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Home Rogers PCB Board Rogers 3010 Substrate High Frequency PCB With 5mil 10mil 25mil 50mil Coating Immersion Silver Gold Tin HASL

Rogers 3010 Substrate High Frequency PCB With 5mil 10mil 25mil 50mil Coating Immersion Silver Gold Tin HASL

Our RO3010 is made from high-quality materials. Its material’s characteristics allow our RO3010 for excellent circuit miniaturization.



  • Item NO.:

    BIC-097-v174.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Rogers 3010 PCB RO3010 High Frequency PCB With 5mil, 10mil, 25mil and 50mil Coating Immersion Silver, Gold, Tin and HASL

(PCB's are custom-made products, the picture and parameters shown are just for reference)


There is about RO3010 high frequency PCBs.


RO3010 high frequency circuit laminates are ceramic-filled PTFE composites intended for using in commercial microwave and RF applications. Its obvious characteristic is that the electrical performance is exceptional and the mechanical property is stable and consistent. Rogers RO3010 advanced circuit materials are ceramic-filled PTFE composites that offer a higher dielectric constant with excellent stability.

RO3010 laminates are competitively priced products with exceptional mechanical and electrical stability. This stability simplfes the design of broadband components and allows the materials to be used in a wide range of applications over a very broad range of frequencies. This material’s characteristics make RO3010 laminates excellent for circuit miniaturization.


RO3010 25mil PCB Direct Broadcast satellites


More features and applications are as follows:

1, Excellent mechanical properties versus temperature, it’s reliable stripline and multi-layer board constructions.

2, Uniform mechanical properties, it’s suitable for use with epoxy glass multi-layer board hybrid designs.

3, Low in-plane expansion coefficient matches to copper, it allows for more reliable surface mounted assemblies; ideal for applications sensitive to temperature change and exhibit excellent dimensional stability.


features RO3010


OurPCB Capability (RO3010)

PCB Material:

Ceramic-filled PTFE composite

Designation:

RO3010

Dielectric constant:

10. 2 ±0.3 (process)

11.2 (design)

Layer count:

2 Layer, Multilayer, Hybrid PCB

Copper weight:

0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

PCB thickness:

5mil (0.127mm), 10mil (0.254mm),

25mil (0.635mm), 50mil (1.27mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, OSP etc..




Double sided RO3010 high frequency PCBs are also available with multi-layer and hybrid construction, 0.5oz to 2oz finished copper, 0.13 mm to 1.3mm thick, maximum size 400 mm by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.


Applications RO3010


Typical applications

1. Automotive radar applications

2. GPS Antennas

3. Power amplifiers and antennas

4. Patch antennas for wireless communications

5. Direct broadcast satellite


RO3010 PCB


The basic colour of RO3010 PCB is white.


The manufacturing process of RO3010 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market.


Appendix: Data Sheet of RO3010

RO3010 Typical Value
Property RO3010 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.05 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 11.2 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0022 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -395 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.35
0.31
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105 MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105 COND A IPC 2.5.17.1
Tensile Modulus 1902
1934
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.05 % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.8 j/g/k Calculated
Thermal Conductivity 0.95 W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
13
11
16
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500 ℃TGA ASTM D 3850
Density 2.8 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 9.4 Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes


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