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The 20mil RT/duroid 6035HTC PCB is a cutting-edge solution for high-power RF and microwave applications. Its exceptional thermal conductivity, low dissipation factor, and stable dielectric properties make it a top choice for engineers and designers seeking reliability and performance.
Item NO.:
BIC-322v398.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
RTduroid 6035HTC PCB 2-layer 20mil 0.508mm Rogers 6035HTC Substrate-Immersion Gold
Introduction
The RT/duroid 6035HTC high frequency PCB is a high-performance, high-frequency circuit material designed for demanding RF and microwave applications. Manufactured by Rogers Corporation, this PCB is engineered to deliver exceptional thermal conductivity, superior electrical performance, and long-term reliability. With its ceramic-filled PTFE composite structure, the Rogers 6035HTC substrate PCB is an ideal choice for high-power applications where thermal management and signal integrity are critical. Whether you're designing power amplifiers, filters, or combiners, this PCB ensures optimal performance in even the most challenging environments.
Key Features
1.Dielectric Constant (Dk): 3.5 +/- 0.05 at 10 GHz/23°C
The consistent dielectric constant ensures stable signal propagation, making it perfect for high-frequency applications.
2.Low Dissipation Factor: 0.0013 at 10 GHz/23°C
This low dissipation factor minimizes signal loss, ensuring high efficiency and performance in RF and microwave circuits.
3.Thermal Conductivity: 1.44 W/m/K at 80°C
With nearly 2.4 times the thermal conductivity of standard RT/duroid 6000 series materials, this PCB excels in dissipating heat, reducing operating temperatures, and enhancing reliability.
4.Thermal Coefficient of Dielectric Constant: -66 ppm/°C
This low thermal coefficient ensures stable electrical performance across a wide temperature range.
5.Moisture Absorption: 0.06%
Low moisture absorption guarantees consistent performance even in humid environments.
6.CTE (Coefficient of Thermal Expansion):
X-axis: 19 ppm/°C
Y-axis: 19 ppm/°C
Z-axis: 39 ppm/°C
The balanced CTE ensures dimensional stability, reducing the risk of warping or delamination during thermal cycling.
7.Copper Foil:
Electro-Deposited (ED) and reverse-treated copper foil with excellent thermal stability.
8.Drillability:
Advanced filler system enables smooth drilling, reducing manufacturing costs compared to alumina-filled laminates.
Why Choose RT/duroid 6035HTC PCB?
1.High Thermal Conductivity:
Efficient heat dissipation lowers operating temperatures, extending the lifespan of high-power components.
2.Improved Dielectric Heat Dissipation:
Reduces thermal stress on components, ensuring reliable performance in high-power applications.
3.Excellent High-Frequency Performance:
Ideal for RF and microwave circuits, offering low insertion loss and stable signal integrity.
4.Thermal Stability:
Maintains consistent performance even under extreme thermal conditions.
5.Cost-Effective Manufacturing:
Superior drillability reduces production costs, making it an economical choice for high-performance applications.
PCB Stackup and Construction Details
The RT duroid 6035HTC PCB is a 2-layer rigid PCB with the following construction:
Layer 1: Copper foil - 35 μm (1 oz)
Core Material: RT/duroid 6035HTC - 0.508 mm (20 mil)
Layer 2: Copper foil - 35 μm (1 oz)
|
Parameter |
Details |
|
Board Dimensions |
67.02 mm x 45.7 mm = 1PCS, +/- 0.15 mm |
|
Minimum Trace/Space |
5/6 mils |
|
Minimum Hole Size |
0.3 mm |
|
Blind Vias |
No |
|
Finished Board Thickness |
0.6 mm |
|
Finished Cu Weight |
1 oz (1.4 mils) outer layers |
|
Via Plating Thickness |
20 μm |
|
Surface Finish |
Immersion Gold |
|
Top Silkscreen |
No |
|
Bottom Silkscreen |
No |
|
Top Solder Mask |
No |
|
Bottom Solder Mask |
No |
|
Electrical Testing |
100% tested prior to shipment |
PCB Statistics
|
Parameter |
Quantity |
|
Components |
14 |
|
Total Pads |
41 |
|
Thru Hole Pads |
25 |
|
Top SMT Pads |
16 |
|
Bottom SMT Pads |
0 |
|
Vias |
21 |
|
Nets |
2 |
Artwork and Standards
Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
Typical Applications
The Rogers 6035HTC PCB is widely used in high-power RF and microwave applications, including:
- High power RF and microwave amplifiers
- Power amplifiers, couplers, filters, combiners, power dividers
Conclusion
The 20mil RT/duroid 6035HTC PCB is a cutting-edge solution for high-power RF and microwave applications. Its exceptional thermal conductivity, low dissipation factor, and stable dielectric properties make it a top choice for engineers and designers seeking reliability and performance. Whether you're working on power amplifiers, combiners, or filters, this PCB delivers the performance and durability you need. Available worldwide and compliant with IPC-Class-2 standards, the RT/duroid 6035HTC PCB is your go-to solution for high-frequency, high-power applications.
For more information or to place an order, contact us today and experience the unmatched quality of Rogers 6035HTC PCBs!
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