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Rogers RO4725JXR antenna grade laminates offer a dependable and cost-effective substitute for traditional PTFE-based laminates.
Item NO.:
BIC-215-v235.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Rogers RO4725JXR Antenna Grade High Frequency Printed Circuit Board DK2.55 RF PCB 30.7mil 60.7mil
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers RO4725JXR antenna grade laminates offer a dependable and cost-effective substitute for traditional PTFE-based laminates.
The resin systems used in RO4725JXR dielectric materials offer the essential properties required for optimal antenna performance. RO4725JXR antenna grade laminates are fully compatible with conventional FR-4 and high-temperature lead-free solder processes. Unlike traditional PTFE-based laminates, these materials do not require special treatment for plated through-hole preparation. By choosing RO4725JXR laminates, designers can achieve cost-effective solutions without compromising performance.
Features:
1.Dielectric constant of 2.55+/- 0.05
2.Low Z-axis coefficient of thermal expansion at 25.6 ppm/°C
3.Low TCDk (Thermal Coefficient of Dielectric Constant) of +34 ppm/°C
4.Dissipation factors ranging from .0022 to .0026
5.High glass transition temperature (Tg) exceeding 280°C
Benefits:
1. Low insertion loss, ensuring minimal signal loss during transmission
2. Dk (Dielectric Constant) matched to standard PTFE-based antenna offerings, facilitating seamless integration with existing designs
3. Reduced passive inter-modulation (PIM), leading to improved signal quality and less interference
4. Consistent circuit performance, providing reliable and predictable results.
Our PCB Capability( RO4725JXR)
PCB Capability (RO4725JXR) | |
PCB material: | Hydrocarbon / Ceramic / Woven Glass |
Designation: | RO4725JXR |
Dielectric constant: | 2.55 |
Layer count: | Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB |
Dielectric thickness: | 30.7mil(0.780mm), 60.7mil (1.542mm) |
Copper weight: | 1oz (35µm), 2oz (70µm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Red, Yellow, White etc. |
Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG, Pure gold etc.. |
Typical Applications
Cellular Base Station Antennas
RO4725JXR Typical Properties
Property | RO4725JXR | Direction | Units | Condition | Test Method |
Dielectric Constant, εr Process | 2.55 ± 0.05 | Z | 10 GHz/23°C | IPC-TM-650, 2.5.5.5 | |
Dielectric Constant, εr Design | 2.64 | Z |
1.7 GHz - 5 GHz |
Differential Phase Length Method | |
Dissipation Factor | 0.0026 | Z | 10 GHz/23°C | IPC-TM-650, 2.5.5.5 | |
0.0022 | 2.5GHz | ||||
Thermal Coefficient of εr | +34 | Z | ppm/°C | -50°C to 150°C | IPC-TM-650, 2.5.5.5 |
Volume Resistivity (0.030") | 2.16 X 10^8 | MΩ•cm | COND A | IPC-TM-650, 2.5.17.1 | |
Surface Resistivity (0.030") | 4.8 X 10^7 | MΩ | COND A | IPC-TM-650, 2.5.17.1 | |
PIM | -166 | dBc |
50 ohm 0.060” |
43dBm 1900MHz |
|
Electrical Strength (0.030”) | 630 | Z | V/mil | IPC-TM-650, 2.5.6.2 | |
Flexural Strength MD | 121 (17.5) |
MPa (kpsi) |
RT | ASTM D790 | |
CMD | 92 (13.3) | ||||
Dimensional Stability | <0.4 | X,Y | mm/m |
after etch +E2/150°C |
IPC-TM-650, 2.4.39A |
Coefficient of Thermal Expansion |
13.9 | X | ppm/°C | -55 TO 288°C | IPC-TM-650, 2.1.24 |
19.0 | Y | ||||
25.6 | Z | ||||
Thermal Conductivity | 0.38 | Z | W/mK° | 50°C | ASTM D5470 |
Moisture Absorption | 0.24% | % | 48/50 | IPC-TM-650 2.6.2.1 ASTM D570 | |
Tg | >280 | °C | IPC-TM-650 2.4.24 | ||
Td | 439 | °C | ASTM D3850 | ||
Density | 1.27 | gm/cm3 | ASTM D792 | ||
Copper Peel Strength | 8.5 | pli | 1 oz LoPro EDC | IPC-TM-650 2.4.8 | |
Flammability | N/A | UL94 | |||
Lead-Free Process Compatible | YES |
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RO4725JXR Antenna PCB Built on 30.7mil 0.78mm Substrates with Double Layer Copper and Immersion GoldsIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
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