Rogers AD255C AD Series Antenna DK2.55 High Frequency Laminate
AD255C is a precision-engineered, glass-reinforced PTFE composite from Rogers Corporation's AD Series Antenna Materials portfolio. This Rogers material is formulated to deliver exceptional electrical performance combined with mechanical robustness, making it an ideal substrate for advanced wireless antenna systems, base station antennas, and RF communication infrastructure.
The unique formulation of Rogers AD255C provides a balanced dielectric constant ofDK2.55 laminate, offering designers flexibility in impedance matching and circuit miniaturization. Its woven glass reinforcement structure ensures excellent dimensional stability during fabrication while maintaining the low-loss characteristics inherent toPTFE-based materials.
Key Features:
Optimized Dielectric Constant (2.55): Provides design flexibility for various antenna architectures
Superior PIM Performance: Engineered to minimize passive intermodulation distortion in multi-band antenna systems
Excellent Thermal Stability: Reliable performance across wide temperature ranges encountered in outdoor antenna installations
Low Moisture Absorption (<0.1%): Ensures consistent electrical performance in humid environments
High Copper Peel Strength (>13 lbs/in): Reliable for multilayer constructions and repeated thermal cycling
Multiple Copper Options: Available with standard ED copper or reverse treated ED copper for optimized loss and PIM performance
Typical Applications:
AD255C high frequency laminate is specially designed for antenna systems that require medium dielectric constant and high signal transmission efficiency, and its main application fields cover:
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Base station antennas (multi-band and MIMO)
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GPS and satellite communication antennas
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Automotive telematics and antenna modules
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RF identification (RFID) systems
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Beamforming networks and power dividers
AD255C Properties Table
|
Electrical Properties
|
AD255C
|
Units
|
Test Conditions
|
Test Method
|
|
PIM (30mil/60mil)
|
-159/-163
|
dBc
|
Reflected 43 dBm swept tones at 1900 MHz, S1/S1
|
Rogers Internal 50 ohm
|
|
Dielectric Constant (process)
|
2.55
|
-
|
23°C @ 50% RH
|
10 GHz
|
IPC TM-650 2.5.5.5
(IPC TM-650 2.5.5.3)
|
|
Dielectric Constant (design)
|
2.60
|
-
|
C-24/23/50
|
10 GHz
|
Microstrip Differential Phase Length
|
|
Dissipation Factor (process)
|
0.0013
|
-
|
23°C @ 50% RH
|
10 GHz
|
IPC TM-650 2.5.5.5
|
|
Thermal Coefficient of Dielectric Constant
|
-110
|
ppm/ºC
|
0°C to 100°C
|
10 GHz
|
IPC TM-650 2.5.5.5
|
|
Volume Resistivity
|
7.4 x 108
|
Mohm-cm
|
C-96/35/90
|
-
|
IPC TM-650 2.5.17.1
|
|
Surface Resistivity
|
3.6 x 107
|
Mohm
|
C-96/35/90
|
-
|
IPC TM-650 2.5.17.1
|
|
Electrical Strength (dielectric strength)
|
911
|
V/mil
|
-
|
-
|
IPC TM-650 2.5.6.2
|
|
Dielectric Breakdown
|
>40
|
kV
|
D-48/50
|
X/Y direction
|
IPC TM-650 2.5.6
|
|
Thermal Properties
|
|
Decomposition Temperature (Td)
|
>500
|
˚C
|
2hrs @ 105˚C
|
5% Weight Loss
|
IPC TM-650 2.3.40
|
|
Coefficient of Thermal Expansion - x
|
34
|
ppm/˚C
|
-
|
-55˚C to 288˚C
|
IPC TM-650 2.4.41
|
|
Coefficient of Thermal Expansion - y
|
26
|
ppm/˚C
|
-
|
-55˚C to 288˚C
|
IPC TM-650 2.4.41
|
|
Coefficient of Thermal Expansion - z
|
196
|
ppm/˚C
|
-
|
-55˚C to 288˚C
|
IPC TM-650 2.4.41
|
|
Thermal Conductivity
|
0.35
|
W/mK
|
-
|
z direction
|
ASTM D5470
|
|
Time to Delamination
|
>60
|
minutes
|
as-received
|
288˚C
|
IPC TM-650 2.4.24.1
|
|
Mechanical Properties
|
|
Copper Peel Strength after Thermal Stress
|
2.4
(13.6)
|
N/mm (lbs/in)
|
10s @288˚C
|
35 μm foil
|
IPC TM-650 2.4.8
|
|
Flexural Strength (MD/CMD)
|
8.8/6.4 (60.7/44.1)
|
MPa (ksi )
|
25°C ± 3°C
|
-
|
ASTM D790
|
|
Tensile Strength (MD/CMD)
|
8.1/6.6 (55.8/45.5)
|
MPa (ksi )
|
23°C/50% RH
|
-
|
ASTM D3039/D3039-14
|
|
Flex Modulus (MD/CMD)
|
930/818 (6,412/5,640)
|
MPa (ksi )
|
25°C ± 3°C
|
-
|
IPC-TM-650 Test Method 2.4.4
|
|
Dimensional Stability (MD/CMD)
|
0.03/0.07
|
mils/inch
|
after etch + bake
|
-
|
IPC-TM-650 2.4.39a
|
|
Physical Properties
|
|
Flammability
|
V-0
|
-
|
-
|
-
|
UL-94
|
|
Moisture Absorption
|
0.03
|
%
|
E1/105 +D48/50
|
-
|
IPC TM-650 2.6.2.1
|
|
Density
|
2.28
|
g/cm3
|
C-24/23/50
|
-
|
ASTM D792
|
|
Specific Heat Capacity
|
0.813
|
J/g°K
|
2 hours at 105°C
|
-
|
ASTM E2716
|
Standard Product Offerings
AD255C copper clad laminate provides a full range of standardized thickness specifications and panel sizes, and supports customized configurations (contact our sales and technical team for personalized needs). All products are matched with mainstream copper foil cladding options to meet the diversified manufacturing needs of PCB factories.
Standard Thicknesses (with tolerance)
Nominal Thickness (inch) Actual Thickness (mm) Tolerance (inch)
|
Nominal Thickness (inch)
|
Actual Thickness (mm)
|
Tolerance (inch)
|
|
0.020”
|
0.508
|
±0.002”
|
|
0.030”
|
0.762
|
±0.002”
|
|
0.040”
|
1.016
|
±0.002”
|
|
0.060”
|
1.524
|
±0.002”
|
|
0.125”
|
3.175
|
±0.006”
|
Standard Panel Sizes
Unified standard sizes for all thicknesses:
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12”×18”(305mm×457mm)
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24”×18”(610mm×457mm)
Standard Copper Claddings
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Electrodeposited (ED) Copper Foil:½oz. (18µm) / 1oz. (35µm)
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Reverse Treated Electrodeposited Copper Foil:½oz. (18µm) / 1oz. (35µm)
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