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TMM6 2-layer PCB delivers the consistency, performance, and cost-efficiency your high-frequency projects demand.
Item NO.:
BIC-412-v495.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
RogersTMM6 PCB 2 layers 15mil 0.381mm Immersion Silver No Solder Mask Silkscreen
For RF and microwave engineers tackling signal-critical designs, balancing material performance, fabrication feasibility, and project cost is a constant challenge. Our 2-layer PCB—built withRogers TMM6 thermoset laminate and engineered to 15mil core specifications—eliminates this tradeoff. Compliant with IPC-Class-2 standards and available globally,TMM6 15 mil PCB merges ceramic stability, PTFE-like processability, and tight manufacturing tolerances to power your high-frequency applications.
Material Breakthrough: Rogers TMM6’s Customer-Centric Design
At the heart of this PCB is Rogers TMM6, a ceramic-polymer composite crafted for plated thru-hole reliability in stripline and microstrip setups. Unlike traditional microwave materials that demand specialized production,TMM6 high frequency PCB works with standard PCB processes—cutting setup time and reducing fabrication errors. Its standout electrical properties shine at 10GHz: a stable dielectric constant (Dk) of 6.0±0.08 minimizes signal distortion, while a 0.0023 dissipation factor ensures ultra-low loss. Thermal resilience is equally impressive: 425°C decomposition temperature, 0.72W/mk conductivity, and copper-matched CTE (18 ppm/K x/y axes) prevent warping in extreme operating environments.
1. PCB Construction Details
Captures structural and fabrication specs that guarantee consistency in high-frequency performance.
Parameter |
Specification |
Base Material |
Rogers TMM6 |
Layer Count |
2 Layers |
Board Dimensions |
40mm x 70mm (1PC) ±0.15mm |
Min. Trace/Spacing |
4 mil / 5 mil |
Min. Hole Size |
0.2mm |
Blind/Buried Vias |
No |
Finished Thickness |
0.5mm |
Finished Cu Weight |
1 oz (35 μm) |
Via Plating Thickness |
20 μm |
Surface Finish |
Immersion Silver |
Silkscreen (Top/Bottom) |
No |
Solder Mask (Top/Bottom) |
No |
Electrical Test |
100% Tested |
2. PCB Stackup
Details the 2-layer rigid structure optimized for signal integrity in high-frequency transmission.
Layer |
Material |
Thickness |
1 |
Copper Foil |
35 μm (1 oz) |
Core |
Rogers TMM6 |
0.381 mm (15 mil) |
2 |
Copper Foil |
35 μm (1 oz) |
3. PCB Statistics
Provides key assembly data to streamline design validation and manufacturing planning.
Item |
Quantity |
Components |
11 |
Total Pads |
37 |
Thru-Hole Pads |
25 |
Top-Side SMT Pads |
12 |
Bottom-Side SMT Pads |
0 |
Vias |
18 |
Nets |
2 |
Benefits
- Mechanical properties resist creep and cold flow
- Resistant to process chemicals, reducing damage during fabrication
- Based on a thermoset resin, allowing for reliable wire-bonding
- All common PCB processes can be used with TMM 6 materials
Typical Applications
This TMM6 Rogers PCB is expertly suited for a wide range of high-frequency applications, including:
- RF and microwave circuitry
- Power amplifiers and combiners
- Filters and coupler
- Satellite communication systems
- Global Positioning Systems Antennas
- Patch Antennas
- Dielectric polarizers and lenses
- Chip testers
Whether you’re designing for aerospace, telecommunications, or test equipment, our TMM6 2-layer PCB delivers the consistency, performance, and cost-efficiency your high-frequency projects demand. Partner with a solution that turns complex RF challenges into streamlined success.
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