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RO3203 Rogers PCB from Rogers Corporation redefine the boundaries of high-speed connectivity with their exceptional features, benefits, and applications.
Item NO.:
BIC-265-v331.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Rogers RO3203 PCB 30mil 2-layer Immersion Silver High Frequency Circuit Materials
In the dynamic realm of high-speed electronics, the RO3203 High Frequency Circuit Materials stand as a testament to innovation and performance. Engineered with precision and reinforced with woven fiberglass, these ceramic-filled laminates from Rogers Corporation offer unparalleled electrical characteristics and mechanical stability at competitive prices. Let's embark on a comprehensive journey to explore the intricacies, features, benefits, construction details, statistics, and applications of the RO3203 PCB.
1. Introduction to RO3203 High Frequency Circuit Materials PCB
The RO3203 30mil Rogers Materials represent a pinnacle of technological advancement in the domain of high-speed electronics. A part of the esteemed RO3000 Series, these Rogers materials boast enhanced mechanical stability, setting them apart from their counterparts. With a dielectric constant of 3.02 and a dissipation factor of 0.0016 at 10 GHz/23°C, the 30mil RO3203 Rogers substrates extend the operational frequency spectrum beyond 40 GHz, catering to cutting-edge applications that demand superior performance.
2. Features of RO3203PCB
Rogers RO3203 ceramic-filled PTFE composites
Dielectric constant: 3.02+/- 0.04 at 10 GHz/23°C
Dissipation factor: 0.0016 at 10 GHz/23°C
High Thermal Conductivity: 0.87 W/mK
Exceptional Thermal Stability: Td > 500°C
Coefficient of Thermal Expansion:
X-axis: 13 ppm/°C
Y-axis: 13 ppm/°C
Z-axis: 58 ppm/°C
Lead-free Process Compatible with 94V-0 flammability rating
3. Key Benefits of RO3203 PCB
Woven Glass Reinforcement: Enhances rigidity for improved handling
Uniform Electrical and Mechanical Performance: Ideal for complex multi-layer high-frequency structures
Low Dielectric Loss: Enables high-frequency applications exceeding 20 GHz
Low In-plane Expansion Coefficient: Matches copper for hybrid designs and reliable surface-mounted assemblies
Excellent Dimensional Stability: Ensures high production yields
Cost-Effective Volume Manufacturing: Economically priced for mass production
Surface Smoothness: Facilitates precise line etching tolerances
4. PCB Stackup and Construction Details
Stackup: 2-layer rigid PCB
Copper Layer 1: 35μm
RO3203 Substrate: 30mil (0.762mm)
Copper Layer 2: 35μm
PCB Construction Details |
Value |
Board dimensions |
30mm x 60mm = 1PCS |
Minimum Trace/Space |
4/7 mils |
Minimum Hole Size |
0.55mm |
Blind Vias |
No |
Finished board thickness |
0.8mm |
Finished Cu weight |
1 oz (1.4 mils) outer layers |
Via plating thickness |
20 μm |
Surface finish |
Immersion Silver |
Top Silkscreen |
No |
Bottom Silkscreen |
No |
Top Solder Mask |
No |
Bottom Solder Mask |
No |
Electrical test |
100% prior to shipment |
5. PCB Statistics
PCB Statistics |
Value |
Components |
12 |
Total Pads |
27 |
Thru Hole Pads |
18 |
Top SMT Pads |
9 |
Bottom SMT Pads |
0 |
Vias |
27 |
Nets |
2 |
6. Quality Assurance and Global Accessibility
Type of Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
7. Typical Applications
The versatility and performance of RO3203 High Frequency Circuit boards make them suitable for a wide range of applications, including:
Automotive collision avoidance systems
Automotive GPS antennas
Wireless telecommunications systems
Microstrip patch antennas for wireless communications
Direct broadcast satellites
Cable system data links
Remote meter readers
Power backplanes
LMDS and wireless broadband
Base station infrastructure
In conclusion, the RO3203 Rogers PCB from Rogers Corporation redefine the boundaries of high-speed connectivity with their exceptional features, benefits, and applications. Designed to meet the demands of modern electronics, these materials empower engineers and manufacturers to push the limits of innovation and deliver cutting-edge solutions in a cost-effective and reliable manner.
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Rogers RO3035 PCB 20mil Laminate 2-layer High Frequency Circuit BoardNext:
Rogers RO4003C PCB 4-layer 0.7mm Thick RO4450F Bondply Multilayer ENIG High Frequency LaminatesIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
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