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Home Newly Shipped RF PCB RT/duroid 6006 PCB 2-layer 10mil 0.254mm Rogers 6006 Immersion Gold Black Silkscreen

RT/duroid 6006 PCB 2-layer 10mil 0.254mm Rogers 6006 Immersion Gold Black Silkscreen

This RT/duroid 6006 2-Layer PCB represents the intersection of advanced material science and precision manufacturing—designed to meet the most stringent requirements of high-frequency systems. 

  • Item NO.:

    BIC-441-v524.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


RT/duroid 6006 PCB 2-layer 10mil 0.254mm Rogers 6006 Immersion Gold Black Silkscreen

 

Introducing our newly shipped RT/duroid 6006 2-Layer 10mil PCB—a premium solution engineered for high-performance microwave and RF systems where signal integrity, miniaturization, and reliability are mission-critical. Built on Rogers’ industry-leading ceramic-PTFE composite laminates, this Rogers 6006 PCB combines exceptional dielectric properties, tight manufacturing tolerances, and optimized design to excel in demanding applications from satellite communications to radar systems. Below is a comprehensive breakdown of its specifications, material advantages, and operational value.

 

PCB Construction Details

The PCB’s construction is precision-engineered to maximize the performance of 10 milRT/duroid 6006, with key parameters controlled to meet high-frequency application requirements:

 

Item

Specification

Base Material

RT/duroid 6006

Layer Count

2-Layer

Board Dimensions

43mm x 107.5mm (1PCS), +/- 0.15mm tolerance

Minimum Trace/Space

4/4 mils

Minimum Hole Size

0.2mm

Blind Vias

None

Finished Board Thickness

0.35mm

Finished Cu Weight (Outer Layers)

1oz (1.4 mils)

Via Plating Thickness

20 μm

Surface Finish

Immersion Gold

Top Silkscreen

Black

Bottom Silkscreen

No

Top Solder Mask

No

Bottom Solder Mask

No

Quality Control

100% Electrical test prior to shipment

 

 

PCB Stackup

The 2-Layer 10mil Circuit Board PCB rigid stackup is optimized to leverage RT/duroid 6006’s dielectric advantages while ensuring stable signal transmission:

 

Layer

Material/Component

Thickness

Copper Layer 1

Electrodeposited Copper Foil

35 μm

Core Material

RT/duroid 6006

0.254mm (10mil)

Copper Layer 2

Electrodeposited Copper Foil

35 μm

 

 

PCB Statistics

Component and connectivity metrics reflect the PCB’s streamlined design for targeted high-frequency functionality:

 

Statistical Item

Value

Total Components

31

Total Pads

79

Thru Hole Pads

37

Top SMT Pads

42

Bottom SMT Pads

0

Total Vias

50

Total Nets

2

 

 

Material Foundation: RT/duroid 6006

Rogers RT/duroid 6006 laminates are purpose-built for electronic and microwave circuits requiring high dielectric constant (Dk) performance. As a ceramic-PTFE composite, it enables significant circuit size reduction while maintaining low loss—ideal for operations at X-band or below. Tight Dk (6.15±0.15 at 10 GHz/23°C) and thickness control ensures repeatable circuit performance across production runs, a critical advantage for mission-critical systems.

 

 RT/duroid 6006 2-Layer PCB

 

Key Features

This Rogers PCB inherits RT/duroid 6006’s industry-leading attributes: dissipation factor of 0.0027 at 10 GHz/23°C, thermal decomposition temperature (Td) > 500°C (TGA), and ultra-low moisture absorption (0.05%). Its CTE values (X-axis: 47 ppm/°C, Y-axis: 34 ppm/°C, Z-axis: 117 ppm/°C) support dimensional stability during thermal cycling, while compliance with 94-V0 flammability standards and lead-free compatibility aligns with global environmental and safety regulations.

 

 

Core Benefits

1) Size Reduction: High Dk minimizes circuit footprint, lowering system weight and space requirements.

2) Low Signal Loss: Optimized for X-band and below, ensuring minimal attenuation in high-frequency transmissions.

3) Consistent Performance: Tightεr and thickness control guarantees reliability across batches.

Environmental Resilience: Low moisture absorption enhances durability in harsh operating conditions.

4) Robust Connectivity: Reliable plated through-holes (20μm plating thickness) ensure stable interlayer connections.

 

 

Typical Applications

Engineered for demanding use cases, this RT/duroid 6006 high frequency PCB excels in:


  • Patch Antennas
  • Satellite Communications Systems
  • Power Amplifiers
  • Aircraft Collision Avoidance Systems
  • Ground Radar Warning Systems


 

Quality & Compliance

Adhering to IPC-Class-2 standards, theRogersPCB supports Gerber RS-274-X artwork for seamless manufacturing integration. Each unit undergoes 100% electrical testing before shipment, ensuring zero-defect performance. With worldwide availability, it delivers consistent quality to global customers across aerospace, defense, and telecommunications industries.

 

 

This RT/duroid 6006 2-Layer PCB represents the intersection of advanced material science and precision manufacturing—designed to meet the most stringent requirements of high-frequency systems. Whether you’re developing next-generation radar or satellite communications technology, it delivers the performance, reliability, and scalability your projects demand.

 

For custom modifications, technical support, or volume pricing inquiries, please reach out to our sales team—we’re ready to tailor this solution to your specific application needs.



 




BICHENG PCB CERTIFICATE:



Top 10 Sales of Rogers PCB




Major material Supplier



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