Rogers AD250C DK2.52 PTFE-based Composite Laminate 20mil 30mil 60mil
Product Overview & Core Advantages
AD250C laminate is a glass-reinforced, PTFE-based composite laminate from Rogers Corporation, tailored for the wireless antenna market. It integrates low-loss electrical performance, precisely controlled dielectric constant, ultra-low passive intermodulation (PIM) and excellent dimensional stability, making it a superior choice for high-reliability antenna PCB fabrication.
Its core performance advantages are reflected in the following aspects:
-
1)Ultra-low loss tangent (0.0013 at 10 GHz), delivering outstanding circuit performance across all common wireless frequency bands.
-
2)Tightly controlled dielectric constant (±0.05 tolerance), ensuring highly repeatable circuit performance in mass production.
-
3)Exceptionally low PIM value (-159/-163 dBc at 30 mil, 1900 MHz), optimizing antenna performance and reducing production yield loss caused by PIM-related issues.
-
4)Excellent dimensional stability, which not only guarantees consistent circuit performance but also improves the yield of PCB manufacturing processes.
-
5)As aPTFE-based material, it features ultra-low moisture absorption (<0.1%, typical value 0.04%), high copper peel strength (>10 pli, typical value 14.8 lbs/in) and high thermal stability, adapting to various harsh application environments.
-
6)Compatible with standard electrodeposited (ED) and reverse treated ED copper foil claddings, providing flexible material matching options to reduce circuit loss and optimize antenna PIM performance.
Typical Application Scenarios
Rogers AD250C is designed for high-performance antenna systems, and its typical application fields include:
-
Cellular infrastructure base station antennas
-
Automotive telematics antenna systems
-
Commercial satellite radio antennas
Standard Offerings of AD250C
AD250C substrate provides standardized thickness specifications, panel sizes and copper foil claddings to meet the diversified needs of PCB manufacturing. Custom configurations are available upon request (contact our sales team for details).
|
Thickness (inch)
|
Thickness (mm)
|
Tolerance (inch)
|
|
0.020”
|
0.508
|
±0.002”
|
|
0.030”
|
0.762
|
±0.002”
|
|
0.060”
|
1.524
|
±0.003”
|
Standard Panel Sizes
-
0.020”thickness: 18”×12”(457mm×305mm) / 18”×24”(457mm×610mm)
-
All other thicknesses: 12”×18”(305mm×457mm) / 24”×18”(610mm×457mm)
Standard Copper Claddings
-
Electrodeposited (ED) Copper Foil:½oz. (18µm) / 1oz. (35µm)
-
Reverse Treated ED Copper Foil:½oz. (18µm) / 1oz. (35µm)
Standard Performance Parameters of AD250C™
|
Property
|
Typical Value
|
Units
|
Test Conditions
|
Test Method
|
|
Electrical Properties
|
|
Dielectric Constant (process)
|
2.52
|
–
|
10 GHz, 23°C, 50% RH
|
IPC TM-650 2.5.5.5
|
|
Dielectric Constant (design)
|
2.5
|
–
|
C-24/23/50, 10 GHz
|
Microstrip Differential Phase Length
|
|
Dissipation Factor
|
0.0013
|
–
|
10 GHz, 23°C, 50% RH
|
IPC TM-650 2.5.5.5
|
|
Thermal Coefficient of εr
|
-117
|
ppm/°C
|
0–100°C, 10 GHz
|
IPC TM-650 2.5.5.5
|
|
Volume Resistivity
|
4.8 × 10⁸
|
MΩ·cm
|
C96/35/90
|
IPC TM-650 2.5.17.1
|
|
Surface Resistivity
|
4.1 × 10⁷
|
MΩ
|
C96/35/90
|
IPC TM-650 2.5.17.1
|
|
Electrical Strength
|
979
|
V/mil
|
–
|
IPC TM-650 2.5.6.2
|
|
Dielectric Breakdown
|
>40
|
kV
|
D-48/50, X/Y Direction
|
IPC TM-650 2.5.6
|
|
PIM²
|
0.975460123
|
dBc
|
43 dBm swept tones, 1900 MHz, S1
|
Rogers Internal 50 ohm Test Method
|
|
Thermal Properties
|
|
Decomposition Temperature (Td)
|
>500
|
°C
|
105°C, 2hrs, 5% Weight Loss
|
IPC TM-650 2.3.40
|
|
Coefficient of Thermal Expansion - X
|
47
|
ppm/°C
|
-55°C to 288°C
|
IPC TM-650 2.4.41
|
|
Coefficient of Thermal Expansion - Y
|
29
|
ppm/°C
|
-55°C to 288°C
|
IPC TM-650 2.4.41
|
|
Coefficient of Thermal Expansion - Z
|
196
|
ppm/°C
|
-55°C to 288°C
|
IPC TM-650 2.4.41
|
|
Thermal Conductivity
|
0.33
|
W/(m·K)
|
Z-direction
|
ASTM D5470
|
|
Time to Delamination
|
>60
|
minutes
|
288°C, as-received
|
IPC TM-650 2.4.24.1
|
|
Mechanical Properties
|
|
Copper Peel Strength
|
2.6 (14.8)
|
N/mm (lbs/in)
|
288°C, 10s, 35 μm foil
|
IPC TM-650 2.4.8
|
|
Flexural Strength (MD/CMD)
|
60.7 / 44.1 (8.8/6.4)
|
MPa (ksi)
|
25°C ± 3°C
|
ASTM D790
|
|
Tensile Strength (MD/CMD)
|
41.4 / 38.6 (6.0/5.6)
|
MPa (ksi)
|
23°C, 50% RH
|
ASTM D3039/D3039-14
|
|
Flexural Modulus (MD/CMD)
|
6,102 / 5,364 (885/778)
|
MPa (ksi)
|
25°C ± 3°C
|
IPC-TM-650 2.4.4
|
|
Dimensional Stability (MD/CMD)
|
0.02 / 0.06
|
mils/inch
|
after etch + bake
|
IPC-TM-650 2.4.39a
|
|
Physical Properties
|
|
Flammability
|
V-0
|
–
|
–
|
UL 94
|
|
Moisture Absorption
|
0.04
|
%
|
E1/105 + D48/50
|
IPC TM-650 2.6.2.1
|
|
Density
|
2.28
|
g/cm³
|
C24/23/50
|
ASTM D792
|
|
Specific Heat Capacity
|
0.813
|
J/g·K
|
2 hours at 105°C
|
ASTM E2716
|
Note
Rogers Corporation recommends evaluating the matching of AD250C material with specific PCB designs to verify the fitness for use throughout the entire service life of the end product. Our technical team can provide professional matching testing and design optimization suggestions for customers.
BICHENG PCB CERTIFICATE:
Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
