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Home Newly Shipped RF PCB F4BTMS220 PCB 2-layer 250mil 6.35mm Thick With Via Plating F4BTMS Series High Frequency Substrate

F4BTMS220 PCB 2-layer 250mil 6.35mm Thick With Via Plating F4BTMS Series High Frequency Substrate

The F4BTMS220 PCB is high-frequency and high-reliability printed circuit board. Its advanced material composition, exceptional electrical performance, and robust thermal properties make it the ideal choice for aerospace, microwave, RF, and military applications.

  • Item NO.:

    BIC-309-v385.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


F4BTMS220 PCB 2-layer 250mil 6.35mm Thick With Via Plating F4BTMS Series High Frequency Substrate

 

The F4BTMS220 PCB is a cutting-edge, high-reliability printed circuit board designed to meet the demanding requirements of advanced aerospace, microwave, RF, and military applications. As part of the F4BTMS series PCB, this F4B PCB represents a significant technological leap forward, combining innovative material formulations and state-of-the-art manufacturing processes to deliver unparalleled performance. Whether you're developing aerospace equipment, radar systems, or satellite communication devices, the F4BTMS220 250mil substrate PCB is engineered to exceed expectations and replace similar foreign products with superior quality and reliability.

 

Key Features of the F4BTMS220 PCB

1. Advanced Material Composition

The F4BTMS220 PTFE PCB is crafted using a unique blend of polytetrafluoroethylene (PTFE) resin, ultra-thin glass fiber cloth, and special nano-ceramics. This combination minimizes the negative effects of glass fiber on electromagnetic wave propagation, resulting in reduced dielectric loss, enhanced dimensional stability, and improved thermal conductivity. The material's low thermal expansion coefficient and stable dielectric temperature characteristics make it ideal for high-frequency and high-temperature environments.

 

2. Exceptional Electrical Performance

Dielectric Constant (Dk): 2.2 at 10GHz

Dissipation Factor (Df): 0.0009 at 10GHz, 0.0010 at 20GHz

Low Thermal Coefficient of Dk: -130 ppm/°C (-55°C to 150°C)

 

These properties ensure minimal signal loss and superior signal integrity, making the F4BTMS220 high frequency PCB perfect for high-frequency applications such as radar, microwave systems, and phased array antennas.

 

3. Robust Thermal and Mechanical Properties

CTE (Coefficient of Thermal Expansion):

X-axis: 40 ppm/°C

Y-axis: 50 ppm/°C

Z-axis: 290 ppm/°C (-55°C to 288°C)

UL-94 V0 Flame Retardant Rating

Low Moisture Absorption: 0.02%

 

These features ensure the Low dielectric constant PCB can withstand extreme temperatures, thermal cycling, and harsh environmental conditions, making it suitable for aerospace and military applications.

 

F4BTMS220 PCB 250mil Thick

 

PCB Stackup: 2-layer rigid PCB

Copper Layer 1: 35μm

F4BTMS220 Core: 6.35 mm (250 mil)

Copper Layer 2: 35μm

 

PCB Construction details

 

Parameter

Details

Board Dimensions

75mm x 75mm = 1PCS, +/- 0.15mm

Minimum Trace/Space

5/9 mils

Minimum Hole Size

0.6mm

Blind Vias

No

Finished Board Thickness

6.4mm

Finished Cu Weight

1oz (1.4 mils) outer layers

Via Plating Thickness

20 um

Surface Finish

Pure gold

Top Silkscreen

No

Bottom Silkscreen

No

Top Solder Mask

No

Bottom Solder Mask

No

Electrical Testing

100% Electrical test prior to shipment

 

 

PCB Statistics

 

Parameter

Details

Components

8

Total Pads

20

Thru Hole Pads

12

Top SMT Pads

8

Bottom SMT Pads

0

Vias

23

Nets

2

 

 

Applications of the F4BTMS220 PCB

The F4BTMS220 F4B material PCB is designed for high-performance applications where reliability, signal integrity, and thermal stability are critical. Some of its typical applications include:

 

- Aerospace equipment, space and cabin equipment

- Microwave, RF

- Radar, military radar

- Feed networks

- Phase-sensitive antennas, phased array antennas

- Satellite communications

 

 

Why Choose the F4BTMS220 PCB?

1.Technological Superiority

TheF4BTMS220via platingPCB leverages advanced material science and manufacturing techniques to deliver unmatched performance. Its ceramic-filled PTFE resin and ultra-thin glass fiber cloth ensure minimal dielectric loss and exceptional thermal stability.

 

2.Global Availability

The F4BTMS220 PCB is available worldwide, making it accessible to engineers and manufacturers across the globe.

 

3.Cost-Effective Alternative

With its ability to replace similar foreign products, the F4BTMS220 PCB offers a cost-effective solution without compromising on quality or performance.

 

4.Customizable and Scalable

While the F4BTMS220 PCB is available in a standard 2-layer configuration, its design can be customized to meet specific application requirements.

 

Conclusion

The F4BTMS220 PCB is high-frequency and high-reliability printed circuit board. Its advanced material composition, exceptional electrical performance, and robust thermal properties make it the ideal choice for aerospace, microwave, RF, and military applications. Whether you're designing cutting-edge radar systems, satellite communication devices, or phased array antennas, the F4BTMS220 250mil PCB delivers the performance, reliability, and durability you need to succeed.

 

Upgrade to the F4BTMS220 DK2.2 PCB today and experience the future of high-performance PCBs!





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