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Home Newly Shipped RF PCB Rogers DiClad 527 High Frequency PCB Board

Rogers DiClad 527 High Frequency PCB Board


Rogers Diclad 527 laminates offer a higher proportion of fiberglass reinforcement compared to PTFE content. 




  • Item NO.:

    BIC-221-v272.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


DiClad 527 High Frequency PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Substrate Introduction

Rogers DiClad 527 laminates are composite materials reinforced with woven fiberglass for use as substrates in printed circuit boards. These Diclad 527 PCB laminates offer a higher proportion of fiberglass reinforcement compared to PTFE content. This carefully balanced ratio results in a wider range of dielectric constant (Dk) and improved dimensional stability and registration.

 

Standard Panel Sizes for DiClad 527:

18" x 12" (457 x 305mm)

18" x 24" (457 x 610mm)

 

Standard Thicknesses for DiClad 527:

0.020" (0.508mm) with a tolerance of +/- 0.0020"

0.030" (0.762mm) with a tolerance of +/- 0.0020"

0.060" (1.524mm) with a tolerance of +/- 0.0020"

 

Standard Claddings for DiClad 527:

Electrodeposited Copper Foil

1/2 oz. (18µm)

1 oz. (35µm)

 

For information on other available PCB configurations, such as additional thicknesses, panel sizes, and claddings, please contact our Customer Service or Sales Engineering teams.

 

Key Features:

1. Dk range: 2.40 to 2.60

2. Low dissipation factor: .0018 at 10GHz

3. Low moisture absorption

 

Key Benefits:

1. Stable Dk across a wide frequency range

2. Low circuit losses at high frequencies

3. Minimal performance variation in high humidity environments

4. Excellent dimensional stability

5. Consistent product performance

6. Uniform electrical properties across frequencies

7. Reliable mechanical performance

8. Excellent chemical resistance

 

Our PCB Capability (DiClad 527)

PCB Capability (DiClad 527) 
PCB Material: Woven Fiberglass/PTFE composite
Designation: DiClad 527
Dielectric constant: 2.40-2.60 10GHz/23˚C
Dissipation factor 0.0017 10GHz/23˚C
Layer count: Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc..


DiClad 527 PCB

 

Typical Applications:

1. Radar feed networks

2. Commercial phased array networks

3. Low-loss base station antennas

4. Guidance systems

5. Digital radio antennas

6. Filters, couplers, and LNAs

 

DiClad 527 Data Sheet

Typical Value
Properties DiClad 527 Units Test Conditions Test Method
Electrical Properties
Dielectric Constant 2.40-2.60 - 23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Dielectric Constant 2.40-2.60 - 23˚C @ 50% RH 1 MHz IPC TM-650 2.5.5.3
Dissapation Factor 0.0017   23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Dissapation Factor 0.0010   23˚C @ 50% RH 1 MHz IPC TM-650 2.5.5.3
Thermal Coefficient of Dielectric
Constant
-153 ppm/˚C -10 to 140˚C 10 GHz IPC TM-650 2.5.5.5
Volume Resistivity 1.2 x 109 MΩ-cm C96/35/90 - IPC TM-650 2.5.17.1
Surface Resistivity 4.5 x 107 C96/35/90 - IPC TM-650 2.5.17.1
Dielectric Breakdown >45 kV D48/50 - ASTM D-149
Arc Resistance

>180 - - ASTM D-495
Thermal Properties
Coefficient of Thermal Expansion - x 14 ppm/˚C - 50˚C to 150˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y 21 ppm/˚C - 50˚C to 150˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z 173 ppm/˚C - 50˚C to 150˚C IPC TM-650 2.4.24
Thermal Conductivity
0.26 W/(m.K)     ASTM E1461
Mechanical Properties
Copper Peel Strength 14 Lbs/in 10s @288˚C 35 μm foil IPC TM-650 2.4.8
Young’s Modulus 517, 706 kpsi 23˚C @ 50% RH - ASTM D-638
Tensile Strength (MD, CMD) 19.0, 15.0 kpsi 23˚C @ 50% RH - ASTM D-882
Compressive Modulus 359 kpsi 23˚C @ 50% RH - ASTM D-695
Flex Modulus

537 kpsi 23˚C @ 50% RH   ASTM D-3039
Physical Properties
Flammability V-0     C48/23/50 &
C168/70
UL 94
Moisture Absorption 0.03 % E1/105+D24/23 IPC TM-650 2.6.2.2
Density 231 g/cm³ C24/23/50 Method A ASTM D792
NASA
Outgassing
    Total Mass Lost 0.02 % 125°C, ≤ 10-6 torr NASA SP-R-0022A
    Collected Volatiles 0.00 %
    Water Vapor Recovered 0.01 %


 

 

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