F4BTM298 High Frequency PCB 3.0mm Substrates RF PCB Board With Immersion Tin
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General description
This is a type of double sided high frequency PCB built on 3.0mm F4BTM298 substrate for the application ofPatch Antenna.
Basic specifications
Base material: F4BTM298
Dielectric constant: 2.98+/-0.06
Layer count: 2 layers
Type: Through holes
Format: 110mm x35mm = 1 type = 1 piece
Surface finish:Immersion tin
Copper weight: Outer layer 35 μm
Solder mask/Legend:No /No
Final PCB height: 3.1 mm
Standard: IPC 6012 Class 2
Packing: 20 pieces are packed for shipment.
Lead time: 7 working days
Shelf life: 6 months
Applications
Multiplexer, Acoustic Detection Sensors, Radio Frequency, RF Transceiver
F4BTM High Frequency Laminates
F4BTM series high frequency materials are made of glass fiber cloth, nano-ceramic filling and polytetrafluoroethylene resin after scientific preparation and strict process pressing.
This F4BTM series of products is based on the F4BM dielectric layer, and the materials are added with high-dielectric and low-loss nanoscale ceramics, thus obtaining higher dielectric constant, better heat resistance, lower coefficient of thermal expansion, higher insulation resistance, better thermal conductivity, while maintaining the characteristics of low loss.
Our PCB Capability (F4BTM)
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PCB Capability (F4BTM)
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PCB Material:
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PTFE / glass fiber cloth / Nano-ceramic filler
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Designation (F4BTM )
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F4BTM
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DK (10GHz)
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DF (10 GHz)
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F4BTM298
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2.98±0.06
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0.0018
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F4BTM300
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3.0±0.06
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0.0018
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F4BTM320
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3.2±0.06
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0.0020
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F4BTM350
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3.5±0.07
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0.0025
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Layer count:
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Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
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Copper weight:
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0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
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Dielectric thickness (or overall thickness)
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0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
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PCB size:
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≤400mm X 500mm
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Solder mask:
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Green, Black, Blue, Yellow, Red etc.
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Surface finish:
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Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..
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Data Sheet (F4BTM)
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Product Technical Parameters
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Product Models & Data Sheet
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Product Features
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Test Conditions
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Unit
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F4BTM298
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F4BTM300
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F4BTM320
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F4BTM350
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Dielectric Constant (Typical)
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10GHz
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/
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2.98
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3.0
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3.2
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3.5
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Dielectric Constant Tolerance
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/
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/
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±0.06
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±0.06
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±0.06
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±0.07
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Loss Tangent (Typical)
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10GHz
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/
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0.0018
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0.0018
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0.0020
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0.0025
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20GHz
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/
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0.0023
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0.0023
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0.0026
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0.0035
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Dielectric Constant Temperature Coefficient
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-55 º~150ºC
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PPM/℃
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-78
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-75
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-75
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-60
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Peel Strength
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1 OZ F4BTM
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N/mm
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>1.6
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>1.6
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>1.6
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>1.6
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1 OZ F4BTME
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N/mm
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>1.4
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>1.4
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>1.4
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>1.4
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Volume Resistivity
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Standard Condition
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MΩ.cm
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≥1×10^7
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≥1×10^7
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≥1×10^7
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≥1×10^7
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Surface Resistivity
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Standard Condition
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MΩ
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≥1×10^6
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≥1×10^6
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≥1×10^6
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≥1×10^6
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Electrical Strength (Z direction)
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5KW，500V/s
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KV/mm
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>26
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>30
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>32
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>32
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Breakdown Voltage (XY direction)
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5KW，500V/s
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KV
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>34
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>35
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>40
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>40
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Coefficientof Thermal Expansion
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XY direction
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-55 º~288ºC
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ppm/ºC
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15，16
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15，16
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13，15
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10，12
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Z direction
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-55 º~288ºC
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ppm/ºC
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78
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72
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58
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51
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Thermal Stress
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260℃, 10s，3 times
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No delamination
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No delamination
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No delamination
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No delamination
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Water Absorption
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20±2℃, 24 hours
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%
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≤0.05
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≤0.05
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≤0.05
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≤0.05
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Density
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Room Temperature
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g/cm3
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2.25
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2.25
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2.20
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2.20
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Long-Term Operating Temperature
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High-Low Temperature Chamber
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℃
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-55～+260
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-55～+260
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-55～+260
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-55～+260
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Thermal Conductivity
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Z direction
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W/(M.K)
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0.42
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0.42
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0.50
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0.54
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PIM
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Only applicable to F4BTME
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dBc
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≤-160
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≤-160
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≤-160
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≤-160
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Flammability
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/
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UL-94
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V-0
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V-0
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V-0
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V-0
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Material Composition
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/
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PTFE, Fiberglass Cloth, nano-ceramics
F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil.
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