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Home Newly Shipped RF PCB TLX-0 PCB 2-layer 20mil 0.508mm Immersion Gold Taconic RF Board Bare Copper

TLX-0 PCB 2-layer 20mil 0.508mm Immersion Gold Taconic RF Board Bare Copper

TLX-0 high frequency PCB integrates advanced material technology, precise manufacturing, and excellent performance, making it a trusted choice for RF and microwave applications across industries.

  • Item NO.:

    BIC-426-v509.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


TLX-0 PCB 2-layer 20mil 0.508mm Immersion Gold Taconic RF Board Bare Copper

 

The TLX-0 2-layer 20 mil PCB is a cutting-edge high-reliability printed circuit board tailored for RF and microwave applications. Crafted with TLX-0 PTFE fiberglass composite material, it stands out for its stable dielectric properties, excellent mechanical strength, and adaptability to extreme environments, making it an ideal choice for low-layer-count microwave designs in various high-tech fields. Below is a detailed breakdown of its technical specifications, performance features, and application value.

 

1. PCB Construction Details Summary

The following table outlines the core structural parameters of the Taconic TLX-0 PCB, covering base material, dimensions, electrical performance indicators, and quality control measures, reflecting the product's precision and reliability.


Parameter

Specification

Base Material

TLX-0 (PTFE Fiberglass Composite)

Layer Count

2-layer

Board Dimensions (Panelization)

175mm x 90mm (10 PCS per panel)

Dimensional Tolerance

± 0.15mm

Minimum Trace / Space

5 mil / 7 mil

Minimum Hole Size

0.3mm

Blind / Buried Vias

No

Finished Board Thickness

0.6mm

Finished Copper Weight (Outer)

1 oz (35 μm / 1.4 mils)

Via Plating Thickness

20 μm

Surface Finish

Immersion Gold (ENIG)

Top / Bottom Silkscreen

No

Top / Bottom Solder Mask

No

Via Treatment

Hole plugged by solder mask ink (Green)

Electrical Testing

100% Electrical Test Prior to Shipment

 


2. PCB Stackup

The stackup structure of this 2-layerTaconic PCB is simple yet optimized, ensuring stable signal transmission and mechanical performance with precise material thickness matching.


Layer

Material

Thickness

Layer 1

Copper (Signal/Component)

35 μm (1 oz)

Dielectric

TLX-0 Core

0.508 mm (20 mil)

Layer 2

Copper (Signal/Ground)

35 μm (1 oz)

 


3. PCB Statistics Summary

The following table presents the key statistical data of the 0.508 mm TLX-0 PCB, including component quantity, pad distribution, via count, etc., providing a clear reference for circuit design and assembly.


Item

Quantity

Components

32

Total Pads

73

Thru-Hole Pads

51

Top-Side SMT Pads

22

Bottom-Side SMT Pads

0

Vias

105

Nets

2



4. Core Material: TLX-0 Laminate

 

The TLX-0 PCB is built on TLX series laminates, which are composed of PTFE fiberglass composites—an industry workhorse in RF microwave substrates. TLX-0, a standout in the series, features a dielectric constant (DK) of 2.45 with an ultra-tight tolerance of±0.04, making it highly suitable for low-layer-count microwave designs.

 

This TLX-0 material excels in withstanding extreme environments: it resists creep for PCBs bolted to vibration-prone housings during space launches, endures high temperatures in engine modules, maintains stability under radiation in space (compliant with NASA's low-outgassing material standards), resists harsh marine conditions for warship antennas, and adapts to wide temperature ranges for altimeter substrates during flights.


TLX-0 PCB 2-layer 20mil Immersion gold

 


5. Outstanding Product Features

The TLX-0 20 mil PCB boasts exceptional performance parameters that lay the foundation for reliable RF/microwave applications: 


  • Dielectric Constant (DK): 2.45 +/-0.04 at 10GHz, ensuring stable signal propagation.
  • Dissipation Factor (DF): 0.0021 at 10GHz, minimizing signal loss.
  • Moisture Absorption: 0.02% (low), preventing performance degradation from humidity.
  • Coefficient of Thermal Expansion (CTE): X-axis 21 ppm/°C, Y-axis 23 ppm/°C, Z-axis 215 ppm/°C, ensuring dimensional stability under temperature fluctuations.
  • Peel Strength: 12 lbs/in, guaranteeing strong adhesion between copper layers and base material.



6. Customer-Centric Benefits

These features translate into tangible benefits for users:


  • Excellent PIM Values: Measured at lower than -160 dBc, ensuring high signal quality.
  • Superior Mechanical & Thermal Properties: Adapting to harsh operating conditions.
  • Low and Stable DK: Supporting consistent signal transmission.
  • Dimensional Stability: Avoiding deformation that affects circuit performance.
  • Low Moisture Absorption: Enhancing long-term reliability in humid environments.
  • Tightly Controlled DK: Meeting high-precision design requirements.
  • Low DF: Reducing energy loss and improving efficiency.
  • UL 94 V0 Rating: Ensuring fire safety.
  • Ideal for Low Layer Count Microwave Designs: Cost-effective and performance-driven.


 

7. Typical Applications

The TLX-0 Taconic RF PCB Circuit Board is widely applicable in RF and microwave fields, including:


  • Passive components: Couplers, splitters, combiners, amplifiers, and antennas.
  • Advanced systems: Radar systems, mobile communications equipment.
  • Test & measurement: Microwave test equipment.
  • Transmission devices: Microwave transmission devices and various RF components.


 

8. Quality & Availability


  • Artwork Format: Gerber RS-274-X, compatible with mainstream design software.
  • Quality Standard: Complies with IPC-Class-2, ensuring high manufacturing quality.
  • Availability: Offered worldwide, enabling global customers to access this high-performance PCB solution conveniently.



In summary, the TLX-0 high frequency PCB integrates advanced material technology, precise manufacturing, and excellent performance, making it a trusted choice for RF and microwave applications across industries.






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