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Home Newly Shipped RF PCB RO4003C 12mil 0.305mm PCB Rogers 4003C 2-layer Wholesale High Frequency Laminate

RO4003C 12mil 0.305mm PCB Rogers 4003C 2-layer Wholesale High Frequency Laminate

The RO4003C 12mil Rogers substrate PCB is a cutting-edge solution for high-frequency, performance-sensitive applications.

  • Item NO.:

    BIC-318-v394.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


RO4003C 12mil0.305mmPCB Rogers 4003C 2-layer Wholesale High Frequency Laminate

 

Introduction

The RO4003C 12mil PCB is a high-performance, cost-effective solution designed for RF and microwave applications. Engineered with Rogers Corporation’s proprietary RO4003C laminate, this PCB combines exceptional electrical performance with ease of fabrication, making it ideal for high-volume, performance-sensitive applications. Whether you’re designing cellular base station antennas, automotive radar systems, or RF identification tags, the Rogers RO4003C PCB delivers unmatched reliability and precision.

 

Rogers 4003C laminates are woven glass-reinforced hydrocarbon/ceramic materials that offer the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. This unique combination ensures tight control over dielectric constant (Dk) and low signal loss, while maintaining compatibility with standard FR-4 processing methods. Unlike traditional PTFE-based materials, RO4003C Substrate does not require special through-hole treatments or handling procedures, significantly reducing fabrication costs and lead times.

 

Key Features

 

1. Exceptional Electrical Performance


  • Dielectric Constant (Dk): 3.38 +/- 0.05 at 10 GHz, ensuring consistent signal integrity across high-frequency applications.
  • Dissipation Factor (Df): 0.0027 at 10 GHz and 0.0021 at 2.5 GHz, minimizing signal loss and enhancing efficiency.
  • Thermal Coefficient of Dielectric Constant: +40 ppm/°C, providing stable performance across a wide temperature range.


 

2. Superior Thermal and Mechanical Properties


  • Thermal Conductivity: 0.71 W/m/°K, ensuring efficient heat dissipation.
  • Coefficient of Thermal Expansion (CTE): X-axis: 11 ppm/°C, Y-axis: 14 ppm/°C, Z-axis: 46 ppm/°C. The CTE closely matches that of copper, ensuring excellent dimensional stability and reliable plated through-hole quality, even under severe thermal shock conditions.
  • Glass Transition Temperature (Tg): >280°C (536°F), maintaining stability across high-temperature processing environments.


 

3. Low Moisture Absorption


  • lMoisture absorption of just 0.06%, ensuring consistent performance in humid environments.


 

4. Cost-Effective Fabrication


  • Processes like FR-4, eliminating the need for specialized equipment or handling procedures.
  • Competitively priced compared to traditional microwave laminates.


 

RO4003C PCB 2-layer 12mil


PCB Stackup

PCB Stackup:  2-layer rigid PCB

Copper_layer_1 - 35μm

Rogers 4003C Core - 0.305 mm (12mil)

Copper_layer_2 - 35μm

 

PCB Construction Details

The Rogers RO4003C High Frequency PCB is a 2-layer rigid PCB with the following specifications:

 

Parameter

Details

Board Dimensions

50mm x 70mm (1PCS), +/- 0.15mm

Minimum Trace/Space

5/5 mils

Minimum Hole Size

0.25mm

Blind Vias

No

Finished Board Thickness

0.4mm

Finished Cu Weight

1oz (1.4 mils) outer layers

Via Plating Thickness

20 μm

Surface Finish

Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)

Top Silkscreen

White

Bottom Silkscreen

No

Top Solder Mask

Green

Bottom Solder Mask

No

Electrical Testing

100% Electrical test used prior to shipment

 

 

PCB Statistic

 

Parameter

Count

Components

17

Total Pads

54

Thru Hole Pads

34

Top SMT Pads

20

Bottom SMT Pads

0

Vias

56

Nets

2

 

 

Why Choose RO4003C PCB?

 

1. Ideal for Multi-Layer Board (MLB) Constructions

The RO4003C laminate’s CTE closely matches that of copper, ensuring excellent dimensional stability and reliable plated through-hole quality, even in mixed dielectric multi-layer board constructions.

 

2. Designed for High-Volume Applications

With its compatibility with standard FR-4 processing methods, the RO4003C High Frequency PCB is perfect for high-volume production, reducing fabrication costs and lead times.

 

3. Optimized for RF and Microwave Applications

The low dissipation factor and tight control over dielectric constant make this PCB ideal for performance-sensitive applications such as cellular base station antennas, automotive radar systems, and RF identification tags.

 

4. Reliable Performance in Harsh Environments

The low moisture absorption and high thermal stability ensure consistent performance in demanding environments, making it suitable for automotive and aerospace applications.

 

Typical Applications

The RO4003C material 12mil PCB is widely used in the following applications:

 

- Cellular Base Station Antennas and Power Amplifiers

- RF Identification Tags

- Automotive Radar and Sensors

- LNB's for Direct Broadcast Satellites

 

Conclusion

The RO4003C 12mil Rogers substrate PCB is a cutting-edge solution for high-frequency, performance-sensitive applications. With its exceptional electrical performance, thermal stability, and cost-effective fabrication, this Rogers PCB is the ideal choice for designers and engineers working on RF and microwave systems. Whether you’re developing automotive radar systems, cellular base station antennas, or RF identification tags, the 12mil RO4003C substrate PCB delivers the reliability, precision, and performance you need to succeed.

 




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