Wangling F4BTME350 10mil DK3.5 High Frequency Substrate PCB 2-Layer Immersion Gold
High-Frequency Product Description & CCL Material Reference
Executive Summary
The F4BTME350 2-layer immersion gold PCB is a high-frequency board built on a PTFE-based ceramic-filled laminate, offering Dk 3.5 ±0.07 at 10 GHz and Df 0.0025. At 0.3 mm finished thickness with 1 oz copper and immersion gold finish, it targets 4G/5G antennas, LNAs, phased arrays, satellite communications, and automotive radar where signal integrity and PIM performance are critical.
Part I: PCB Product Description
1. Product Overview
This DK3.5 F4B PCB is a precision 2-layer rigid board for RF and microwave applications. Its substrate combines PTFE resin, glass fiber cloth, and nano-ceramic fillers to achieve a controlled Dk of 3.5 with ultra-low loss. The 0.3 mm finished thickness suits compact high-density modules. Every unit is 100% electrically tested and manufactured to IPC-Class-2 standards.
2. PCB Construction Details
The table below summarizes the complete construction specifications.
|
Parameter
|
Specification
|
|
Base Material
|
F4BTME350
|
|
Layer Count
|
2 layers (rigid)
|
|
Board Dimensions
|
89.77 × 45.16 mm, ±0.15 mm
|
|
Min Trace / Space
|
6 / 8 mils
|
|
Min Hole Size
|
0.25 mm
|
|
Blind Vias
|
None
|
|
Finished Thickness
|
0.3 mm
|
|
Finished Cu Weight
|
1 oz (35 µm) outer layers
|
|
Via Plating
|
20 µm
|
|
Surface Finish
|
Immersion gold
|
|
Top Silkscreen
|
White
|
|
Bottom Silkscreen
|
None
|
|
Top Solder Mask
|
Black
|
|
Bottom Solder Mask
|
None
|
|
Electrical Test
|
100% prior to shipment
|
|
Quality Standard
|
IPC-Class-2
|
|
Artwork Format
|
Gerber RS-274-X
|
|
Availability
|
Worldwide
|
3. PCB Stackup
The symmetric 2-layer stackup uses copper outer layers and a single F4BTME350 core.
|
Layer
|
Material
|
Thickness
|
|
Cu Layer 1 (Top)
|
Copper
|
35 µm (1 oz)
|
|
Core
|
F4BTME350
|
0.254 mm (10 mil)
|
|
Cu Layer 2 (Bottom)
|
Copper
|
35 µm (1 oz)
|
4. PCB Statistics
The component and interconnect counts reflect a focused RF design.
|
Metric
|
Count
|
|
Components
|
12
|
|
Total Pads
|
38
|
|
Thru-Hole Pads
|
17
|
|
Top SMT Pads
|
21
|
|
Bottom SMT Pads
|
0
|
|
Vias
|
9
|
|
Nets
|
2
|
5. Key Performance Differentiators
· Dk 3.5 ±0.07 at 10 GHz enables tight 50-ohm impedance control.
· Df 0.0025 at 10 GHz / 0.0035 at 20 GHz minimizes insertion loss.
· CTE 10/12 ppm/°C (x/y), 51 ppm/°C (z) from -55 to 288°C ensures stability.
· PIM ≤ -160 dBc via reverse-treated RTF copper foil.
· Moisture absorption ≤0.05%; thermal conductivity 0.54 W/(m·K).
· UL-94 V-0; operating temperature -55 to +260°C.
6. Typical Applications
· 4G/5G base station antennas
· LNAs, LNBs/LNCs
· Phased array and phase-sensitive antennas
· Satellite communications, aerospace equipment
· Microwave/RF modules, radar (incl. automotive)
· High-power amplifiers, passive components
· PCS/PCN large-format antennas, feed networks
7. PCB Conclusion
The F4BTME350 ENIG PCB combines high-frequency electrical performance, mechanical stability, and manufacturing quality. Its PTFE ceramic-filled substrate, tight Dk tolerance, ultra-low loss, and PIM below -160 dBc suit demanding RF designs. Backed by IPC-Class-2 certification, 100% electrical testing, and worldwide availability, it offers a reliable platform for next-generation communication systems.
Part II: F4BTME350 CCL Material Knowledge
1. Material Introduction
The F4BTME350 copper clad laminate is part of the F4BTM/F4BTME series by Taizhou Wangling Insulation Materials Factory. It is formulated from glass fiber cloth, nano-ceramic fillers, and PTFE resin under strict pressing. Built on the F4BM dielectric layer, nano-ceramics enhance Dk, heat resistance, insulation, and thermal conductivity while preserving low loss.
2. F4BTM vs. F4BTME
Both share the same dielectric but use different copper foil. F4BTM pairs with ED copper foil for non-PIM applications. F4BTME pairs with reverse-treated RTF foil, delivering PIM ≤ -160 dBc, precise line control, and lower conductor loss — ideal for high-performance antenna and phase-sensitive systems.
