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Home Rogers PCB Board Rogers 60mil RT/duroid 6035HTC High Frequency PCB on Double Sided Copper With Green Mask

Rogers 60mil RT/duroid 6035HTC High Frequency PCB on Double Sided Copper With Green Mask

Duroid TM 6035HTC laminate is a ceramic filled TEflon component high frequency circuit material with high thermal conductivity and is designed for high power RF and microwave applications.




  • Item NO.:

    BIC-128-v157.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Rogers 60mil RT/duroid 6035HTC High Frequency PCB on Double Sided Copper With Green Mask for High Power RF Amplifiers

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


The RT/ Duroid 6035HTC material has much higher thermal conductivity than FR-4 and even some low loss high frequency laminates. The material consists of a ceramic-filled PTFE composite dielectric and standard or reverse-treated electrolytic (ED) copper foil. Because of its high thermal conductivity, the material is widely used in microwave amplifiers with hundreds of watts of power for efficient thermal management. It has a relative dielectric constant of 3.50 at 10GHz on the Z-axis _, and its tolerance across the board remains within +0.05 to keep the impedance of the transmission line consistent. The CTE of the x and y axes is 19ppm/°C, which is close to matching the CTE of copper.


Duroid 6000 laminates also offer superior electronic performance for a wide range of high reliability, aerospace applications.


Of course, correct thermal management in circuit design is not simply a matter of choosing the circuit laminate with the best thermal properties. There are many other factors that affect the temperature of a circuit operating at a given power level and frequency. For example, circuit materials are characterized by dissipation factor, which is the loss caused by the dielectric material. There are also losses through a conductive transmission line (such as a microstrip or ribbon circuit), and the higher the insertion loss, the more heat the transmission line produces at a higher power level. The roughness of the copper conductor on a PCB can lead to increased plug loss, especially at higher frequencies.


In addition, the choice of the dielectric constant of the PCB material will determine the size and density of the microwave/RF circuit, since the size of the microwave transmission line()permittivity is large, the size of the transmission line required to achieve a given impedance will be small, and the power handling capability of the PCB will be limited by the wire width and insertion loss and the ground plane spacing. For example, for an amplifier circuit, choosing a PCB material with a small relative dielectric constant can make the transmission line wider for a given impedance, thus improving heat flow. The use of PCB materials with higher relative permittivity will result in circuits with finer transmission line sizes and closer spacing, thus hot spots may form in high-power circuits. In addition, the selection of materials with low dissipation factor helps to minimize the insertion loss of the transmission line and optimize the gain of the amplifier circuit.




Features/Benefits:

1.High Thermal conductivity

Improved dielectric heat dissipation enables lower operating temperatures for high power applications

2.Low loss tangent

Excellent high frequency performance

3.Thermally stable low profile and reverse treat copper foil

Lower insertion loss and excellent thermal stability of traces

4.Advanced filler system

Improved drill ability and extended tool life compared to alumina containing circuit materials


Some Typical Applications:

1.High Power RF and Microwave Amplifiers

2.Power Amplifiers, Couplers, Filters

3.Combiners, Power Dividers




PCB Capability(RT/duroid 6035HTC):

PCB Capability (RT/duroid 6035HTC) 
PCB Material: Ceramic-filled PTFE composites
Designation: RT/duroid 6035HTC
Dielectric constant: 3.50±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..


Data Sheet of RT/duroid 6035HTC:


RT/duroid 6035HTC Typical Value
Property RT/duorid 6035HTC Direction Units Condition Test Method
Dielectric Constant,εProcess 3.50±0.05 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.6 Z 8 GHz - 40 GHz Differential Phase Length Method
Dissipation Factor 0.0013 Z 10 GHz/23 IPC-TM-650 2.5.5.5
Thermal Coefficient of  ε -66 Z ppm/℃ -50 to 150 mod IPC-TM-650, 2.5.5.5
Volume Resistivity 108 MΩ.cm A IPC-TM-650, 2.5.17.1
Surface Resistivity 108 A IPC-TM-650, 2.5.17.1
Dimensional Stability -0.11                    -0.08 CMD       MD mm/m (mils/inch) 0.030" 1oz EDC foil Thickness after etch '+E4/105 IPC-TM-650  2.4.39A
Tensile Modulus 329                 244 MD       CMD kpsi 40 hrs @23/50RH ASTM D638
Moisure Absorption 0.06 % D24/23 IPC-TM-650 2.6.2.1 ASTM D570
Coefficient of Thermal Expansion (-50 to 288 )
19                     19                     39 X                 Y                     Z                             ppm/ 23 / 50% RH  IPC-TM-650 2.4.41
Thermal Conductivity 1.44 W/m/k 80 ASTM C518
Density 2.2 gm/cm3 23 ASTM D792
Copper Peel Stength 7.9 pli 20 sec. @288 IPC-TM-650 2.4.8
Flammability V-0 UL 94
Lead-Free Process Compatible Yes


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