Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
Rogers Diclad 527 laminates offer a higher proportion of fiberglass reinforcement compared to PTFE content.
Item NO.:
BIC-221-v272.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
DiClad 527 High Frequency PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Substrate Introduction
Rogers DiClad 527 laminates are composite materials reinforced with woven fiberglass for use as substrates in printed circuit boards. These Diclad 527 PCB laminates offer a higher proportion of fiberglass reinforcement compared to PTFE content. This carefully balanced ratio results in a wider range of dielectric constant (Dk) and improved dimensional stability and registration.
Standard Panel Sizes for DiClad 527:
18" x 12" (457 x 305mm)
18" x 24" (457 x 610mm)
Standard Thicknesses for DiClad 527:
0.020" (0.508mm) with a tolerance of +/- 0.0020"
0.030" (0.762mm) with a tolerance of +/- 0.0020"
0.060" (1.524mm) with a tolerance of +/- 0.0020"
Standard Claddings for DiClad 527:
Electrodeposited Copper Foil
1/2 oz. (18µm)
1 oz. (35µm)
For information on other available PCB configurations, such as additional thicknesses, panel sizes, and claddings, please contact our Customer Service or Sales Engineering teams.
Key Features:
1. Dk range: 2.40 to 2.60
2. Low dissipation factor: .0018 at 10GHz
3. Low moisture absorption
Key Benefits:
1. Stable Dk across a wide frequency range
2. Low circuit losses at high frequencies
3. Minimal performance variation in high humidity environments
4. Excellent dimensional stability
5. Consistent product performance
6. Uniform electrical properties across frequencies
7. Reliable mechanical performance
8. Excellent chemical resistance
Our PCB Capability (DiClad 527)
| PCB Capability (DiClad 527) | |
| PCB Material: | Woven Fiberglass/PTFE composite |
| Designation: | DiClad 527 |
| Dielectric constant: | 2.40-2.60 10GHz/23˚C |
| Dissipation factor | 0.0017 10GHz/23˚C |
| Layer count: | Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc.. |
Typical Applications:
1. Radar feed networks
2. Commercial phased array networks
3. Low-loss base station antennas
4. Guidance systems
5. Digital radio antennas
6. Filters, couplers, and LNAs
DiClad 527 Data Sheet
| Typical Value | ||||||
| Properties | DiClad 527 | Units | Test Conditions | Test Method | ||
| Electrical Properties | ||||||
| Dielectric Constant | 2.40-2.60 | - | 23˚C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 | |
| Dielectric Constant | 2.40-2.60 | - | 23˚C @ 50% RH | 1 MHz | IPC TM-650 2.5.5.3 | |
| Dissapation Factor | 0.0017 | 23˚C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 | ||
| Dissapation Factor | 0.0010 | 23˚C @ 50% RH | 1 MHz | IPC TM-650 2.5.5.3 | ||
|
Thermal Coefficient of Dielectric Constant |
-153 | ppm/˚C | -10 to 140˚C | 10 GHz | IPC TM-650 2.5.5.5 | |
| Volume Resistivity | 1.2 x 109 | MΩ-cm | C96/35/90 | - | IPC TM-650 2.5.17.1 | |
| Surface Resistivity | 4.5 x 107 | MΩ | C96/35/90 | - | IPC TM-650 2.5.17.1 | |
| Dielectric Breakdown | >45 | kV | D48/50 | - | ASTM D-149 | |
|
Arc Resistance |
>180 | - | - | ASTM D-495 | ||
| Thermal Properties | ||||||
| Coefficient of Thermal Expansion - x | 14 | ppm/˚C | - | 50˚C to 150˚C | IPC TM-650 2.4.41 | |
| Coefficient of Thermal Expansion - y | 21 | ppm/˚C | - | 50˚C to 150˚C | IPC TM-650 2.4.41 | |
| Coefficient of Thermal Expansion - z | 173 | ppm/˚C | - | 50˚C to 150˚C | IPC TM-650 2.4.24 | |
|
Thermal Conductivity |
0.26 | W/(m.K) | ASTM E1461 | |||
| Mechanical Properties | ||||||
| Copper Peel Strength | 14 | Lbs/in | 10s @288˚C | 35 μm foil | IPC TM-650 2.4.8 | |
| Young’s Modulus | 517, 706 | kpsi | 23˚C @ 50% RH | - | ASTM D-638 | |
| Tensile Strength (MD, CMD) | 19.0, 15.0 | kpsi | 23˚C @ 50% RH | - | ASTM D-882 | |
| Compressive Modulus | 359 | kpsi | 23˚C @ 50% RH | - | ASTM D-695 | |
|
Flex Modulus |
537 | kpsi | 23˚C @ 50% RH | ASTM D-3039 | ||
| Physical Properties | ||||||
| Flammability | V-0 |
C48/23/50 & C168/70 |
UL 94 | |||
| Moisture Absorption | 0.03 | % | E1/105+D24/23 | IPC TM-650 2.6.2.2 | ||
| Density | 231 | g/cm³ | C24/23/50 | Method A | ASTM D792 | |
|
NASA Outgassing |
Total Mass Lost | 0.02 | % | 125°C, ≤ 10-6 torr | NASA SP-R-0022A | |
| Collected Volatiles | 0.00 | % | ||||
| Water Vapor Recovered | 0.01 | % | ||||
Previous:
RT/duroid 5880 PCB 62mil Rogers Laminate High-Frequency Circuit BoardNext:
DiClad 527 High Frequency PCB Built on 20mil 0.508mm Substrates with Double Sided Copper and Immersion GoldIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
Categories
New Products
Rigid Polyimide 4-Layer PCB 1.8mm Thick HASL Lead-Free Vias Resin-filled and Capped
Taconic RF-35 PCB 2-layer 10mil 0.254mm Immersion silver High Frequency Board
F4BTME320 PCB 2-layer 1.524mm 60mil Thick Wangling F4BTME Series Immersion Tin
6-layer Hybrid PCB 0.305mm RO4003C + 3.0mm FR-4 Depth-Controlled Slot Multilayer Board
Taconic TRF-45 PCB Double-Sided 32mil 0.813mm Thick ENIG High Frequency Board
TP980 Dielectric PCB 2-Layer 4.0mm Thick DK9.8 High DK ENIG-finish High Frequency Board
TP450 PCB 2-Layer TP-series Laminates 2.5mm Thick Bare Copper
Taconic TLY-5 PCB 2-layer 125mil 3.2mm DK2.2 Laminate 1oz Copper ENIG
© Copyright: 2025 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.
IPv6 network supported