3. Key Features
· Dk selectable 2.98–3.5 (F4BTME350 = 3.5)
· Nano-ceramic enhanced performance
· Excellent PIM (F4BTME: ≤ -160 dBc)
· Thickness 0.254–12.0 mm; multiple panel sizes
· High-volume, cost-effective production
· Radiation-resistant, low outgassing
4. Complete Technical Datasheet
The table below presents the full datasheet for Wangling F4BTME350.
|
Property
|
Test Condition
|
Unit
|
Value
|
|
Dk (typical)
|
10 GHz
|
—
|
3.5
|
|
Dk Tolerance
|
—
|
—
|
±0.07
|
|
Df (typical)
|
10 GHz
|
—
|
0.0025
|
|
Df (typical)
|
20 GHz
|
—
|
0.0035
|
|
Dk Temp Coefficient
|
-55 to 150°C
|
ppm/°C
|
-60
|
|
Peel Strength (F4BTM)
|
1 oz
|
N/mm
|
>1.6
|
|
Peel Strength (F4BTME)
|
1 oz
|
N/mm
|
>1.4
|
|
Volume Resistivity
|
Normal
|
MΩ·cm
|
≥10⁷
|
|
Surface Resistance
|
Normal
|
MΩ
|
≥10⁶
|
|
Elec. Strength (Z)
|
5 kW, 500 V/s
|
kV/mm
|
>32
|
|
Breakdown Voltage (XY)
|
5 kW, 500 V/s
|
kV
|
>40
|
|
CTE (XY)
|
-55 to 288°C
|
ppm/°C
|
10, 12
|
|
CTE (Z)
|
-55 to 288°C
|
ppm/°C
|
51
|
|
Thermal Stress
|
260°C, 10 s, 3x
|
—
|
No delamination
|
|
Moisture Absorption
|
20±2°C, 24 h
|
%
|
≤0.05
|
|
Density
|
Room temp
|
g/cm³
|
2.20
|
|
Long-Term Use Temp
|
Thermal chamber
|
°C
|
-55 to +260
|
|
Thermal Conductivity (Z)
|
—
|
W/(m·K)
|
0.54
|
|
PIM (F4BTME only)
|
—
|
dBc
|
≤-160
|
|
Flammability
|
—
|
UL-94
|
V-0
|
|
Composition
|
—
|
—
|
PTFE + glass fiber; ED or RTF foil
|
Test methods: Dk via GB/T 12636-1990 or IPC-TM-650 2.5.5.5 (Z-direction stripline); other properties per IPC-TM-650 or GB/T 4722-2017. Data are typical values.
5. Copper Foil Options
|
Series
|
Foil Type
|
Thicknesses
|
|
F4BTM
|
ED
|
0.5, 1, 1.5, 2 oz
|
|
F4BTME
|
Reverse RTF
|
0.5, 1 oz
|
6. Panel Sizes
|
Size (mm)
|
Note
|
|
460 × 610
|
Standard
|
|
600 × 500
|
Standard
|
|
914 × 1220
|
Not for thickness ≥ 4.0 mm
|
7. Thicknesses & Tolerances
|
Thickness (mm)
|
Tol. (mm)
|
Thickness (mm)
|
Tol. (mm)
|
|
0.254 (min)
|
±0.02
|
1.524
|
±0.06
|
|
0.508
|
±0.04
|
2.0
|
±0.075
|
|
0.762
|
±0.05
|
3.0
|
±0.09
|
|
0.8
|
±0.05
|
4.0
|
±0.1
|
|
1.0
|
±0.05
|
5.0
|
±0.1
|
|
1.016
|
±0.05
|
6.0
|
±0.12
|
|
1.27
|
±0.06
|
8.0
|
±0.15
|
|
|
|
10.0
|
±0.18
|
|
|
|
12.0
|
±0.2
|
8. Metal-Backed Variants (AL / CU)
Copper- or aluminum-backed versions offer enhanced shielding and heat dissipation. Naming: F4BTM(E)-AL or -CU.
|
Model
|
Base
|
Density
|
Thermal Cond.
|
Base Thickness (mm)
|
|
-CU
|
Copper
|
8.9 g/cm³
|
380 W/mK
|
0.48–3.98
|
|
-AL
|
Aluminum
|
2.7 g/cm³
|
180 W/mK
|
0.48–3.98
|
Base tolerance: +0.02/-0.05 mm. Sizes: 460×610, 460×305 mm.
9. Product Photo
Figure 1: F4BTME350 PTFE-based copper clad laminate
10. CCL Conclusion
The F4BTME350 substrate is a versatile PTFE-based laminate that underpins the PCB in Part I. Its nano-ceramic composition, reverse RTF foil, broad thickness and size options, and metal-backed variants give RF designers a flexible, reliable substrate. All properties are validated via IPC-TM-650 and GB/T methods, providing data confidence for high-frequency design across 4G/5G, satellite, aerospace, and automotive radar applications.
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