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Home Rogers PCB Board Rogers RT/duroid 6035 High Frequency PCB Built on 10mil Core With Immersion Gold for Filters

Rogers RT/duroid 6035 High Frequency PCB Built on 10mil Core With Immersion Gold for Filters

The RT/ duroid 6035HTC material has much higher thermal conductivity than FR-4 and even some low loss high frequency compression materials.

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Rogers RT/duroid 6035 High Frequency PCB Built on 10mil Core With Immersion Gold for Filters

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

The RT/ duroid 6035HTC material consists of a ceramic-filled PTFE composite dielectric and a standard or reverse-treated electrolytic (ED) copper foil. Because of its high thermal conductivity, the material is widely used in microwave amplifiers with hundreds of watts of power for efficient thermal management. It has a relative dielectric constant of 3.50 at 10GH on the Z-axis, and its tolerance across the board remains within +005, thus keeping the impedance of the energy transfer line consistent. The CTE of the x and y axes is 19ppm/C, which is close to matching the CTE of copper.

Duroid 6035HTC laminates are ceramic filled teflon components for high frequency circuits with high thermal conductivity and are designed for high power RF and microwave applications. Duroid 6000 laminates also offer superior electronic performance for a wide range of high reliability, aerospace applications.

Of course, correct thermal management in circuit design is not simply a matter of choosing the circuit laminate with the best thermal dependency. There are many other factors that affect the temperature of a circuit operating at a given power level and frequency. For example, the circuit material is characterized by the excitation factor, which is the loss caused by the dielectric material. There are also losses through a conductive transfer line (such as making a strip or ribbon circuit), and the higher the insertion loss, the more heat the transmission line generates at a higher power level. The roughness of the hinge conductor on a PCB can lead to increased insertion loss, especially at higher frequencies.

In addition, the choice of the dielectric constant of the PCB material will determine the size and density of the microwave/DRAMA circuit board, since the size of the microwave transmission line structure depends on the wavelength of the signal to be processed. When the relative permittivity is large, the size of the transmission line required to achieve a given impedance will be smaller, and the power handling capability of the PCB will be limited by the width and loss of the wire and the ground plane spacing. For example, for an amplifier circuit, choosing a PCB material with a small relative dielectric constant can make the line wider for a given impedance, thus improving the heat flow. The use of PCB materials with larger relative permittivity will lead to smaller size of transfer lines and more closely spaced circuits, so hot spots may be formed in high-power circuits. In addition, the selection of materials with low dissipation factor helps to minimize the insertion loss of the transmission line and optimize the gain of the amplifier circuit.

Rogers 6035HTC 10mil PCB


1.High Thermal conductivity

Improved dielectric heat dissipation enables lower operating temperatures for high power applications

2.Low loss tangent

Excellent high frequency performance

3.Thermally stable low profile and reverse treat copper foil

Lower insertion loss and excellent thermal stability of traces

4.Advanced filler system

Improved drill ability and extended tool life compared to alumina containing circuit materials

Rogers 6035HTC PCB

Some Typical Applications:

1.High Power RF and Microwave Amplifiers

2.Power amplifiers, Couplers, Filters

3.Combiners, Power Dividers

PCB Capability(RT/duroid 6035HTC):

PCB Capability (RT/duroid 6035HTC) 
PCB Material: Ceramic-filled PTFE composites
Designation: RT/duroid 6035HTC
Dielectric constant: 3.50±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

Data Sheet of RT/duroid 6035HTC:

RT/duroid 6035HTC Typical Value
Property RT/duorid 6035HTC Direction Units Condition Test Method
Dielectric Constant,εProcess 3.50±0.05 Z 10 GHz/23℃ IPC-TM-650 Clamped Stripline
Dielectric Constant,εDesign 3.6 Z 8 GHz - 40 GHz Differential Phase Length Method
Dissipation Factor 0.0013 Z 10 GHz/23℃ IPC-TM-650
Thermal Coefficient of  ε -66 Z ppm/℃ -50℃to 150℃ mod IPC-TM-650,
Volume Resistivity 108 MΩ.cm A IPC-TM-650,
Surface Resistivity 108 A IPC-TM-650,
Dimensional Stability -0.11                    -0.08 CMD       MD mm/m (mils/inch) 0.030" 1oz EDC foil Thickness after etch '+E4/105 IPC-TM-650  2.4.39A
Tensile Modulus 329                 244 MD       CMD kpsi 40 hrs @23℃/50RH ASTM D638
Moisure Absorption 0.06 % D24/23 IPC-TM-650 ASTM D570
Coefficient of Thermal Expansion (-50℃to 288℃)
19                     19                     39 X                 Y                     Z                             ppm/℃ 23℃/ 50% RH  IPC-TM-650 2.4.41
Thermal Conductivity 1.44 W/m/k 80℃ ASTM C518
Density 2.2 gm/cm3 23℃ ASTM D792
Copper Peel Stength 7.9 pli 20 sec. @288℃ IPC-TM-650 2.4.8
Flammability V-0 UL 94
Lead-Free Process Compatible Yes




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