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Home Rogers PCB Board Rogers RT/Duroid 6002 High Frequency PCB with 10mil 20mil 30mil 60mil Coating Immersion Gold Immersion Silver

Rogers RT/Duroid 6002 High Frequency PCB with 10mil 20mil 30mil 60mil Coating Immersion Gold Immersion Silver


The dielectric constant of RT/duroid 6002 has excellent resistance to temperature change between -55℃and 150℃, which can meet the requirements of filter, oscillator and delay line application design for its electrical stability.


  • Item NO.:

    BIC-096-v175.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Rogers RT/Duroid 6002 High Frequency PCB with 10mil, 20mil, 30mil and 60mil Coating Immersion Gold and Immersion Silver.

(PCB's are custom-made products, the picture and parameters shown are just for reference)


There is a type PCB about the high frequency PCB made on RT/duroid 6002 material PCB.



The RT/ duroid 6002 microwave material is a kind of low loss and low dielectric constant laminate, which can meet the strict requirements for mechanical reliability and electrical stability in complex microwave structural design. The main components are PTFE ceramics composites.


When it comes to high-frequency circuit materials, the RT/duroid 6002 high-frequency circuit material has many benefits. Its high dielectric constant and thermal expansion coefficient are perfect for applications requiring rapid and high-temperature changes, such as microwave devices. It is also compatible with FR-4 based printed Circuit Board.


The main advantages

1.low loss ensures excellent high Frequency performance

2.excellent mechanical and electrical properties, reliable multi-layer board construction.

3.extremely low thermal coefficient of dielectric constant,ensure excellent dimensional stability.

4.in-plane expansion coefficient matched to copper, allows for more reliable surface mounted assemblies。

5.low outgassing, ideal for space applications


Benefits of RT duroid 6002 PCB


Typical applications

1.Phased Array Antennas

2.Round Based and Airborne Radar Systems

3.GPS antennas

4.Power Backplanes

5.Commercial Airline Collision Avoidance


Applicaitons of RT duroid 6002


Our PCB Capability (RT/duroid 6002)

PCB Material:

Ceramic-filled PTFE composite

Designation:

RT/duroid 6002

Dielectric constant:

2.94 ±0.04 (process)

2.94 (design)

Layer count:

2 Layer, Multilayer

Copper weight:

0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

PCB thickness:

10mil (0.254mm), 20mil (0.508mm)

30mil (0.762mm), 60mil (1.524mm), 120mil (3.048mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, Immserion Silver, OSP etc..


The base copper of RT/druoid 6002 PCB has 0.5oz, 1oz and 2oz; the thickness of PCB board is wide, ranging from 5mil to 120mil to be considered by our designers.


RT/druoid 6002 PCB Board


The basic colour of RT/duroid 6002 PCB is white.


RT/duroid 6002 PCB is very suited to the equipment of flat and non-planar structures, such as antennas, complex multi-layer circuits with inner-layer connections, and microwave circuits for aerospace designs in hostile environments.


Appendix: Data Sheet of RT/duroid 6002

RT/duroid 6002 Typical Value
Property RT/duroid 6002 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.94±0.04 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 
Dielectric Constant,εDesign 2.94 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0012 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +12 Z ppm/℃ 10 GHz 0℃-100℃ IPC-TM-650 2.5.5.5
Volume Resistivity 106 Z Mohm.cm A ASTM D 257
Surface Resistivity 107 Z Mohm A ASTM D 257
Tensile Modulus 828(120) X,Y MPa(kpsi) 23℃ ASTM D 638
Ultimate Stress 6.9(1.0) X,Y MPa(kpsi)
Ultimate Strain 7.3 X,Y %
Compressive Modulus 2482(360) Z MPa(kpsi) ASTM D 638
Moisture Absorption 0.02 % D48/50 IPC-TM-650 2.6.2.1
ASTM D 570
Thermal Conductivity 0.6 W/m/k 80℃ ASTM C518
Coefficient of Thermal Expansion
(-55 to 288℃)
16
16
24
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.41
Td 500 ℃TGA ASTM D 3850
Density 2.1 gm/cm3 ASTM D 792
Specific Heat 0.93(0.22) j/g/k
(BTU/ib/OF)
Calculated
Copper Peel 8.9(1.6) Ibs/in.(N/mm) IPC-TM-650 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes



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