Wangling F4BM245 DK2.45 F4BM Series PTFE Glass Fiber Cloth Copper Clad Laminate

Wangling F4BM245 DK2.45 F4BM Series PTFE Glass Fiber Cloth Copper Clad Laminate

Product Brief

Wangling F4BM245 is a high-performance PTFE glass fiber cloth copper clad laminate independently developed and produced by Taizhou Wangling Insulation Material Factory. It is precision pressed by scientific proportioning of high-purity polytetrafluoroethylene (PTFE) resin, PTFE film and high-quality glass fiber cloth, with ED copper foil as the conductive cladding layer.

This F4BM245 material optimizes the ratio of PTFE and glass fiber cloth on the basis of traditional F4B series laminate products, which not only realizes the precise control of dielectric constant at 2.45 (10GHz), but also significantly improves the overall electrical and mechanical properties. It features low dielectric loss, high insulation resistance, excellent dimensional stability and low thermal expansion coefficient, and can perfectly replace imported similar products with higher cost performance.

F4BM245 substrate is specially designed for RF/microwave applications without PIM index requirements. Its stable electrical performance in a wide temperature range (-55℃~260℃) and excellent thermal stress resistance make it an ideal core material for manufacturing high-frequency passive components and RF transmission systems, and is widely used in the field of communication and radar equipment manufacturing.

Core Features

1)Fixed dielectric constant (typical value) of 2.45 at 10GHz with a tight tolerance of±0.05, ensuring stable signal transmission

2)Ultra-low loss factor, only 0.0012 at 10GHz and 0.0017 at 20GHz, reducing signal attenuation

High peel strength (>1.8N/mm for 1OZ copper foil), ensuring reliable combination of copper foil and medium layer

3)Excellent temperature stability of dielectric constant, temperature coefficient is -120PPM/℃(-55℃~150℃)

4)Superior electrical insulation performance, volume resistivity≥6×10⁶MΩ.cm, surface resistivity≥1×10⁶MΩ

5)Good thermal and mechanical properties, no delamination after 3 times of thermal stress test at 260℃for 10s

6)UL-94 V-0 flame retardant grade, low water absorption (≤0.08%) and anti-radiation performance

Commercial mass production, diversified size customization, high cost performance and short delivery cycle

Typical Application Fields

• Microwave, RF and radar system core components
• Passive devices such as phase shifters and filters
• Power dividers, couplers and combiners
• RF feed network and antenna transmission module
• Base station communication equipment high-frequency board

F4BM245 Technical Parameters

Test Standard Note

• The dielectric constant (typical value) is tested for the Z direction of the material, in accordance with GB/T 12636-1990 or IPC-TM650 2.5.5.5 strip line method;
• Other performance tests are carried out in accordance with or with reference to the test methods specified in IPC-TM-650 or GBT4722-2017;
• All test data are typical measured values, only for customer material selection reference, not for explicit or implicit warranty.

Copper Foil Specification

F4BM245 high frequency laminate is matched with ED copper foil, and the optional thicknesses are as follows (the thickness is the standard copper foil thickness for cladding):

Available Size & Thickness

1. Conventional Plate Size

Can be supplied in standard sizes, support non-standard customization (contact the factory for special requirements):

• 460×610mm
• 500×600mm
• 850×1200mm
• 914×1220mm
• 1000×1200mm

 Note: When the total thickness (including copper) or medium thickness is≥4.0mm or≤0.2mm, the maximum plate size cannot exceed 500×610mm.

2. Thickness & Tolerance (Support medium thickness/copper-clad total thickness customization)

Please indicate the thickness type (medium thickness/copper-clad total thickness) when placing an order. The conventional thickness and tolerance are as follows:

 Special Note: The minimum available medium thickness of F4BM245 is 0.1mm (since the dielectric constant≤2.65), which can meet the thin-layer design requirements of high-frequency PCB.

Customized Derivatives

F4BM245 Wangling DK2.45 laminate supports the customization of aluminum-based/copper-based composite plates (F4BM245-AL/F4BM245-CU), with the medium layer covered with copper foil on one side and aluminum/copper base on the other side, which can realize the functions of electromagnetic shielding and high-efficiency heat dissipation, and is suitable for high-power RF PCB design.