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Home Rogers PCB Board Rogers 3203 RO3203 High Frequency PCB Double Sided RF Circuit Board For Base Station Infrastructure

Rogers 3203 RO3203 High Frequency PCB Double Sided RF Circuit Board For Base Station Infrastructure

Rogers RO3203 are ceramic-filled laminates that provide improved and superior mechanical properties. 

  • Item NO.:

    BIC-124-v177.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Rogers 3203 PCB RO3203 High Frequency PCB Double Sided RF Circuit Board For Base Station Infrastructure

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


RO3203 High Frequency Circuit Materials of Rogers Corporation are ceramic-filled laminates reinforced with woven fiberglass. This material is engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The dielectric constant of RO3203 High Frequency Circuit Materials is 3.02. This, along with a dissipation factor of 0.0016, extends the useful frequency range beyond 40 GHz.


RO3203 60mil PCB


This ceramic-filled circuit material is ISO 9002 certified, so it is a reliable material that meets designers’ needs and specifications. This laminate was specifically designed to offer a wide frequency range. This Rogers PCB material comes with several features and benefits.


These laminates are produced with the use of PTFE substrates and reinforced with woven glass. Ro3203 is an improved version of RO3003 laminates designed to offer better mechanical properties. As a result of this, it has similar electrical and mechanical features to RO3003.



Rogers RO3203 offers a lot of benefits that make them exceptional in the RO3000 series. These laminates provide benefits such as:

  • Smooth copper surface that enables finer line etching tolerances
  • Excellent rigidity that makes it very easy to handle
  • Low in-plane expansion that matches with copper
  • A wide range of dielectric constant
  • Uniform mechanical and electrical properties
  • Exceptional dimensional stability
  • Cost-effective


PCB Capability (RO3203)


PCB Capability (RO3203) 
PCB Material: Ceramic-filled Laminates Reinforced with Woven Fiberglass
Designation: RO3203
Dielectric constant: 3.02±0.04
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

Data Sheet of RO3203

RO3203 Typical Value
Property RO3203 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.02±0.04 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Dissipation Factor,tanδ 0.0016 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Conductivity 0.47 (3.2) W/mK Float 100℃ ASTM C518
Volume Resistivity 107 MΩ.cm A ASTM D257
Surface Resistivity 107 A ASTM D257
Dimensional Stability 0.08 X, Y mm/m +E2/150 after etch IPC-TM-650  2.4.3.9
Tensile Modulus X                 Y kpsi RT ASTM D638
Flexural Modulus 400                 300 X                 Y kpsi A ASTM D790
Tensile Strength 12.5                   13 X                 Y kpsi RT ASTM D638
Flexural Strength 9                            8 X                 Y kpsi A ASTM D790
Moisure Absorption <0.1 % D24/23 IPC-TM-650 2.6.2.1
Coefficient of Thermal Expansion
58                     13 Z                            X,Y                  ppm/℃ -50℃to 288℃ ASTM D3386
Td 500 TGA ASTM D3850
Density 2.1 gm/cm3 23℃ ASTM D792
Copper Peel Stength 10 (1.74) lbs/in (N/mm) After solder IPC-TM-650 2.4.8
Flammability V-0 UL 94
Lead-Free Process Compatible Yes


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