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Home Newly Shipped RF PCB Rogers RO4725JXR Antenna Grade High Frequency Printed Circuit Board DK 2.55 RF PCB 30.7mil 60.7mil

Rogers RO4725JXR Antenna Grade High Frequency Printed Circuit Board DK 2.55 RF PCB 30.7mil 60.7mil


Rogers RO4725JXR antenna grade laminates offer a dependable and cost-effective substitute for traditional PTFE-based laminates.






  • Item NO.:

    BIC-215-v235.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Rogers RO4725JXR Antenna Grade High Frequency Printed Circuit Board DK2.55 RF PCB 30.7mil 60.7mil

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers RO4725JXR antenna grade laminates offer a dependable and cost-effective substitute for traditional PTFE-based laminates.

 

The resin systems used in RO4725JXR dielectric materials offer the essential properties required for optimal antenna performance. RO4725JXR antenna grade laminates are fully compatible with conventional FR-4 and high-temperature lead-free solder processes. Unlike traditional PTFE-based laminates, these materials do not require special treatment for plated through-hole preparation. By choosing RO4725JXR laminates, designers can achieve cost-effective solutions without compromising performance.

 

Features:

1.Dielectric constant of 2.55+/- 0.05

2.Low Z-axis coefficient of thermal expansion at 25.6 ppm/°C

3.Low TCDk (Thermal Coefficient of Dielectric Constant) of +34 ppm/°C

4.Dissipation factors ranging from .0022 to .0026

5.High glass transition temperature (Tg) exceeding 280°C

 

Benefits:

1. Low insertion loss, ensuring minimal signal loss during transmission

2. Dk (Dielectric Constant) matched to standard PTFE-based antenna  offerings, facilitating seamless integration with existing designs

3. Reduced passive inter-modulation (PIM), leading to improved signal quality and less interference

4. Consistent circuit performance, providing reliable and predictable results.

 

Our PCB Capability( RO4725JXR)

PCB Capability (RO4725JXR) 
PCB material: Hydrocarbon / Ceramic / Woven Glass
Designation: RO4725JXR
Dielectric constant: 2.55
Layer count: Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB
Dielectric thickness: 30.7mil(0.780mm), 60.7mil (1.542mm)
Copper weight: 1oz (35µm), 2oz (70µm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Red, Yellow, White etc.
Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG, Pure gold etc..

 

Typical Applications

Cellular Base Station Antennas

 

Rogers RO4725JXR Antenna PCB

 

RO4725JXR Typical Properties

Property RO4725JXR Direction Units Condition Test Method
Dielectric Constant, εr Process 2.55 ± 0.05 Z 10 GHz/23°C IPC-TM-650, 2.5.5.5
Dielectric Constant, εr Design 2.64 Z 1.7 GHz - 5
GHz
Differential Phase Length Method
Dissipation Factor 0.0026 Z 10 GHz/23°C IPC-TM-650, 2.5.5.5
0.0022 2.5GHz
Thermal Coefficient of εr +34 Z ppm/°C -50°C to 150°C IPC-TM-650, 2.5.5.5
Volume Resistivity (0.030") 2.16 X 10^8 MΩ•cm COND A IPC-TM-650, 2.5.17.1
Surface Resistivity (0.030") 4.8 X 10^7 MΩ COND A IPC-TM-650, 2.5.17.1
PIM -166 dBc 50 ohm
0.060”
43dBm
1900MHz
Electrical Strength (0.030”) 630 Z V/mil IPC-TM-650, 2.5.6.2
Flexural Strength            MD 121 (17.5) MPa
(kpsi)
RT ASTM D790
                                                      CMD 92 (13.3)
Dimensional Stability <0.4 X,Y mm/m after etch
+E2/150°C
IPC-TM-650, 2.4.39A
Coefficient of Thermal
Expansion
13.9 X ppm/°C -55 TO 288°C IPC-TM-650, 2.1.24
19.0 Y
25.6 Z
Thermal Conductivity 0.38 Z W/mK° 50°C ASTM D5470
Moisture Absorption 0.24% % 48/50 IPC-TM-650 2.6.2.1 ASTM D570
Tg >280 °C IPC-TM-650 2.4.24
Td 439 °C ASTM D3850
Density 1.27 gm/cm3 ASTM D792
Copper Peel Strength 8.5 pli 1 oz LoPro EDC IPC-TM-650 2.4.8
Flammability N/A UL94
Lead-Free Process Compatible YES








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