RO3006 PCB 2-layer 5mil 0.127mm Rogers 3006 Pure Gold Custom High Frequency Board

RO3006 PCB 2-layer 5mil 0.127mm Rogers 3006 Pure Gold Custom High Frequency Board

The RO3006 2-layer 5 mil Pure Gold PCB is a high-precision circuit board tailored for commercial microwave and RF applications. Built onRogers RO3006 ceramic-filled PTFE composite material, it delivers exceptional electrical stability, mechanical reliability, and dimensional precision, making it an ideal choice for industries requiring high-performance signal transmission and temperature resistance. Below is a detailed breakdown of its technical specifications, performance advantages, and application scenarios.

1. PCB Construction Details

The following table outlines the comprehensive construction parameters of the RO3006 2-layer PCB, covering base material, structural dimensions, electrical performance indicators, and quality control standards.

2. PCB Stackup

The RO30065 mil PCB adopts a simplified and efficient 2-layer rigid structure, with the following table presenting the material layers and their corresponding thicknesses.

3. PCB Statistics

The component and connection statistics of the Rogers 3006 PCB reflect its compact design and precise functional configuration, as shown in the table below.

4. Core Material: Rogers RO3006 Introduction

At the heart of this PCB is Rogers RO3006 laminate, a ceramic-filled PTFE composite engineered for high-performance microwave and RF applications. Unlike traditional PTFE glass materials, RO3006 high frequency PCB offers exceptional electrical and mechanical stability, maintaining a consistent dielectric constant (Dk) across a wide temperature range. This eliminates the sudden Dk step change near room temperature, ensuring reliable signal transmission in dynamic environmental conditions.

5. Product Features

The RO3006 pure gold PCB boasts outstanding performance indicators that meet the demands of high-end applications:

1) Material Advantage:Adopts Rogers RO3006 ceramic-filled PTFE composites, ensuring superior electrical performance.

2) Electrical Stability:Dielectric constant (Dk) of 6.15±0.15 at 10 GHz/23°C; dissipation factor of 0.002 at 10 GHz/23°C, minimizing signal loss.

3) High Temperature Resistance:Decomposition temperature (Td) > 500°C, suitable for high-temperature operating environments.

4) Thermal Performance: Thermal Conductivity of 0.79 W/mK, facilitating efficient heat dissipation.

5) Low Moisture Absorption: Only 0.02%, ensuring stability in humid environments.

6) Dimensional Stability: Coefficient of Thermal Expansion (-55 to 288°C): X/Y axis 17 ppm/°C, Z axis 24 ppm/°C, matching copper’s expansion rate.

6. Product Benefits

This 5mil Rogers PCB delivers tangible value to customers through its superior design and material properties:

1) Uniform Mechanical Properties: Compatible with multi-layer board designs and epoxy glass hybrid designs, expanding application flexibility.

2) Low In-Plane Expansion Coefficient:Matches copper, enabling more reliable surface-mounted assemblies, ideal for temperature-sensitive applications and ensuring excellent dimensional stability.

3) Economical Manufacturing: Supports volume production with cost-effective laminate pricing, reducing overall project costs.

7. Typical Applications

Leveraging its high performance, the RO3006 PCB is widely applicable in various high-tech fields:

• Automotive radar systems
• Global Positioning Satellite (GPS) antennas
• Cellular telecommunications (power amplifiers and antennas)
• Wireless communication patch antennas
• Direct broadcast satellites
• Cable system datalinks
• Remote meter readers
• Power backplanes

8. Quality & Availability

• Artwork Standard: Accepts Gerber RS-274-X artwork format, compatible with mainstream PCB design software.
• Quality Certification: Complies with IPC-Class-2 standards, ensuring consistent quality.
• Global Availability: Shipped worldwide, meeting the needs of international customers.

With its exceptional performance, reliable quality, and wide applicability, the RO3006 2-layer 5 mil PCB is set to become a core component in microwave and RF applications, driving innovation in automotive, telecommunications, and satellite industries.