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Home Rogers PCB Board Rogers TMM10i Microwave 15mil 25mil 50mil 75mil RF PCB with Immersion Gold

Rogers TMM10i Microwave 15mil 25mil 50mil 75mil RF PCB with Immersion Gold

Rogers’ TMM10i thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high plated-thru-hole reliability stripline and microstrip applications.






  • Item NO.:

    BIC-153-v121.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Color:

    White
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

Rogers TMM10i Microwave Printed Circuit Board 15mil 25mil 50mil 75mil TMM10i RF PCB with Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


The electrical and mechanical properties of TMM10i laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates, without requiring the specialized production techniques common to these materials.


TMM10i laminates have an exceptionally low thermal coefficient of dielectric constant, typically less than 30 ppm/°C. The material’s isotropic coefficients of thermal expansion, very closely matched to copper, allow for production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM10i laminates is approximately twice that of traditional PTFE/ceramic laminates, facilitating heat removal.


TMM10i laminates are based on thermoset resins, and do not soften when heated. As a result, wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation.


Rogers TMM10i PCB bichengpcb


Some Typical Applications:

1. Chip testers

2. Dielectric polarizers and lenses

3. Filters and coupler

4. Global Positioning Systems Antennas

5. Patch Antennas

6. Power amplifiers and combiners

7. RF and microwave circuitry

8. Satellite communication systems


Our Capabilities (TMM10i):


PCB Capability (TMM10i) 
PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation: TMM10i
Dielectric constant: 9.80 ±0.245
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm),        150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm),         275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion tin, OSP, Pure Gold Plated (No Nickle under gold) etc..


Data Sheet of TMM10:

TMM10i Typical Value
Property TMM10i Direction Units Condition Test Method
Dielectric Constant,εProcess 9.80±0.245 Z 10 GHz IPC-TM-650 2.5.5.5 
Dielectric Constant,εDesign 9.9 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.002 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant -43 - ppm/°K -55℃-125℃ IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 2 x 108 - Mohm.cm - ASTM D257
Surface Resistivity 4 x 107 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 267 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 ℃TGA - ASTM D3850
Coefficient of Thermal Expansion - x 19 X ppm/K 0 to 140℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 19 Y ppm/K 0 to 140℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 20 Z ppm/K 0 to 140℃ ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.76 Z W/m/K 80℃ ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.0 (0.9) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) - X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.8 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.16 - % D/24/23 ASTM D570
3.18mm (0.125") 0.13
Specific Gravity 2.77 - - A ASTM D792
Specific Heat Capacity 0.72 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -


BICHNEG PCB WORKSHOP:


BICHNEG PCB WORKSHOP


BICHNEG PCB CERTIFICATION: 


BICHNEG PCB CERTIFICATION


BICHENG PCB MAIN COURIERS:


BICHENG PCB MAIN COURIERS



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