M6 High Speed Low Loss 16-Layer PCB 2.0mm Thick Megtron6 R-5775 Multilayer Board
In the rapidly evolving world of electronics, where speed, reliability, and performance are paramount, the M6 High-Speed PCB stands out as a cutting-edge solution for high-frequency and high-speed applications. Built using Panasonic Megtron6 (M6) R-5775 laminate, this Low Loss PCB is engineered to meet the demanding requirements of modern technologies such as 5G communication, millimeter-wave radar, high-speed servers, and high-performance computing (HPC). With its exceptional electrical, thermal, and mechanical properties, the M6 High-Speed PCB is the ideal choice for industries pushing the boundaries of innovation.
Key Features of M6 High-Speed PCB
1.Low Dielectric Loss and Stable Dielectric Constant
The Panasonic Megtron6 laminate boasts a dielectric constant (Dk) of 3.4 at 1GHz/23°C and 3.34 at 13GHz, ensuring consistent signal integrity across a wide frequency range. Its dissipation factor (Df) is an ultra-low 0.002 at 1GHz/23°C and 0.0037 at 13GHz, minimizing signal loss and enabling high-speed data transmission with minimal distortion.
2.Exceptional Thermal Reliability
With a glass transition temperature (Tg) of >185°C (DSC method) and 210°C (DMA method), the M6 PCB can withstand high-temperature environments without compromising performance. Its thermal decomposition temperature (Td) is an impressive 410°C (TGA method), ensuring long-term reliability even under extreme conditions.
3.Low Coefficient of Thermal Expansion (CTE)
The M6 laminate features a CTE of 16 ppm/°C in the X and Y axes and 45 ppm/°C in the Z axis, reducing the risk of delamination and ensuring dimensional stability during thermal cycling.
4.RoHS and Halogen-Free Compliance
The M6 High-Speed PCB adheres to RoHS and halogen-free standards, making it an environmentally friendly choice for green manufacturing.
5.Compatibility with Traditional FR-4 Processing
Unlike other high-frequency materials, the M6 laminate is compatible with traditional FR-4 processing technology, eliminating the need for specialized equipment and reducing production costs.
6.Flammability Rating of UL 94V-0
The high speed PCB meets the UL 94V-0 flammability standard, ensuring safety and reliability in high-risk applications.
16-Layer Rigid PCB Stackup
|
Layer
|
Material/Description
|
Thickness (μm)
|
|
Copper Layer 1
|
Copper
|
35 μm
|
|
Prepreg 1
|
R-5670(G) 1080 X 1
|
85.1 μm
|
|
Copper Layer 2
|
Copper
|
17 μm
|
|
Core 1
|
M6 Core R5775G(HVLP)
|
96 μm
|
|
Copper Layer 3
|
Copper
|
17 μm
|
|
Prepreg 2
|
R-5670(G) 3313 X 1
|
99.4 μm
|
|
Copper Layer 4
|
Copper
|
17 μm
|
|
Core 2
|
M6 Core R5775G(HVLP)
|
96 μm
|
|
Copper Layer 5
|
Copper
|
17 μm
|
|
Prepreg 3
|
R-5670(G) 3313 X 1
|
99.4 μm
|
|
Copper Layer 6
|
Copper
|
17 μm
|
|
Core 3
|
M6 Core R5775G(HVLP)
|
96 μm
|
|
Copper Layer 7
|
Copper
|
35 μm
|
|
Prepreg 4
|
R-5670(G) 3313 X 1
|
99.4 μm
|
|
Copper Layer 8
|
Copper
|
35 μm
|
|
Core 4
|
M6 Core R5775G(HVLP)
|
96 μm
|
|
Copper Layer 9
|
Copper
|
17 μm
|
|
Prepreg 5
|
R-5670(G) 3313 X 1
|
99.4 μm
|
|
Copper Layer 10
|
Copper
|
17 μm
|
|
Core 5
|
M6 Core R5775G(HVLP)
|
96 μm
|
|
Copper Layer 11
|
Copper
|
17 μm
|
|
Prepreg 6
|
R-5670(G) 3313 X 1
|
99.4 μm
|
|
Copper Layer 12
|
Copper
|
17 μm
|
|
Core 6
|
M6 Core R5775G(HVLP)
|
96 μm
|
|
Copper Layer 13
|
Copper
|
17 μm
|
|
Prepreg 7
|
R-5670(G) 3313 X 1
|
99.4 μm
|
|
Copper Layer 14
|
Copper
|
17 μm
|
|
Core 7
|
M6 Core R5775G(HVLP)
|
96 μm
|
|
Copper Layer 15
|
Copper
|
17 μm
|
|
Prepreg 8
|
R-5670(G) 1080 X 1
|
85.1 μm
|
|
Copper Layer 16
|
Copper
|
35 μm
|
PCB Construction and Specifications
The M6 High-Speed PCB is a 16-layer PCB designed for complex circuit requirements. Below are the detailed construction specifications:
