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Home Newly Shipped RF PCB Rogers TMM6 PCB 2 layers 15mil 0.381mm Immersion Silver No Solder Mask Silkscreen

Rogers TMM6 PCB 2 layers 15mil 0.381mm Immersion Silver No Solder Mask Silkscreen

TMM6 2-layer PCB delivers the consistency, performance, and cost-efficiency your high-frequency projects demand.

  • Item NO.:

    BIC-412-v495.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


RogersTMM6 PCB 2 layers 15mil 0.381mm Immersion Silver No Solder Mask Silkscreen

 

For RF and microwave engineers tackling signal-critical designs, balancing material performance, fabrication feasibility, and project cost is a constant challenge. Our 2-layer PCB—built withRogers TMM6 thermoset laminate and engineered to 15mil core specifications—eliminates this tradeoff. Compliant with IPC-Class-2 standards and available globally,TMM6 15 mil PCB merges ceramic stability, PTFE-like processability, and tight manufacturing tolerances to power your high-frequency applications.

 

Material Breakthrough: Rogers TMM6’s Customer-Centric Design

At the heart of this PCB is Rogers TMM6, a ceramic-polymer composite crafted for plated thru-hole reliability in stripline and microstrip setups. Unlike traditional microwave materials that demand specialized production,TMM6 high frequency PCB works with standard PCB processes—cutting setup time and reducing fabrication errors. Its standout electrical properties shine at 10GHz: a stable dielectric constant (Dk) of 6.0±0.08 minimizes signal distortion, while a 0.0023 dissipation factor ensures ultra-low loss. Thermal resilience is equally impressive: 425°C decomposition temperature, 0.72W/mk conductivity, and copper-matched CTE (18 ppm/K x/y axes) prevent warping in extreme operating environments.

 

1. PCB Construction Details

Captures structural and fabrication specs that guarantee consistency in high-frequency performance.


Parameter

Specification

Base Material

Rogers TMM6

Layer Count

2 Layers

Board Dimensions

40mm x 70mm (1PC) ±0.15mm

Min. Trace/Spacing

4 mil / 5 mil

Min. Hole Size

0.2mm

Blind/Buried Vias

No

Finished Thickness

0.5mm

Finished Cu Weight

1 oz (35 μm)

Via Plating Thickness

20 μm

Surface Finish

Immersion Silver

Silkscreen (Top/Bottom)

No

Solder Mask (Top/Bottom)

No

Electrical Test

100% Tested

 


2. PCB Stackup

Details the 2-layer rigid structure optimized for signal integrity in high-frequency transmission.


Layer

Material

Thickness

1

Copper Foil

35 μm (1 oz)

Core

Rogers TMM6

0.381 mm (15 mil)

2

Copper Foil

35 μm (1 oz)

 


3. PCB Statistics

Provides key assembly data to streamline design validation and manufacturing planning.


Item

Quantity

Components

11

Total Pads

37

Thru-Hole Pads

25

Top-Side SMT Pads

12

Bottom-Side SMT Pads

0

Vias

18

Nets

2

 

TMM6 PCB 2-layer 15mil

 

Benefits

- Mechanical properties resist creep and cold flow

- Resistant to process chemicals, reducing damage during fabrication

- Based on a thermoset resin, allowing for reliable wire-bonding

- All common PCB processes can be used with TMM 6 materials


Typical Applications

This TMM6 Rogers PCB is expertly suited for a wide range of high-frequency applications, including:

 

- RF and microwave circuitry

- Power amplifiers and combiners

- Filters and coupler

- Satellite communication systems

- Global Positioning Systems Antennas

- Patch Antennas

- Dielectric polarizers and lenses

- Chip testers


Whether you’re designing for aerospace, telecommunications, or test equipment, our TMM6 2-layer PCB delivers the consistency, performance, and cost-efficiency your high-frequency projects demand. Partner with a solution that turns complex RF challenges into streamlined success.






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