Rogers
3203 PCB RO3203 High Frequency PCB Double Sided RF Circuit Board For Base
Station Infrastructure
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
RO3203
High Frequency Circuit Materials of Rogers Corporation are ceramic-filled
laminates reinforced with woven fiberglass. This material is engineered to
offer exceptional electrical performance and mechanical stability at
competitive prices. The dielectric constant of RO3203 High Frequency Circuit
Materials is 3.02. This, along with a dissipation factor of 0.0016, extends the
useful frequency range beyond 40 GHz.
This
ceramic-filled circuit material is ISO 9002 certified, so it is a reliable
material that meets designers’ needs and specifications. This laminate was
specifically designed to offer a wide frequency range. This Rogers PCB material comes with several features and benefits.
These
laminates are produced with the use of PTFE substrates and reinforced with
woven glass. Ro3203 is an improved version of RO3003 laminates designed to
offer better mechanical properties. As a result of this, it has similar
electrical and mechanical features to RO3003.
Rogers
RO3203 offers a lot of benefits that make them exceptional in the RO3000
series. These laminates provide benefits such as:
-
Smooth copper surface
that enables finer line etching tolerances
-
Excellent rigidity that
makes it very easy to handle
-
Low in-plane expansion
that matches with copper
-
A wide range of
dielectric constant
-
Uniform mechanical and
electrical properties
-
Exceptional dimensional
stability
-
Cost-effective
PCB
Capability (RO3203)
|
PCB Capability (RO3203)
|
|
PCB Material:
|
Ceramic-filled Laminates Reinforced
with Woven Fiberglass
|
|
Designation:
|
RO3203
|
|
Dielectric constant:
|
3.02±0.04
|
|
Layer count:
|
Double Layer, Multilayer, Hybrid PCB
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|
Copper
weight:
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0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
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PCB thickness:
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10mil
(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
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PCB size:
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≤400mm X 500mm
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Solder mask:
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Green, Black, Blue,
Yellow, Red etc.
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|
Surface
finish:
|
Bare copper, HASL,
ENIG, OSP etc..
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Data
Sheet of RO3203
|
RO3203
Typical Value
|
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Property
|
RO3203
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Direction
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Units
|
Condition
|
Test Method
|
|
Dielectric Constant,εProcess
|
3.02±0.04
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650
2.5.5.5
|
|
Dissipation Factor,tanδ
|
0.0016
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650 2.5.5.5
|
|
Thermal
Conductivity
|
0.47 (3.2)
|
|
W/mK
|
Float
100℃
|
ASTM C518
|
|
Volume Resistivity
|
107
|
|
MΩ.cm
|
A
|
ASTM D257
|
|
Surface Resistivity
|
107
|
|
MΩ
|
A
|
ASTM D257
|
|
Dimensional Stability
|
0.08
|
X, Y
|
mm/m
+E2/150
|
after etch
|
IPC-TM-650 2.4.3.9
|
|
Tensile Modulus
|
|
X Y
|
kpsi
|
RT
|
ASTM D638
|
|
Flexural Modulus
|
400 300
|
X Y
|
kpsi
|
A
|
ASTM D790
|
|
Tensile Strength
|
12.5 13
|
X Y
|
kpsi
|
RT
|
ASTM D638
|
|
Flexural Strength
|
9 8
|
X Y
|
kpsi
|
A
|
ASTM D790
|
|
Moisure Absorption
|
<0.1
|
|
%
|
D24/23
|
IPC-TM-650 2.6.2.1
|
Coefficient of Thermal Expansion
|
58 13
|
Z X,Y
|
ppm/℃
|
-50℃to
288℃
|
ASTM D3386
|
|
Td
|
500
|
|
℃
|
TGA
|
ASTM D3850
|
|
Density
|
2.1
|
|
gm/cm3
|
23℃
|
ASTM D792
|
|
Copper Peel Stength
|
10 (1.74)
|
|
lbs/in (N/mm)
|
After solder
|
IPC-TM-650 2.4.8
|
|
Flammability
|
V-0
|
|
|
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UL 94
|
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Lead-Free Process Compatible
|
Yes
|
|
|
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