|
Parameter
|
Details
|
Specifications
|
|
Board Dimensions
|
Length x Width
|
110 mm x 110 mm (±0.15 mm)
|
|
Quantity
|
Per Panel
|
1 PCS
|
|
Minimum Trace/Space
|
Trace Width / Space
|
3/4 mils
|
|
Minimum Hole Size
|
Drilled Hole Diameter
|
0.2 mm
|
|
Via Type
|
Through-Hole Vias
|
No Blind Vias
|
|
Finished Board Thickness
|
Total Thickness
|
2.0 mm
|
|
Finished Copper Weight
|
Outer Layers
|
1 oz (1.4 mils)
|
|
Inner Layers
|
0.5 oz / 1 oz
|
|
|
Via Plating Thickness
|
Plating Thickness
|
25 μm
|
|
Surface Finish
|
Type
|
Electroless Nickel Immersion Gold (ENIG)
|
|
Top Silkscreen
|
Color
|
White
|
|
Bottom Silkscreen
|
Color
|
White
|
|
Top Solder Mask
|
Color
|
Green
|
|
Bottom Solder Mask
|
Color
|
Green
|
|
Via Filling
|
Via Size
|
0.2 mm vias filled and capped
|
|
Electrical Testing
|
Testing Method
|
100% Electrical Test Prior to Shipment
|
Impedance Control Specifications
|
Type
|
Layer
|
Trace Width (mil)
|
Space (mil)
|
Impedance (Ω)
|
Reference Layer(s)
|
|
Single-End
|
L1
|
11.8
|
-
|
75
|
Layer 4
|
|
Single-End
|
L1
|
5.9
|
-
|
50
|
Layer 2
|
|
Single-End
|
L16
|
5.9
|
-
|
50
|
Layer 15
|
|
Differential
|
L1
|
5.9 / 7.87
|
-
|
100
|
Layer 2
|
|
Differential
|
L10
|
3.94 / 5.9
|
-
|
100
|
Layer 9
|
|
Differential
|
L12
|
3.94 / 5.9
|
-
|
100
|
Layer 11, Layer 13
|
PCB Statistics
|
Parameter
|
Count
|
|
Components
|
154
|
|
Total Pads
|
406
|
|
Thru-Hole Pads
|
137
|
|
Top SMT Pads
|
121
|
|
Bottom SMT Pads
|
148
|
|
Vias
|
532
|
|
Nets
|
9
|
Typical Applications
The Panasonic M6 High-Speed PCB is versatile and suitable for a wide range of high-performance applications, including:
- 5G Communication Base Stations:
Millimeter-wave antennas, radio - frequency front - ends of AAU (Active Antenna Unit).
- Automotive Electronics:
77GHz millimeter-wave radar, ADAS (Advanced Driver - Assistance Systems).
- Data Centers:
High-speed server motherboards, 400G/800G optical module PCBs.
- Aerospace:
High-frequency circuit boards for satellite communication and radar systems.
- Consumer Electronics:
High-frequency Wi-Fi 6E/7 routers, AR/VR devices.
Why Choose M6 High-Speed PCB?
1.Superior Signal Integrity
The low Dk and Df values of the M6 High Tg PCB laminate ensure minimal signal loss and distortion, making it ideal for high-frequency applications.
2.High Thermal Reliability
With a high Tg value and excellent thermal stability, the M6 PCB performs reliably in demanding environments.
3.Cost-Effective Manufacturing
Compatibility with traditional FR-4 processing reduces production costs without compromising performance.
4.Environmentally Friendly
RoHS and halogen-free compliance align with global green manufacturing standards.
5.Wide Range of Applications
From 5G infrastructure to automotive radar systems, the M6 High-Speed PCB is a versatile solution for cutting-edge technologies.
Conclusion
The M6 High-Speed Mutilayer PCB is a state-of-the-art solution designed to meet the rigorous demands of modern high-frequency and high-speed applications. With its advanced materials, precise impedance control, and exceptional thermal reliability, this Megtron6 PCB is the perfect choice for industries at the forefront of technological innovation. Whether you’re developing 5G infrastructure, automotive radar systems, or high-performance computing solutions, the Panasonic M6 Laminate PCB delivers unmatched performance and reliability.
Availability: Worldwide
Quality Standard: IPC-Class-2
Artwork Format: Gerber RS-274-X
Elevate your designs with the M6 High-Speed PCB – where performance meets precision. Contact us today to learn more or request a quote!
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