High
Frequency PCB Rogers 10mil 0.254mm RO4350B Double Sided RF PCB for LTE
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
RO4350B
is a patented hydrocarbon resin system/ceramic filler reinforced by braided
glass cloth. Its electrical properties are very similar to PTFE/ braided glass
cloth and its workability is similar to epoxy resin/glass cloth. There is even no need for special plating through hole
preprocessing or handling procedures as with PTFE-based microwave materials. It
also passes the UL94V-O fire rating required for active equipment and high
voltage rf design. Rogers Ro4350B high frequency material, dielectric constant:
3.38+0.05, loss factor :0.0027, dielectric constant temperature coefficient
:+40, volume resistance :1.7×10&10, surface resistance :4.2×10&9, TG:
> 280, TD:425, Thermal conductivity: O.64 Characteristics: low dielectric
constant tolerance and low loss stable electrical characteristics at different
frequencies low dielectric constant fluctuation with temperature low Z-axis
expansion coefficient easy mass production CAF impedance (ion migration
resistance)
High
frequency board refers to special circuit board with high electromagnetic
frequency. It is often used in automobile anti-collision system, satellite
system, radio system and other fields.
Rogers
PCBS are mainly used in wireless base stations, aviation and defense,
automotive, high-speed electronics, etc.
Our
company commonly used high-frequency plate has Rogers 4000 series, 3000 series,
Taconic TLY series, RF series, Polytetrafluoron PTFE: : F4BM dielectric 2.2-3.5
thickness: 10mil.20mil.30mil /60mi, etc., the material of the mixed plate is
generally :RO4350B+FR4, RO4350B+IT180, RO4003C + FR4, RO3010 + FR4, RO3003 + FR4,
etc.
Our
company is specialized in PCB manufacturing and has rich PCB manufacturing
experience for many years. We are committed to providing fast and high quality
PCB boards to customers around the world at reasonable prices. Every PCB is
manufactured according to strict standards, in accordance with IPC, RoHS and
other standards, to ensure that PCB boards meet customer requirements.
Parameters
of a type of 0.3mm RO4350B PCB
|
PCB SIZE
|
30 x 80mm=1up
|
|
BOARD TYPE
|
Double
sided PCB
|
|
Number
of Layers
|
2 layers
|
|
Surface
Mount Components
|
YES
|
|
Through
Hole Components
|
NO
|
|
LAYER STACKUP
|
copper
------- 35um(1 oz)+plate TOP layer
|
|
RO4350B 0.254mm
|
|
copper ------- 35um(1oz) + plate BOT Layer
|
|
TECHNOLOGY
|
|
|
Minimum Trace and Space:
|
N/A
|
|
Minimum
/ Maximum Holes:
|
N/A
|
|
Number
of Different Holes:
|
N/A
|
|
Number
of Drill Holes:
|
0
|
|
Number
of Milled Slots:
|
0
|
|
Number
of Internal Cutouts:
|
0
|
|
Impedance
Control:
|
no
|
|
Number
of Gold finger:
|
0
|
|
BOARD
MATERIAL
|
|
|
Glass
Epoxy:
|
RO4350B Tg280℃, er<3.48, Rogers Corp.
|
|
Final
foil external:
|
1.5
oz
|
|
Final
foil internal:
|
N/A
|
|
Final
height of PCB:
|
0.3
mm ±0.1
|
|
PLATING AND COATING
|
|
|
Surface Finish
|
Immersion gold,
16%
|
|
Solder
Mask Apply To:
|
N/A
|
|
Solder
Mask Color:
|
N/A
|
|
Solder
Mask Type:
|
N/A
|
|
CONTOUR/CUTTING
|
Routing
|
|
MARKING
|
|
|
Side of
Component Legend
|
N/A
|
|
Colour
of Component Legend
|
N/A
|
|
Manufacturer
Name or Logo:
|
N/A
|
|
VIA
|
NO
|
|
FLAMIBILITY RATING
|
UL
94-V0 Approval MIN.
|
|
DIMENSION TOLERANCE
|
|
|
Outline
dimension:
|
0.0059"
|
|
Board
plating:
|
0.0029"
|
|
Drill
tolerance:
|
0.002"
|
|
TEST
|
100%
Electrical Test prior shipment
|
|
TYPE OF ARTWORK TO BE SUPPLIED
|
email
file, Gerber RS-274-X, PCBDOC etc
|
|
SERVICE AREA
|
Worldwide,
Globally.
|
Typical applications are as follows:
Data sheet of Rogers 4350B (RO4350B)：
|
Property
|
RO4350B
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric
Constant,εProcess
|
3.48±0.05
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650
2.5.5.5 Clamped Stripline
|
|
Dielectric Constant,εDesign
|
3.66
|
Z
|
|
8 to 40 GHz
|
Differential
Phase Length Method
|
|
Dissipation Factortan,δ
|
0.0037
0.0031
|
Z
|
|
10
GHz/23℃
2.5 GHz/23℃
|
IPC-TM-650
2.5.5.5
|
|
Thermal Coefficient of ε
|
+50
|
Z
|
ppm/℃
|
-50℃to 150℃
|
IPC-TM-650
2.5.5.5
|
|
Volume Resistivity
|
1.2 x 1010
|
|
MΩ.cm
|
COND A
|
IPC-TM-650
2.5.17.1
|
|
Surface Resistivity
|
5.7 x109
|
|
MΩ
|
COND A
|
IPC-TM-650
2.5.17.1
|
|
Electrical Strength
|
31.2(780)
|
Z
|
Kv/mm(v/mil)
|
0.51mm(0.020")
|
IPC-TM-650
2.5.6.2
|
|
Tensile Modulus
|
16,767(2,432)
14,153(2,053)
|
X
Y
|
MPa(ksi)
|
RT
|
ASTM
D 638
|
|
Tensile Strength
|
203(29.5)
130(18.9)
|
X
Y
|
MPa(ksi)
|
RT
|
ASTM
D 638
|
|
Flexural Strength
|
255
(37)
|
|
MPa
(kpsi)
|
|
IPC-TM-650
2.4.4
|
|
Dimensional Stability
|
<0.5
|
X,Y
|
mm/m
(mil/inch)
|
after etch+E2/150℃
|
IPC-TM-650
2.4.39A
|
|
Coefficient of Thermal Expansion
|
10
12
32
|
X
Y
Z
|
ppm/℃
|
-55℃to288℃
|
IPC-TM-650
2.4.41
|
|
Tg
|
>280
|
|
℃TMA
|
A
|
IPC-TM-650
2.4.24.3
|
|
Td
|
390
|
|
℃TGA
|
|
ASTM
D 3850
|
|
Thermal Conductivity
|
0.69
|
|
W/M/oK
|
80℃
|
ASTM
C518
|
|
Moisture Absorption
|
0.06
|
|
%
|
48hrs
immersion 0.060"
sample Temperature 50℃
|
ASTM
D 570
|
|
Density
|
1.86
|
|
gm/cm3
|
23℃
|
ASTM
D 792
|
|
Copper Peel Stength
|
0.88
(5.0)
|
|
N/mm
(pli)
|
after
solder float 1 oz.
EDC Foil
|
IPC-TM-650
2.4.8
|
|
Flammability
|
(3)V-0
|
|
|
|
UL
94
|
|
Lead-free Process Compatible
|
Yes
|
|
|
|
|
MANUFACTURING PROCESS:
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BICHENG PCB CERTIFICATE:
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Tel : +86 755 27374946
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Email : info@bichengpcb.com
