Copper Coin Embedded PCB 6-Layer M6 and IT180 High Tg FR-4 Hybrid Circuit Board

Copper Coin Embedded PCB 6-Layer M6 and IT180 High Tg FR-4 Hybrid Circuit Board

Introducing the Copper Coin Embedded PCB 6-Layer M6 and IT180 Hybrid board—a cutting-edge printed circuit board engineered to meet the demands of high-frequency, high-temperature, and high-reliability applications. This innovative mixed material PCB combines the superior signal integrity of M6 high-speed material with the robust thermal and mechanical stability of IT180 material, enhanced by a centrally embedded copper coin for optimized heat dissipation. Whether powering 5G base stations, automotive radar systems, or aerospace electronics, this 6-layer PCB delivers precision, durability, and efficiency in a compact form factor.

PCB Construction Details

This section outlines critical construction parameters, from base materials to quality assurance measures, ensuring clarity on structural integrity and performance capabilities.

PCB Stackup

The 6-layer PCB stackup is meticulously designed to balance high-frequency performance and thermal efficiency, leveraging M6 high speed material and IT180 materials for targeted layer functionality.

PCB Statistics

These statistics highlight the Hybrid PCB Board’s capacity for dense component integration while maintaining manufacturing precision.

Core Advantages: M6 Material Performance & Engineering Excellence

At the heart of this PCB is M6 high-speed material, engineered for exceptional high-frequency performance: it boasts a low dielectric constant (DK 3.4 at 1GHz, 3.34 at 13GHz) and ultra-low dissipation factor (0.002 at 1GHz, 0.0037 at 13GHz), minimizing signal loss in high-speed circuits. Complemented by a high Tg (>185°C via DSC, 210°C via DMA) and thermal decomposition temperature (410°C), M6 ensures stability under extreme heat—critical for automotive and aerospace environments.

The hybrid design with IT180 core materials enhances mechanical robustness, while the embedded copper coin accelerates heat transfer, preventing thermal throttling in power-dense components.Resin-filled and capped viaseliminate signal interference, whileENIG surface finish ensures long-term solderability and corrosion resistance.

Applications & Compliance

This 6-layer hybrid PCB excels in:

• 5G Communication Base Stations (millimeter-wave antennas, AAU radio-frequency front-ends)
• Automotive Electronics (77GHz radar, ADAS)
• Networking & Communications
• Aerospace & Defense

Compliant with IPC-Class-2 standards, RoHS, and halogen-free requirements, it aligns with green manufacturing norms. Compatible with traditional FR-4 processing, it reduces production costs without sacrificing performance. Available worldwide, this Copper Coin Embedded 6-layer PCB is a versatile solution for next-generation electronics demanding speed, reliability, and thermal efficiency.