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Home Rogers PCB Board Rogers RT/duroid 5880 RF PCB 10mil 20mil 31mil 62mil Coating Immersion Silver Immersion Tin HASL

Rogers RT/duroid 5880 RF PCB 10mil 20mil 31mil 62mil Coating Immersion Silver Immersion Tin HASL


Rogers RT/duroid 5880 high frequency Teflon PCB is PTFE glass fiber reinforced material. These microfibers are randomly distributed within the material,for circuit application and circuit production processes.




  • Item NO.:

    BIC-093-v171.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Rogers RT/duroid 5880 RF PCB with 10mil, 20mil, 31mil and 62mil Coating Immersion Gold, Immersion Silver, Immersion Tin and HASL

(PCB's are custom-made products, the picture and parameters shown are just for reference)


There is an high frequency PCB built on RT/duroid 5880 laminates.


RT/duroid 5880 is one of Rogers’ glass microfiber reinforced PTFE composite which is designed for exacting stripline and microstrip circuit applications.


why do we use RT5880


Why do we use RT/duroid 5880?

Firstly, the randomly oriented microfibers result in exceptional dielectric constant uniformity.


Secondly, the dielectric constant of RT/duroid 5880 laminates is uniform from panel to panel and is constant over a wide frequency range.


Thirdly, its low dissipation factor extends the usefulness of RT/duroid 5880 laminates to Ku-band and above. It’s as low as 0.0004 when 1 MHz and 0.0009 when 10 GHz.


Fourthly, designed for exacting stripline and microstrip circuit applications


Our PCB Capability (RT/duroid 5880)

PCB Material:

Glass microfiber reinforced PTFE composites

Designation:

RT/duroid 5880

Dielectric constant:

2.2 ±0.02 (process)

2.2 (design)

Layer count:

2 Layer, Multilayer, Hybrid type (Mixed)

Copper weight:

0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

PCB thickness:

10mil (0.254mm), 20mil (0.508mm)

31mil (0.787mm), 62mil (1.575mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, OSP, etc..


RT/duroid 5880 material can be made in double layer board, multilayer board and hybrid types. The double sided boards are available in a variety of thicknesses, such as 10mil, 20mil, 31mil and 62mil.


Application RT-duroid 5880


The typical applications are microstrip and stripline circuits, commercial airline broadband antenna,radar systems, millimeter wave applications, point to point digital radio antenna etc.


The basic colour of RT/duroid 5880 PCB is black.


RT/duroid 5880 PCB also has the properties of low water absorption, excellent chemical resistance etc.

If you have any questions, please feel free to contact us.

Thank you for your reading.


Appendix: Typical Values of Rogers 5880

RT/duroid 5880 Typical Value
Property RT/duroid 5880 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.20
2.20±0.02 spec.
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign 2.2 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0004
0.0009
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε -125 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
(cal/g/c)
N/A Calculated
Tensile Modulus Test at 23℃ Test at 100℃ N/A MPa(kpsi) A ASTM D 638
1070(156) 450(65) X
860(125) 380(55) Y
Ultimate Stress 29(4.2) 20(2.9) X
27(3.9) 18(2.6) Y
Ultimate Strain 6 7.2 X %
4.9 5.8 Y
Compressive Modulus 710(103) 500(73) X MPa(kpsi) A ASTM D 695
710(103) 500(73) Y
940(136) 670(97) Z
Ultimate Stress 27(3.9) 22(3.2) X
29(5.3) 21(3.1) Y
52(7.5) 43(6.3) Z
Ultimate Strain 8.5 8.4 X %
7.7 7.8 Y
12.5 17.6 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.2 Z W/m/k 80℃ ASTM C 518
Coefficient of Thermal Expansion 31
48
237
X
Y
Z
ppm/℃ 0-100℃ IPC-TM-650 2.4.41
Td 500 N/A ℃TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel  31.2(5.5) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float
IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A



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