Rogers RO3035 2-Layer 10mil 0.254mm Immersion Gold High-Frequency PCB

Rogers RO3035 2-Layer 10mil 0.254mm Immersion Gold High-Frequency PCB

The RO3035 2-layer 10mil Immersion Gold PCB is a high-performance circuit board tailored for high-frequency and high-reliability applications, built on Rogers' advanced RO3035 laminates. As a core component in cutting-edge electronic systems, it combines exceptional material properties, precise manufacturing, and versatile applicability, making it an ideal choice for 5G, automotive radar, and satellite communication scenarios.

1. PCB Construction Details

The following table outlines the comprehensive construction parameters of the Rogers 3035 PCB, covering base material, dimensions, electrical performance, and manufacturing standards.

2. PCB Stackup

The 2-layer RO3035 PCB adopts a simple yet efficient stackup structure, ensuring stable signal transmission and mechanical performance.

3. PCB Statistics

The statistical data reflects the board's component layout and connection characteristics, suitable for compact electronic designs.

Rogers RO3035 Material Introduction

The high frequency PCB is constructed with Rogers RO3035 laminates—ceramic-filled, PTFE-based high-frequency circuit materials belonging to the RO3000 PCB series. These laminates feature consistent mechanical properties across different dielectric constants (Dk), enabling multi-layer board designs without warping or reliability issues. With stable Dk under varying temperatures, they are perfectly suited for 5G, millimeter wave sub-6GHz, and massive MIMO applications.

Key Features

1) Material Composition:Rogers RO3035ceramic-filled PTFE composites.

2) Electrical Performance: Dielectric constant (Dk) of 3.5±0.05 at 10GHz/23°C; dissipation factor of 0.0015 at 10GHz/23°C.

3) Thermal Stability: Decomposition temperature (Td) >500°C; thermal conductivity of 0.5 W/mK.

4) Moisture Resistance: Moisture absorption of only 0.04%.

5) Thermal Expansion: Coefficient of thermal expansion (CTE) of 17 ppm/°C (X/Y axis) and 24 ppm/°C (Z axis) within -55 to 288°C.

Core Benefits

1) High-Frequency Capability: Supports applications up to 30-40GHz, ideal for high-speed signal transmission.

2) Reliability Enhancement:Lower operating temperature in power amplifiers; low in-plane CTE matching copper, ensuring stable surface mount assemblies and dimensional stability for temperature-sensitive scenarios.

3) Design Flexibility: Uniform mechanical properties across Dk ranges, suitable for multi-layer designs and hybrid epoxy glass multi-layer board combinations.

4) Cost-Effectiveness: Compatible with volume manufacturing processes and economical laminate pricing.

Typical Applications & Standards

This RO3035 high frequency PCB meets IPC-Class-2 standards, with Gerber RS-274-X artwork support and worldwide availability. Its typical applications include:

• Automotive radar systems
• Global Positioning Satellite (GPS) antennas
• Cellular telecommunications (power amplifiers, antennas)
• Wireless communication patch antennas
• Direct broadcast satellites
• Cable system datalinks
• Remote meter readers
• Power backplanes

In summary, the RO3035 10 mil PCB integrates high-performance material, precise manufacturing, and broad applicability, serving as a reliable core component for modern high-frequency electronic systems.