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Home Newly Shipped RF PCB TMM10i PCB 50mil 1.27mm Rogers Substrate for RF Microwave

TMM10i PCB 50mil 1.27mm Rogers Substrate for RF Microwave

The TMM10i 50mil PCB is a high-quality printed circuit board designed for various applications, including RF and microwave circuitry, power amplifiers, filters, and couplers.

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  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
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TMM10i PCB 50mil 1.27mm Rogers Substrate for RF Microwave


Introducing the TMM10i 50mil Rogers PCB, a cutting-edge solution for RF and microwave circuitry. Our TMM10i PCB is specifically designed to meet the demanding requirements of high-frequency applications, ensuring exceptional performance and reliability. With its advanced material composition and precise construction, the TMM10i PCB is the ideal choice for a wide range of applications, from power amplifiers and combiners to satellite communication systems and chip testers.


Material and Performance:

The TMM10i PCB is constructed using a combination of ceramic, hydrocarbon, and thermoset polymer composites, resulting in a high-performance substrate. It features a process dielectric constant (Dk) of 9.80 +/- 0.23 at 10 GHz/23°C, providing excellent signal integrity. With a dissipation factor of 0.0020 at 10 GHz/23°C, the PCB minimizes signal loss and distortion. The thermal coefficient of Dk of -43 ppm/°C during -55°C to 125°C ensures stable performance across a wide temperature range, enabling reliable operation from -40℃ to +85℃.

TMM10i 50mil Rogers PCB


Features and Benefits:

The TMM10i PCB offers a range of features and benefits that make it stand out among other options in the market: 

Coefficient of thermal expansion matched to copper: The PCB's material is precisely engineered to match the coefficient of thermal expansion of copper, minimizing the risk of delamination and ensuring reliable performance under thermal stress.

Thickness range and mechanical properties: Available in a thickness range of .0015 to .500 inches (+/- .0015”), the TMM10i PCB offers flexibility in meeting specific design requirements. The material's mechanical properties resist creep and cold flow, ensuring dimensional stability over time.

Chemical resistance and fabrication: The TMM10imaterialPCB is resistant to process chemicals, reducing the risk of damage during fabrication and ensuring consistent performance. Unlike some materials, it does not require a sodium napthanate treatment prior to electroless plating, simplifying the manufacturing process. 

Reliable wire-bonding: Based on a thermoset resin, the TMM10i PCB allows for reliable wire-bonding, ensuring secure connections for critical components.


Construction Details:



Board dimensions

155.1mm x 168.12mm (12PCS), +/- 0.15mm

Minimum Trace/Space

5/5 mils

Minimum Hole Size


Blind vias


Finished board thickness


Finished Cu weight

1 oz (1.4 mils) outer layers

Via plating thickness

20 μm

Surface finish

Immersion Tin

Top Silkscreen


Bottom Silkscreen


Top Solder Mask


Bottom Solder Mask


100% Electrical test




PCB Statistics:

The TMM10i PCB exhibits the following statistics:

PCB Statistics




Total Pads


Thru Hole Pads


Top SMT Pads


Bottom SMT Pads






TMM10i 50mil PCB 


TMM10i PCB Thermal Properties:

The TMM10i 50mil PCB offers impressive thermal properties that contribute to its reliability and durability. With a coefficient of thermal expansion (CTE) matched to copper, it minimizes the risk of stress-induced failures and ensures reliable operation under temperature variations. The CTE values are 19 ppm/K in the X and Y directions and 20 ppm/K in the Z direction.


The PCB has a decomposition temperature (Td) of 425°C, indicating its ability to withstand high temperatures during assembly and operation. It also features a thermal conductivity of 0.76 W/m/K at 80°C, facilitating efficient heat dissipation in heat-sensitive applications.


TMM10i PCB Mechanical Properties:

The TMM10i 1.27mm substrate possesses robust mechanical properties that contribute to its structural integrity and long-term performance. It exhibits a flexural strength of 1.8 Mpsi (MD/CMD) and a flexural modulus of 1.8 Mpsi (MD/CMD), indicating its ability to withstand bending and mechanical stress.


TMM10i PCB Physical Properties:

The Rogers TMM10i laminate demonstrates favorable physical properties, including low moisture absorption and high insulation resistance. It has a moisture absorption rate of 0.16% for a 1.27mm (0.050") thickness and 0.13% for a 3.18mm (0.125") thickness, ensuring dimensional stability even in humid environments. The insulation resistance exceeds 2000 Gohm, providing excellent electrical insulation.


Artwork and Standards:

The 50mil TMM10 ihigh frequency PCB accepts Gerber RS-274-X artwork and conforms to the IPC-Class-2 standard, ensuring high quality and reliability.


Typical Applications:

The TMM10i 50mil PCB finds its application in a variety of industries and systems, including:

1.RF and microwave circuitry

2.Power amplifiers and combiners

3.Filters and couplers

4.Satellite communication systems

5.Global Positioning Systems Antennas

6.Patch Antennas

7.Dielectric polarizers and lenses

8.Chip testers


Trust the TMM10i PCB supplier to deliver exceptional performance and reliability in your high-frequency applications. Experience the benefits of advanced material composition, precise construction, and industry-leading specifications with our Rogers TMM10i PCB.

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