Taconic TSM-DS3 PCB 2-layer 30mil 0.762mm ENIG Green Solder Mask White Silkscreen

Taconic TSM-DS3 PCB 2-layer 30mil 0.762mm ENIG Green Solder Mask White Silkscreen

Introduction

The TSM-DS3 30 mil PCB redefines performance for high-power, high-frequency applications, leveraging a ceramic-filled reinforced substrate with industry-leading thermal stability and low loss. Engineered to meet IPC-Class-2 standards, thisTaconicPCB combines precise manufacturing with the unique benefits of TSM-DS3 material, making it ideal for sectors ranging from aerospace to semiconductor testing.

1. PCB Construction Details

Comprehensive build specs ensuring precision, reliability, and compatibility with standard assembly processes.

2. PCB Stackup

A streamlined 2-layer rigid structure optimized for thermal conductivity and signal integrity.

3. PCB Statistics

Key design metrics supporting component placement and connectivity planning.

TSM-DS3 Material

At the core of this Taconic High Frequency PCB is TSM-DS3, a ceramic-filled substrate with only ~5% fiberglass content—far less than traditional epoxies. This unique composition delivers:

1) Electrical Excellence: Dielectric constant (Dk) of 3.0±0.05 at 10GHz/23°C and dissipation factor (Df) of 0.0014 at 10GHz, ensuring minimal signal loss for high-frequency applications.

2) Thermal Resilience: Thermal conductivity of 0.65 W/m·K (unclad) and low moisture absorption (0.07%), critical for heat management in high-power designs like radar manifolds.

3) Dimensional Stability: CTE matched to copper (X-axis: 10 ppm/°C, Y-axis: 16 ppm/°C, Z-axis: 23 ppm/°C), enabling consistent performance across thermal cycles (-30 to 120°C) with Dk stability of±0.25%.

Unmatched Benefits for Design & Manufacturing

The Taconic TSM-DS3 PCB translates material advantages into tangible value:

1) Versatile Scalability: Rivals epoxy in dimensional stability, supporting large-format and high-layer-count PCBs without compromising yield.

2) Reliable Production: Manufactured with the predictability of top fiberglass-reinforced epoxies, ensuring consistent quality for complex designs.

3) Material Compatibility: Works seamlessly with resistive foils, expanding design flexibility for specialized applications.

Typical Applications

This Taconic PCB Laminates excels in the most demanding environments:

- Couplers

- Phased Array Antennas

- Radar Manifolds

- mmWave Antenna/Automotive

- Oil Drilling

- Semiconductor/ATE Testing

Quality & Availability

Supplied with Gerber RS-274-X artwork for seamless integration into design workflows, this high frequency PCB is available worldwide and adheres to IPC-Class-2 standards—guaranteeing reliability for commercial and industrial use. Every unit undergoes 100% electrical testing pre-shipment, eliminating performance risks.

Conclusion

The TSM-DS3 2-Layer 30mil PCB is more than a circuit board—it’s a solution for engineers seeking low loss, thermal stability, and dimensional precision. Whether powering radar systems or semiconductor testers, it delivers consistent performance where it matters most.