15mil TMM10i 0.381 mm Double-Sided Pure Gold Plating Bare Copper Rogers PCB

15mil TMM10i 0.381 mm Double-Sided Pure Gold Plating Bare Copper Rogers PCB

This high‑performance double sided rigid printed circuit board is engineered for demanding radio‑frequency, microwave, and high‑reliability electronic systems. Built on Rogers TMM10i ceramic‑loaded thermoset dielectric material and finished withnickel-free pure gold plating, it delivers exceptional electrical stability, mechanical robustness, and long‑term performance in mission‑critical environments. Every board is manufactured to IPC‑Class‑2 standards, fully electrically tested, and supported by global supply availability, making it ideal for aerospace, satellite communications, RF antennas, and high‑frequency instrumentation.

PCB Construction Details

This table summarizes the Rogers board’s structural, dimensional, and surface‑finish specifications for precision manufacturing and assembly.

PCB Stackup

This table defines the layer composition and thickness of this 2-layer TMM10i high frequency PCB.

PCB Statistics

This table shows the 15 mil TMM10i board’s design density, pad types, via count, and electrical interconnection structure.

Core Material Introduction: Rogers TMM10i

Rogers TMM10i is an isotropicthermoset microwave composite material made from ceramic‑filled thermoset polymer. It is specially formulated for high‑reliability plated through‑hole performance in stripline and microstrip circuit designs. Featuring a stable isotropic dielectric constant, TMM10i substrate integrates the advantages of ceramic and PTFE‑based substrates while supporting standard soft‑substrate fabrication processes. This balance of electrical performance and manufacturability makes it a leading choice for high‑frequency applications.

Key Electrical & Mechanical Features

• Dielectric Constant (Dk): 9.80±0.245
• Dissipation Factor: 0.0020 at 10GHz
• Thermal Coefficient of Dk:–43 ppm/°K
• CTE matched to copper for enhanced thermal reliability
• Decomposition Temperature (Td): 425°C (TGA)
• CTE (x/y/z): 19 ppm/K, 19 ppm/K, 20 ppm/K
• Thermal Conductivity: 0.76 W/m·K
• Thickness range: 0.0015 to 0.500 inches with±0.0015”tolerance

Performance Benefits

TMM10i high frequency PCB provides multiple advantages for industrial and aerospace‑grade production:

• Excellent mechanical stability resisting creep and cold flow
• High resistance to processing chemicals, minimizing damage during fabrication
• No sodium naphthenate treatment required before electroless plating
• Thermoset resin base enables reliable wire‑bonding
• Consistent performance in repeated thermal cycles and harsh operating conditions

Typical Applications

This RogersTMM10i PCB is purpose‑built for high‑frequency and high‑reliability systems, including:

• RF and microwave circuits
• Power amplifiers and signal combiners
• RF filters and couplers
• Satellite communication systems
• GPS antennas
• Patch antennas
• Dielectric polarizers and lenses
• High‑performance chip test fixtures

Quality & Availability

Artwork is accepted in Gerber RS‑274‑X format. The board is built in compliance with IPC‑Class‑2 standards and undergoes 100% electrical testing before delivery to ensure functional integrity and yield. With worldwide availability, this TMM10i pure gold PCB supports rapid prototyping and volume production for customers across global markets.