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Home Rogers PCB Board 60 mil Rogers 3203 High Frequency PCB Double Sided RF Circuit Board

60 mil Rogers 3203 High Frequency PCB Double Sided RF Circuit Board

RO3203 High Frequency Circuit Materials of Rogers Corporation are ceramic-filled laminates reinforced with woven fiberglass.

  • Item NO.:

    BIC-124-v179.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Rogers 3203 PCB RO3203 High Frequency PCB Double Sided RF Circuit Board For Base Station Infrastructure

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


This material is engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The dielectric constant of RO3203 High Frequency Circuit Materials is 3.02. This, along with a dissipation factor of 0.0016, extends the useful frequency range beyond 40 GHz.

Ceramic-filled laminates like the Rogers RO3203 offer enhanced and superior mechanical qualities. One of the laminates of the ro3003 family, it is intended for high-frequency uses. RO3203 is a woven glass cloth-reinforced circuit material.

This ceramic-filled circuit material has ISO 9002 certification, making it a dependable product that satisfies the requirements and standards of designers. This laminate was created primarily to provide a broad frequency range. There are various features and advantages of using this Rogers PCB material.

The PTFE substrates used to create these laminates are strengthened with woven glass. To provide greater mechanical qualities, RO3203 laminates are an enhanced version of RO3003 laminates. As a result, it shares RO3003's electrical and mechanical characteristics.



Feature of RO3203:

The distinctive features of the Rogers RO3203 set it apart from the RO3000 series. Among its attributes are:


Low coefficient of thermal expansion: The RO3203 material has a 13 ppm/°C coefficient of thermal expansion in both the X and Y axes. It is perfect for use in the creation of multilayer epoxy fiberglass hybrid boards because of its feature.


Low dimensional stability: The ro3203's dimensional stability is 0.8 mm/m. It is thought that this dimensional stability is very low. No of the environmental circumstances, this material can keep its size.


Excellent dielectric constant: This material's dielectric constant is 3.02. For a substance like Rogers 3203, this value is regarded as optimum. Low dielectric constant materials assist reduce electrical power loss, making them perfect for high-frequency applications.


Lower moisture absorption: Materials made of RO3203 have a moisture absorption of 0.1%. Extremely little moisture will absorb at this level, which is ideal for designers. The thermal and electrical characteristics of the material will be hardly affected by low moisture absorption.



Rogers RO3203 60mil PCB


Typical Applications:

1. Automotive Collision Avoidance Systems

2. Automotive Global Positioning Satellite Antennas

3. Base Station Infrastructure

4. Datalink on Cable Systems

5. Direct Broadcast Satellites

6. LMDS and Wireless Broadband

7. Microstrip Patch Antennas

8. Power Backplanes

9. Remote Meter Readers

10. Wireless Telecommunications Systems


PCB Capability (RO3203)

PCB Capability (RO3203) 
PCB Material: Ceramic-filled Laminates Reinforced with Woven Fiberglass
Designation: RO3203
Dielectric constant: 3.02±0.04
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..


Data Sheet of RO3203:

RO3203 Typical Value
Property RO3203 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.02±0.04 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Dissipation Factor,tanδ 0.0016 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Conductivity 0.47 (3.2) W/mK Float 100℃ ASTM C518
Volume Resistivity 107 MΩ.cm A ASTM D257
Surface Resistivity 107 A ASTM D257
Dimensional Stability 0.08 X, Y mm/m +E2/150 after etch IPC-TM-650  2.4.3.9
Tensile Modulus X                 Y kpsi RT ASTM D638
Flexural Modulus 400                 300 X                 Y kpsi A ASTM D790
Tensile Strength 12.5                   13 X                 Y kpsi RT ASTM D638
Flexural Strength 9                            8 X                 Y kpsi A ASTM D790
Moisure Absorption <0.1 % D24/23 IPC-TM-650 2.6.2.1
Coefficient of Thermal Expansion
58                     13 Z                            X,Y                  ppm/℃ -50℃to 288℃ ASTM D3386
Td 500 TGA ASTM D3850
Density 2.1 gm/cm3 23℃ ASTM D792
Copper Peel Stength 10 (1.74) lbs/in (N/mm) After solder IPC-TM-650 2.4.8
Flammability V-0 UL 94
Lead-Free Process Compatible Yes


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