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RF-35 is an organic-ceramic laminate material in the ORCER (Organic Ceramic) family of Taconic products. It is based on woven glass reinforcement. RF-35 is the result of Taconic's expertise in both ceramic filling technology and coated polytetrafluoride (PTFE) fiberglass.
Item NO.:
BIC-171-v130.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaColor:
WhiteShipping Port:
ShenzhenLead Time:
7-10 daysRF-35 Taconic High Frequency PCB with DK 3.5 Tg 315℃ 10mil 20mil 30mil 60mil RF PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
RF-35 is the best choice for low cost, high volume commercial microwave and radio frequency applications.It has an excellent peel strength for 1/2 ounce and 1 ounce copper (even compared to standard epoxy glass), a key aspect of the need for rework.
RF-35's Tg exceeds 315 ℃. Its ultra low moisture absorption rate and low dissipation factor minimize phase shift with frequency. RF-35 used woven fabrics in the design result in the stable dimension. The laminates are usually orderly clad on one side or both sides with 1/2,1 and 2 ounces electrodeposited copper respectively.
So we benefit from its low cost, excellent peel strength, exceptionally low dissipation factor, low moisture absorption and enhanced surface smoothness.
Applications:
Power Amplifiers
Filters and Couplers
Passive Components
Our PCB Capability (RF-35):
PCB Material: |
PTFE Ceramic Fiberglass |
|
Designation: |
RF-35 |
|
Dielectric constant: |
3.5 |
|
Dissipation Factor |
0.0018 |
|
Layer count: |
Double Layer, Multilayer, Hybrid PCB |
|
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
|
PCB thickness: |
10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
|
PCB size: |
≤400mm X 500mm |
|
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
|
Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc.. |
RF-35 Typical Value:
Property |
Test Method |
Unit |
Value |
Unit |
Value |
Dielectric Constant @ 1.9 GHz |
IPC-TM 650 2.5.5 |
|
3.5 |
|
3.5 |
Dissipation Factor @ 1.9 GHz |
IPC-TM 650 2.5.5 |
|
0.0018 |
|
0.0018 |
Moisture Absorption (.060") |
IPC-TM 650 2.6.2.1 |
% |
0.02 |
% |
0.02 |
Peel Strength (1/2 oz. copper) |
IPC-TM 650 2.4.8 |
lbs./linear inch |
>8.0 |
N/mm |
>1.5 |
Peel Strength (1 oz. copper) |
IPC-TM 650 2.4.8 |
lbs./linear inch |
>10.0 |
N/mm |
>1.8 |
Dielectric Breakdown |
IPC-TM 650 2.5.6 |
kV |
41 |
kV |
41 |
Volume Resistivity |
IPC-TM 650 2.5.17.1 |
Mohm/cm |
1.26 x 109 |
Mohm/cm |
1.26 x 109 |
Surface Resistivity |
IPC-TM 650 2.5.17.1 |
Mohm |
1.46 x 108 |
Mohm |
1.46 x 108 |
Arc Resistance |
IPC TM 650 2.5.1 |
seconds |
>180 |
seconds |
>180 |
Flexural Strength Lengthwise |
ASTM D 790 |
psi |
>22,000 |
N/mm2 |
>152 |
Flexural Strength Crosswise |
ASTM D 790 |
psi |
>18,000 |
N/mm2 |
>124 |
Thermal Conductivity |
ASTM F 433 |
W/m/K |
0.24 |
W/m/K |
0.24 |
Tensile Strength Lengthwise |
ASTM D 638 |
psi |
27,000 |
N/mm2 |
187 |
Tensile Strength Crosswise |
ASTM D 638 |
psi |
21,000 |
N/mm2 |
145 |
Dimensional Stability Lengthwise |
IPC-TM 650 2.4.39 |
in/in |
0.00004 |
mm/mm |
0.00004 |
Dimensional Stability Crosswise |
IPC-TM 650 2.4.39 |
in/in |
-0.0001 |
mm/mm |
-0.0001 |
x-y CTE |
ASTM D 3386 (TMA) |
ppm/°C |
19-24 |
ppm/°C |
19-24 |
z CTE |
ASTM D 3386 (TMA) |
ppm/°C |
64 |
ppm/°C |
64 |
Flammability |
UL-94 |
|
V-0 |
|
V-0 |
Hardness |
Rockwell M Scale |
|
34 |
|
34 |
Type |
Dk |
|
TLY-5A |
2.17 |
|
TLY-5 |
2.20 |
|
TLY-3 |
2.33 |
|
TLT-0 |
TLX-0 |
2.45 |
TLT-9 |
TLX-9 |
2.50 |
TLT-8 |
TLX-8 |
2.55 |
TLT-7 |
TLX-7 |
2.60 |
TLT-6 |
TLX-6 |
2.65 |
TLE-95 |
2.95 |
|
TLC-27 |
2.75 |
|
TLC-30 |
3.00 |
|
TLC-32 |
3.20 |
|
RF-30 |
3.00 |
|
RF-35 |
RF-35P |
3.50 |
RF-60 |
6.15 |
|
CER-10 |
10 |
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Taconic TLY-5Z High Frequency 50mil 1.27mm 2-Layer PCB with Immersion GoldNext:
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