RT/duroid 6035HTC PCB 2-layer 60mil 1.524mm ENIG Rogers 6035HTC Black Silkscreen

RT/duroid 6035HTC PCB 2-layer 60mil 1.524mm ENIG Rogers 6035HTC Black Silkscreen

Designed for demanding high-power RF and microwave scenarios, our RT/duroid 6035HTC 2-layer PCB stands out as a precision-engineered solution, combining advanced material properties with meticulous manufacturing. Crafted from Rogers RT/duroid 6035HTC—a ceramic-filled PTFE composite—this Rogers 60mil PCB delivers exceptional thermal conductivity, stable high-frequency performance, and reliability, making it ideal for power-intensive applications where performance and durability are non-negotiable.

Core Material: RT/duroid 6035HTC

At the heart of this PCB is Rogers 6035HTC, a premium laminate tailored for high-power RF and microwave use. As a ceramic-filled PTFE composite, it addresses critical challenges in high-power scenarios: its thermal conductivity (1.44 W/m/K at 80°C) is nearly 2.4 times that of standard RT/duroid 6000 series, enabling efficient heat dissipation to keep components cool. Its advanced filler system also enhances drill-ability, reducing manufacturing costs compared to alumina-filled alternatives, while the copper foil (ED and reverse treat) ensures long-term thermal stability—critical for sustained high-power operation.

Key Features & Benefits

This 60mil RT/duroid 6035HTC PCB’s performance is defined by its material and design precision:

1) Superior Dielectric Properties: With a dielectric constant (DK) of 3.5±0.05 at 10 GHz/23°C and a dissipation factor of 0.0013 at the same conditions, it minimizes signal loss, ensuring clear high-frequency transmission.

2) Thermal Efficiency: High thermal conductivity and a low thermal coefficient of dielectric constant (-66 ppm/°C) prevent performance degradation under temperature fluctuations, making it ideal for high-power environments.

3) Mechanical Stability: CTE values (19 ppm/°C in X/Y axes, 39 ppm/°C in Z-axis) ensure dimensional stability, while UL 94-V0 flammability rating adds safety.

4) Lead-Free Compatibility: Aligns with modern Environmental friendly standards, supporting sustainable manufacturing workflows.

These features translate to tangible benefits: lower operating temperatures for high-power components, reduced insertion loss, and consistent performance across demanding conditions—critical for maintaining reliability in mission-critical systems.

PCB Construction Details

The following table outlines core construction parameters, from material to manufacturing standards, ensuring transparency in design and quality.

PCB Stackup

This table details the 2-layer rigid structure, highlighting material thicknesses for precise design integration.

PCB Statistics

The following data reflects component and connectivity details, aiding in assembly and integration planning.

Typical Applications

Engineered for high-power RF and microwave systems, this Rogers 6035HTC custom PCB excels in:

• High-power RF and microwave amplifiers
• Power amplifiers, couplers, filters, combiners, and power dividers
• Its combination of thermal efficiency and high-frequency stability makes it a go-to choice for industries ranging from telecommunications to aerospace, where performance under extreme power loads is paramount.

Compliance & Availability

• Artwork Type: Gerber RS-274-X (industry-standard format for seamless manufacturing integration).
• Quality Standard: IPC-Class-2, ensuring reliable performance for general electronic assemblies.
• Availability: Shipped worldwide, with prompt delivery to support global project timelines.

In summary, our RT/duroid 6035HTC high frequency PCB is more than a component—it’s a solution engineered to meet the rigors of high-power RF and microwave applications, blending advanced materials with precision manufacturing to deliver performance, reliability, and value.