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Home Newly Shipped RF PCB F4BTMS1000 PCB 2-layer 6.35mm Thick F4BTMS Series High Frequency Laminates

F4BTMS1000 PCB 2-layer 6.35mm Thick F4BTMS Series High Frequency Laminates

The F4BTMS 1000 substrate PCB is a state-of-the-art solution for industries that demand the highest levels of performance, reliability, and durability.


  • Item NO.:

    BIC-3021-v374.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail



F4BTMS1000 PCB 2-layer 6.35mm Thick F4BTMS Series High Frequency Laminates

 

The F4BTMS1000 PCB is a cutting-edge, high-reliability printed circuit board designed to meet the demanding requirements of advanced industries such as aerospace, military, and telecommunications. As part of the F4BTMS series PCB, this PCB represents a significant technological leap forward, offering superior material performance, enhanced thermal and electrical properties, and exceptional reliability. Whether you're developing aerospace equipment, radar systems, or satellite communication devices, the F4BTMS1000 PCB is engineered to deliver unmatched performance and durability.

 

Product Overview

The F4BTMS1000 PCB is a 2-layer rigid PCB constructed using the revolutionary F4BTMS1000 core material, which is enriched with advanced ceramics and ultra-thin, ultra-fine glass fiber cloth. This innovative material formulation ensures superior dielectric properties, thermal stability, and mechanical strength, making it an ideal choice for high-frequency and high-reliability applications. With a dielectric constant (Dk) of 10.2 at 10GHz and a low dissipation factor (Df) of 0.0020 at 10GHz, this PCB is optimized for high-speed signal transmission and minimal signal loss.

 

Key Features and Benefits

 

1. Advanced Material Composition

The F4BTMS1000 core material incorporates a unique blend of polytetrafluoroethylene (PTFE) resin, special nano-ceramics, and ultra-thin glass fiber cloth. This combination minimizes the negative effects of glass fiber on electromagnetic wave propagation, resulting in:

 

-Reduced dielectric loss

-Enhanced dimensional stability

-Improved thermal conductivity (0.81 W/mk)

-Low moisture absorption (0.03%)

 

2. Exceptional Electrical Performance


-Dielectric Constant (Dk): 10.2 at 10GHz

-Dissipation Factor (Df): 0.0020 at 10GHz, 0.0023 at 20GHz

-Low Thermal Coefficient of Dk: -320 ppm/°C (-55°C to 150°C)

 

These properties ensure stable signal integrity and minimal loss, even in high-frequency applications.

 

3. Superior Thermal and Mechanical Properties

 

Coefficient of Thermal Expansion (CTE):

-X-axis: 16 ppm/°C

-Y-axis: 18 ppm/°C

-Z-axis: 32 ppm/°C (-55°C to 288°C)

-Thermal Conductivity: 0.81 W/mk

-Low Moisture Absorption: 0.03%

 

These features make the F4BTMS1000 F4B Substrate PCB highly resistant to thermal stress and environmental degradation, ensuring long-term reliability.


F4BTMS1000 PCB

 

PCB Stackup:  2-layer rigid PCB

 

Copper_layer_1 - 35μm

F4BTMS1000 Core - 6.35 mm (250mil)

Copper_layer_2 - 35μm

 

PCB Construction details

 

Parameter

Details

Board dimensions

98mm x 98mm = 1 PCS, ±0.15mm

Minimum Trace/Space

6/6 mils

Minimum Hole Size

0.6mm

Blind vias

No

Finished board thickness

6.4mm

Finished Cu weight (outer layers)

1oz (1.4 mils)

Via plating thickness

20 μm

Surface finish

Bare copper

Top Silkscreen

No

Bottom Silkscreen

No

Top Solder Mask

No

Bottom Solder Mask

No

Electrical test

100% used prior to shipment

 

 

PCB Statistics

 

Statistic Item

Quantity

Components

28

Total Pads

58

Thru Hole Pads

27

Top SMT Pads

31

Bottom SMT Pads

0

Vias

35

Nets

2

 

 

Some Typical Applications

 

- Aerospace equipment, space and cabin equipment

- Microwave, RF

- Radar, military radar

- Feed networks

- Phase-sensitive antennas, phased array antennas

- Satellite communications, and more.

 

Why Choose the F4BTMS1000 PCB?


1. Unmatched Material Performance

The F4BTMS1000 core material sets a new standard for high-frequency PCBs, offering superior dielectric properties, thermal stability, and mechanical strength.

 

2. Reliability in Extreme Conditions

With its low CTE, high thermal conductivity, and low moisture absorption, the F4BTMS1000 PCB is built to withstand harsh environments, ensuring long-term reliability.

 

3. Optimized for High-Frequency Applications

The low dielectric loss and stable dielectric constant make this PCB ideal for high-speed signal transmission and high-frequency applications.

 

4. Global Availability and Compliance

The F4BTMS1000 PCB is available worldwide and complies with IPC-Class-2 quality standards, ensuring consistent performance and reliability.

 

Conclusion

The F4BTMS1000 substrate PCB is a state-of-the-art solution for industries that demand the highest levels of performance, reliability, and durability. Its advanced material composition, exceptional electrical and thermal properties, and robust construction make it the ideal choice for aerospace, military, and telecommunications applications. Whether you're designing cutting-edge radar systems or satellite communication devices, the F4BTMS1000 high frequency circuit board delivers the performance and reliability you need to succeed in today's competitive landscape.

 

For more information or to place an order, contact our sales team today. Let the F4BTMS1000 PCB power your next breakthrough innovation!




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Top 10 Sales of Rogers PCB




Major material Supplier



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