15mil TMM4 PCB 2-layer Rogers Immersion Gold Bare Copper Custom Board

15mil TMM4 PCB 2-layer Rogers Immersion Gold Bare Copper Custom Board

The 15mil TMM4 2-Layer Immersion Gold PCB is not just a circuit board—it is a precision-engineered solution tailored to solve the core pain points of microwave and RF applications: unstable signal transmission, poor environmental adaptability, and high manufacturing costs. By integrating Rogers’ flagshipTMM4 thermoset material with strict IPC-Class-2 quality control and optimized 2-layer design, we deliver a product that balances performance, reliability, and cost-effectiveness, trusted by global partners in aerospace, telecom, and precision testing. Below is a comprehensive breakdown of its core specifications, material advantages, and practical value, with key structural data organized in tables for quick reference.

PCB Construction Details

Every construction parameter of this TMM4 PCB is determined through rigorous engineering verification, focusing on dimensional accuracy, connectivity stability, and compatibility with high-frequency scenarios. The key construction specifications are summarized in the following table.

PCB Stackup

The 2-layer stackup is the core of signal integrity. We adopt a 15 mil TMM4 core as the middle layer, matched with uniform copper layers on both sides to ensure consistent dielectric performance and thermal compatibility. The detailed stackup composition is shown below.

PCB Statistics

From a management perspective, we focus on both product performance and manufacturing efficiency. The following table summarizes the key statistical data of the Rogers TMM4 PCB, which is designed to adapt to standard assembly processes and reduce production costs.

Core Competitiveness: TMM4 Material & Performance Advantages

As the core material, Rogers TMM4 is a ceramic-hydrocarbon thermoset composite designed for high PTH reliability in strip-line and micro-strip applications. It integrates the mechanical strength of ceramic and the processability of traditional PTFE, avoiding the need for specialized production techniques. Its thermoset resin base ensures reliable wire-bonding without pad lifting or substrate deformation.

Key features include Dk 4.50 +/- 0.045, dissipation factor 0.0020 at 10GHz, CTE 16ppm/°K (x/y) and 21ppm/°K (z), 425°C Td, 0.7 W/mk thermal conductivity, and 0.07%-0.18% moisture absorption—ensuring stable performance in extreme environments.

These advantages translate to practical value for clients: creep and cold flow resistance ensures dimensional stability; process chemical resistance reduces fabrication damage; compatibility with common PWB processes lowers production costs; and high PTH reliability minimizes after-sales risks. The immersion gold finish further enhances solderability and corrosion resistance.

Typical Applications

This TMM4 high frequency PCB is ideally suited for:

• RF and Microwave Circuits
• Power Amplifiers and Combiners
• Filters and Couplers
• Satellite Communication Systems
• Global Positioning System (GPS) Antennas
• Patch Antenna Arrays
• Dielectric Polarizers and Lenses
• Chip and Component Test Fixtures

In summary, this 15 mil TMM4 2-Layer PCB is more than a component—it is a cost-effective, high-reliability solution engineered to meet the evolving needs of high-frequency applications. Backed by strict quality control and global availability, it represents our dedication to delivering superior PCB products that drive client success.