Rogers RO4835 PCB 10mil 0.254mm 2-layer ENEPIG No Solder Mask Black Silkscreen

Rogers RO4835 PCB 10mil 0.254mm 2-layer ENEPIG No Solder Mask Black Silkscreen

This high-performance 2-layer rigid printed circuit board is engineered on Rogers RO4835 high-frequency laminate, manufactured to IPC Class‑2 standards and optimized for RF, microwave, and automotive radar applications. Combining low electrical loss, exceptional thermal stability, and precision mechanical features, this Rogers PCB delivers reliable signal integrity and manufacturability for volume production. With a compact form factor, fine-trace capability, andENEPIG surface finish, it supports high-frequency functionality while complying with global industry and environmental standards. Every board undergoes full electrical testing to ensure consistent performance in demanding operating environments.

PCB Construction Details

This section summarizes the core structural, material, and surface finishing specifications that define the board’s physical and functional build.

PCB Stackup

The following stackup defines the layer structure and dielectric thickness of this2-layer high-frequency PCB.

PCB Statistics

This table lists the component, pad, via, and net quantities to clarify circuit density and layout complexity.

Design & Manufacturing Specifications

• Artwork Format: Gerber RS‑274‑X
• Accepted Standard: IPC‑Class‑2
• Compliance: RoHS‑compliant, UL 94 V‑0, IPC‑4103
• Service & Shipping: Worldwide delivery available

Rogers RO4835 Material Overview

• Rogers RO4835 is a high-performance hydrocarbon ceramic laminate designed for cost-sensitive high-frequency applications. It provides improved thermal stability and oxidation resistance compared to conventional hydrocarbon substrates, with electrical and mechanical properties comparable toRO4350B. The material is fully compatible with standard FR‑4 fabrication processes, enabling cost-effective mass production without sacrificing high-frequency performance. When paired with Rogers’LoPro reverse-treated copper foil, RO4835 achieves low insertion loss, making it ideal for RF and microwave designs.

Key Electrical & Thermal Features 

• Dielectric Constant (Dk): 3.48±0.05
• Dissipation Factor (Df): 0.0037 at 10 GHz
• Glass Transition Temperature (Tg): >280°C (TMA)
• Coefficient of Thermal Expansion (CTE):
• X‑axis: 10 ppm/°C
• Y‑axis: 12 ppm/°C
• Z‑axis: 31 ppm/°C

Performance Benefits

RO4835 Rogers material PCB offers multiple advantages for high-reliability and high-frequency circuits:

1)Superior oxidation resistance compared to standard thermoset microwave materials

2)Optimized for performance-sensitive, high-volume manufacturing

3)Low-loss properties for stable operation at elevated frequencies

4)Tight dielectric tolerance for precise controlled-impedance transmission lines

5)Compatible with lead-free assembly processes, resisting blistering and delamination

6)Low Z‑axis thermal expansion for robust, reliable plated through‑holes

7)Low in‑plane CTE ensures dimensional stability across all processing temperatures

Typical Applications

This RO4835 2-layer ENEPIG PCB is widely used in: 

• Automotive radar and ADAS sensors
• Point-to-point microwave communication systems
• RF power amplifiers
• Phased-array radar systems
• High-frequency RF components and modules

Conclusion

By combining Rogers’ industry-leading high-frequency substrate, precision 2-layer construction, and ENEPIG surface finish, this RO4835 high frequency PCB achieves an ideal balance of electrical performance, mechanical reliability, and production economics. It is suitable for prototypes and volume production alike, supporting global customers in automotive, aerospace, wireless infrastructure, and industrial RF markets.