Rogers RO4730G3 PCB 20mil 0.508mm Antenna-grade Laminate 2-layer 35um Copper ENEPIG

Rogers RO4730G3 PCB 20mil 0.508mm Antenna-grade Laminate 2-layer 35um Copper ENEPIG

Product Overview

The RO4730G3 20mil ENEPIG PCB is a 2-layer rigid printed circuit board built on Rogers RO4730G3 antenna-grade laminate, featuring an ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) surface finish for superior conductivity and corrosion resistance. With a finished board thickness of 0.6mm and 1oz outer copper weight, this Rogers PCB is optimized for high-frequency performance, boasting low dielectric loss, stable electrical properties across temperature variations, and seamless compatibility with lead-free soldering and conventional FR-4 processing.

PCB Construction Details

The following table summarizes the key construction parameters of the RO4730G3 PCB, outlining material specifications, dimensional tolerances, and manufacturing details that define its performance and usability.

PCB Stackup

The stackup of this 2-layer rigid PCB is designed to maximize electrical performance, with precise layer thicknesses that ensure stable signal transmission and compatibility with the RO4730G3 laminate’s properties. The following table details the stackup structure:

PCB Statistics

The following table provides key statistical data about the Rogers RO4730G3 PCB’s component layout, pad configuration, and connectivity, offering insights into its design complexity and application suitability:

RO4730G3 Laminate Introduction

The foundation of this PCB is Rogers RO4730G3, a high-performance antenna-grade laminate composed of hydrocarbon, ceramic, and woven glass, with a UL 94 V-0 flammability rating. It serves as a reliable, low-cost alternative to traditional PTFE-based laminates, addressing the cost-performance balance that designers often struggle to achieve. The resin system of

RO4730G3 is specifically formulated to deliver ideal antenna performance, with stable dielectric properties across a wide frequency range. Unlike PTFE-based materials, RO4730G3 does not require special treatment for plated through-hole (PTH) preparation, simplifying manufacturing and reducing production costs. It is fully compatible with conventional FR-4 processing and high-temperature lead-free soldering, making it easy to integrate into existing assembly lines.

Key Electrical & Mechanical Features

The 20mil RO4730G3 PCB boasts exceptional electrical and mechanical properties that make it suitable for high-frequency, high-reliability applications.

At 10GHz, it features a dielectric constant (Dk) of 3.0 +/- 0.05 and a dissipation factor of 0.0028—critical for minimizing signal loss and ensuring consistent performance. Its thermal coefficient of Dk (TCDk) is 34 ppm/°C, ensuring stable electrical performance even as operating temperatures fluctuate.

Mechanically, the laminate’s coefficient of thermal expansion (CTE) is matched to copper, reducing thermal stress and preventing warpage during soldering and operation.

With a glass transition temperature (Tg) exceeding 280°C and a decomposition temperature (Td) of 411°C (per TGA), it offers exceptional thermal stability. The CTE values for the x, y, and z axes are 15.9 ppm/°C, 14.4 ppm/°C, and 35.2 ppm/°C, respectively, while its thermal conductivity is 0.45 W/mk, supporting efficient heat dissipation.

Core Benefits

This RO4730G3 high frequency PCB delivers numerous benefits that set it apart from conventional alternatives.

1)Its low-loss dielectric combined with low-profile foil reduces passive intermodulation (PIM) and insertion loss, ensuring clear signal transmission in high-frequency applications.

2)The unique filler and closed microspheres in the RO4730G3 laminate result in low density, making the PCB 30% lighter than PTFE/glass alternatives—ideal for weight-sensitive applications.

3)With a Z-axis CTE of less than 30 ppm/°C and a high Tg of over 280°C, it offers design flexibility and compatibility with automated assembly processes.

4)The low TCDk (less than 40 ppm/°C) ensures consistent circuit performance across temperature variations, while the specially formulated thermoset resin system enables easy fabrication and reliable PTH processing.

5)Additionally, the PCB is environmentally friendly, complying with RoHS standards and compatible with lead-free manufacturing processes.

Artwork, Quality & Availability

We accept artwork in Gerber RS-274-X format, the industry standard for PCB manufacturing, ensuring seamless file compatibility and accurate reproduction of design specifications. The PCB adheres to IPC-Class-2 quality standards, guaranteeing high reliability and consistency for general electronic applications. Furthermore, this product is available worldwide, ensuring timely delivery and support for global customers.

Typical Applications

The RO4730G3 20mil 2-layer PCB is specifically engineered for cellular base station antennas, where its low loss, stable electrical properties, and lightweight design make it an ideal choice.

Its performance characteristics also make it suitable for other high-frequency applications that require cost-effectiveness without compromising on reliability, such as wireless communication devices and radar systems.

In summary, the RO4730G3 ENEPIG PCB is a high-performance, cost-optimized solution that combines premium materials, precise manufacturing, and exceptional reliability. It addresses the unique needs of high-frequency antenna applications, offering a balance of performance, usability, and affordability that is unmatched by conventional PCB solutions.