TLY-5Z High Frequency PCB 60mil 30mil 20mil and 10mil Taconic RF PCB with Immersion Gold
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
It is designed for low density applications such as aerospace having optimally low weight requirements. Since using ceramic and woven fiberglass, TLY-5Z has high stable property on dimension. The low density approach also makes it with a low Z axis expansion which is not possible with PTFE-rich composites. TLY-5Z has high thermally stability and it has just half the thermal expansion of PTFE-rich laminates, offers improved drilling and can be thermally cycled.
Benefits:
Low Z Axis CTE
Plated through hole stability
Low density (1.92 g/cm3)
Attractive price/performance ratio
Excellent peel strength
Compatible with flat copper
Typical Applications:
Aerospace components
Low weight antennas for aircraft
RF passive components
Our PCB Capability (TLY-5Z):
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PCB Capability (TLY-5Z)
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PCB Material:
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Composites of
Ceramic, PTFE and Woven Fiberglass
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Designation:
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TLY-5Z
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Dielectric constant:
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2.20 +/- 0.04
(1.9GHz)
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Dissipation Factor
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0.0015 (10GHz)
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Layer count:
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Double Sided PCB, Multilayer PCB, Hybrid PCB
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Copper
weight:
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0.5oz (17 µm), 1oz (35µm)
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Laminate
thickness:
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10mil
(0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
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PCB size:
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≤400mm X 500mm
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Solder mask:
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Green, Black, Blue,
Yellow, Red etc.
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Surface
finish:
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Bare
copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated
etc..
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About Us:
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.
We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We also actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.
Our PCBs are used for a variety of purposes, including, but not limited to, computer networking, safety and surveillance, power supply, telecommunication, automotive electronics, medical apparatus and instruments, national defense and industrial equipment etc.
Appendix: Typical Values of TLY-5Z:
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TLY-5Z
Typical Values
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Property
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Test Method
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Unit
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Value
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Unit
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Value
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Dk @ 1.9 GHz
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IPC-650 2.5.5.5.1
Mod.
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2.20+/- 0.04
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2.20+/- 0.04
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Df @ 1.9 GHz
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IPC-650 2.5.5.5.1
Mod.
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0.001
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0.001
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Df @ 10 GHz
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IPC-650 2.5.5.5.1
Mod.
|
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0.0015
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0.0015
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Tc(D)K (-55 ~150°C)
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IPC-650 2.5.5.6 Mod.
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ppm/°C
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-72
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ppm/°C
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-72
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Dielectric
Breakdown Voltage
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IPC-650 2.5.6
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kV
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45
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kV
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45
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Dielectric
Strength
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IPC-650 2.5.6.2
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V/mil
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770
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V/mm
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30,315
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Moisture
Absorption
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IPC-650 2.6.2.1
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%
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0.03
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%
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0.03
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Peel Strength
(1 oz. copper)
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IPC-650 2.4.8
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lbs./inch
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7
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N/mm
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1.3
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Volume
Resistivity
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IPC-650 2.5.17.1
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Mohms/cm
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10^9
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Mohms/cm
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10^9
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Surface
Resistivity
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IPC-650 2.5.17.1
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Mohms
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10^8
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Mohms
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10^8
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Tensile
Strength (MD)
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IPC-650 2.4.18.3
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psi
|
9137
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N/mm2
|
63
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Tensile
Strength (CD)
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IPC-650 2.4.18.3
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psi
|
9572
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N/mm2
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66
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Tensile
Modulus (MD)
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IPC-650 2.4.18.3
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psi
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182,748
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N/mm2
|
1260
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Tensile
Modulus (CD)
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IPC-650 2.4.18.3
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psi
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165,344
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N/mm2
|
1140
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Elongation
(MD)
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IPC-650 2.4.18.3
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%
|
6
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%
|
6
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Elongation
(CD)
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IPC-650 2.4.18.3
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%
|
6.9
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%
|
6.9
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Flex Strength
(MD)
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ASTM D790
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psi
|
10,300
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N/mm2
|
71
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Flex Strength
(CD)
|
ASTM D790
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psi
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11,600
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N/mm2
|
80
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Flex Modulus
(MD)
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ASTM D790
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psi
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377,100
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N/mm2
|
2600
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Flex Modulus
(CD)
|
ASTM D790
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psi
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432,213
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N/mm2
|
2980
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Dimensional
Stability (MD)
|
IPC-650
2.4.39(Bake)
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% (10 mil)
|
-0.05
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% (30 mil)
|
-0.05
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Dimensional
Stability (CD)
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IPC-650
2.4.39(Bake)
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% (10 mil)
|
-0.17
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% (30 mil)
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-0.11
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Dimensional
Stability (MD)
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IPC-650
2.4.39(Stress)
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% (10 mil)
|
-0.07
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% (30 mil)
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-0.07
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Dimensional
Stability (CD)
|
IPC-650
2.4.39(Stress)
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% (10 mil)
|
-0.22
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% (30 mil)
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-0.14
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Density
(Specific Gravity)
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IPC-650 2.3.5
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g/cm3
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1.92
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g/cm3
|
1.92
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Specific Heat
|
IPC-650 2.4.50
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J/g°C
|
0.95
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J/g°C
|
0.95
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Thermal
Conductivity
|
IPC-650 2.4.50
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W/M*K
|
0.2
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W/M*K
|
0.2
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CTE (x-y) (50 - 150°C)
|
IPC-650 2.4.41
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ppm/ºC
|
30-40
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ppm/ºC
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30-40
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CTE (z) (50 - 150°C)
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IPC-650 2.4.41
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ppm/ºC
|
130
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ppm/ºC
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130
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Hardness
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ASTM
D2240(Durometer)
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-
|
68
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-
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68
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UL-94
Flammability Rating
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UL-94
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V-0
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V-0
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