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The uniform dispersion of ceramics throughout the laminate yields an extremely low X and Y thermal expansion coefficient. Low modulus and low X-Y CTE values make RF-35A2 an attractive material for chip carrier in surface mounting technology.
Item NO.:
BIC-168-v132.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaColor:
WhiteShipping Port:
ShenzhenLead Time:
7-10 daysTaconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Taconic’s RF-35A2 substrate is designed to have ultra-low fiberglass content to achieve "best in class" insertion loss properties and the uniform dielectric constant 3.5 +/-0.05 throughout the laminate. It is a type of ultra low loss power amplifier material.
RF-35A2 is manufactured with a proprietary multi-step process with excellent dielectric performance and excellent copper peel adhesion.The low 0.0015 dissipation factor at 10 GHz allows for maximum power transfer resulting in low heat generation.
Benefits:
Low loss properties
DK tolerance of +/- 0.05
Homogeneous DK
Excellent peel strength
Low moisture absorption
Our PCB Capability (RF-35A2):
PCB Capability (RF-35A2) | |
PCB Material: | PTFE Ceramic Fiberglass |
Designation: | RF-35A2 |
Dielectric constant: | 3.15 |
Dissipation Factor | 0.0015 |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm) |
PCB thickness: | 10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
Applications:
Power amplifiers
Filters / couplers
High speed digital
Passive components
Wireless antennas
RF-35A2 Typical Values:
RF-35A2 Typical Values | |||||
Property | Test Method | Unit | Value | Unit | Value |
Dk @ 10 GHz | IPC-650 2.5.5.5.1(Modified) | 3.5 | 3.5 | ||
Df @ 10 GHz | IPC-650 2.5.5.5.1(Modified) | 0.0015 | 0.0015 | ||
Moisture Absorption | IPC-650 2.6.2.1 | % | 0.03 | % | 0.03 |
Dielectric Breakdown | IPC-650 2.5.6/ASTM D 149 | kV | 59 | kV | 59 |
Dielectric Strength | ASTM D 149 | V/mil | 1000 | V/mm | 39,370 |
Volume Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1(Humidity Cond.) | Mohm/cm | 10^9 | Mohm/cm | 10^9 |
Surface Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1(Humidity Cond.) | Mohm | 10^8 | Mohm | 10^8 |
Arc Resistance | IPC-650 2.5.1 | Seconds | 242 | Seconds | 242 |
Flexural Strength(MD) | IPC-650 2.4.4 | kpsi | 24 | N/mm2 | 165 |
Flexural Strength(CD) | IPC-650 2.4.4 | kpsi | 15 | N/mm2 | 103 |
Tensile Strength(MD) | ASTM D 3039 | psi | 16,800 | N/mm2 | 116 |
Tensile Strength(CD) | ASTM D 3039 | psi | 11,000 | N/mm2 | 75.8 |
Young’s Modulus(MD) | ASTM D 3039 | psi | 106 | N/mm2 | 8,343 |
Young’s Modulus(CD) | ASTM D 3039 | psi | 106 | N/mm2 | 7,171 |
Poisson’s Ratio(MD) | ASTM D 3039 | 0.14 | 0.14 | ||
Poisson’s Ratio(CD) | ASTM D 3039 | 0.1 | 0.1 | ||
Strain at Break(MD) | ASTM D 3039 | % | 1.6 | % | 1.6 |
Strain at Break(CD) | ASTM D 3039 | % | 1.4 | % | 1.4 |
Compressive Modulus (Z axis) | ASTM D 695(23°C) | kpsi | 385 | N/mm2 | 2,650 |
Peel Strength(1 oz. VLP) | IPC-650 2.4.8(Thermal Stress) | lbs/in | 12 | N/mm | 2.1 |
Peel Strength(1 oz. VLP) | IPC-650 2.4.8.3 (150°C )(Elevated Temp.) | lbs/in | 14 | N/mm | 2.5 |
Peel Strength(1 oz. VLP) | IPC-650 2.4.8 Sec. 5.2.3(Proc. Chemicals) | lbs/in | 11 | N/mm | 2 |
Density(Specific Gravity) | gm/cm3 | 2.28 | gm/cm3 | 2.28 | |
Specific Heat | ASTM E 1269 (DSC)(100°C) | J/g/K | 0.99 | J/g/K | 0.99 |
Thermal Conductivity | ASTM F 433 | W/M*K | 0.29 | W/M*K | 0.29 |
Td | IPC-650 2.4.24.6 2% Weight Loss | °C | 528 | °C | 528 |
Td | IPC-650 2.4.24.65% Weight Loss | °C | 547 | °C | 547 |
CTE (x) | IPC-650 2.4.41 (>RT - 125°C) | ppm/°C | 10 | ppm/°C | 10 |
CTE (y) | IPC-650 2.4.41(>RT - 125°C) | ppm/°C | 13 | ppm/°C | 13 |
CTE (z) | IPC-650 2.4.41(>RT - 125°C) | ppm/°C | 108 | ppm/°C | 108 |
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