Rogers
60mil RT/duroid 6035HTC High Frequency PCB on Double Sided Copper With Green
Mask for High Power RF Amplifiers
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
The RT/ Duroid 6035HTC material has much higher thermal conductivity than FR-4 and
even some low loss high frequency laminates. The material consists of a
ceramic-filled PTFE composite dielectric and standard or reverse-treated
electrolytic (ED) copper foil. Because of its high thermal conductivity, the
material is widely used in microwave amplifiers with hundreds of watts of power
for efficient thermal management. It has a relative dielectric constant of 3.50
at 10GHz on the Z-axis _, and its tolerance across the board remains within
+0.05 to keep the impedance of the transmission line consistent. The CTE of the
x and y axes is 19ppm/°C, which is close to matching the CTE of copper.
Duroid
6000 laminates also offer superior electronic performance for a wide range of
high reliability, aerospace applications.
Of
course, correct thermal management in circuit design is not simply a matter of
choosing the circuit laminate with the best thermal properties. There are many
other factors that affect the temperature of a circuit operating at a given
power level and frequency. For example, circuit materials are characterized by
dissipation factor, which is the loss caused by the dielectric material. There
are also losses through a conductive transmission line (such as a microstrip or
ribbon circuit), and the higher the insertion loss, the more heat the
transmission line produces at a higher power level. The roughness of the copper
conductor on a PCB can lead to increased plug loss, especially at higher
frequencies.
In
addition, the choice of the dielectric constant of the PCB material will
determine the size and density of the microwave/RF circuit, since the size of
the microwave transmission line（）permittivity
is large, the size of the transmission line required to achieve a given
impedance will be small, and the power handling capability of the PCB will be
limited by the wire width and insertion loss and the ground plane spacing. For
example, for an amplifier circuit, choosing a PCB material with a small
relative dielectric constant can make the transmission line wider for a given
impedance, thus improving heat flow. The use of PCB materials with higher
relative permittivity will result in circuits with finer transmission line
sizes and closer spacing, thus hot spots may form in high-power circuits. In
addition, the selection of materials with low dissipation factor helps to
minimize the insertion loss of the transmission line and optimize the gain of
the amplifier circuit.
Features/Benefits:
1.High Thermal conductivity
Improved
dielectric heat dissipation enables lower operating temperatures for high power
applications
2.Low loss tangent
Excellent
high frequency performance
3.Thermally stable low profile and reverse
treat copper foil
Lower
insertion loss and excellent thermal stability of traces
4.Advanced filler system
Improved
drill ability and extended tool life compared to alumina containing circuit
materials
Some
Typical Applications:
1.High Power RF and Microwave Amplifiers
2.Power Amplifiers, Couplers, Filters
3.Combiners, Power Dividers
PCB
Capability（RT/duroid 6035HTC）:
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PCB Capability (RT/duroid 6035HTC)
|
|
PCB Material:
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Ceramic-filled PTFE composites
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Designation:
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RT/duroid 6035HTC
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Dielectric constant:
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3.50±0.05
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Layer count:
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Double Layer, Multilayer, Hybrid PCB
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Copper
weight:
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0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
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PCB thickness:
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10mil
(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
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PCB size:
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≤400mm X 500mm
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Solder mask:
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Green, Black, Blue,
Yellow, Red etc.
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Surface
finish:
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Bare copper, HASL,
ENIG, OSP etc..
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Data
Sheet of RT/duroid 6035HTC:
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RT/duroid
6035HTC Typical Value
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Property
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RT/duorid 6035HTC
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Direction
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Units
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Condition
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Test Method
|
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Dielectric Constant,εProcess
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3.50±0.05
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Z
|
|
10 GHz/23℃
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IPC-TM-650
2.5.5.5 Clamped Stripline
|
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Dielectric Constant,εDesign
|
3.6
|
Z
|
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8 GHz - 40
GHz
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Differential Phase Length Method
|
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Dissipation
Factor
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0.0013
|
Z
|
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10 GHz/23℃
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IPC-TM-650 2.5.5.5
|
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Thermal Coefficient of ε
|
-66
|
Z
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ppm/℃
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-50 ℃to 150℃
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mod IPC-TM-650, 2.5.5.5
|
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Volume Resistivity
|
108
|
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MΩ.cm
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A
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IPC-TM-650, 2.5.17.1
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Surface Resistivity
|
108
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MΩ
|
A
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IPC-TM-650, 2.5.17.1
|
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Dimensional Stability
|
-0.11 -0.08
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CMD MD
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mm/m
(mils/inch)
|
0.030"
1oz EDC foil Thickness after etch '+E4/105
|
IPC-TM-650 2.4.39A
|
|
Tensile Modulus
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329 244
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MD CMD
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kpsi
|
40 hrs @23℃/50RH
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ASTM D638
|
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Moisure Absorption
|
0.06
|
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%
|
D24/23
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IPC-TM-650 2.6.2.1 ASTM D570
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Coefficient of Thermal Expansion (-50 ℃to 288 ℃)
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19 19 39
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X Y Z
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ppm/℃
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23℃ / 50% RH
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IPC-TM-650 2.4.41
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Thermal Conductivity
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1.44
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W/m/k
|
80℃
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ASTM C518
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Density
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2.2
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gm/cm3
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23℃
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ASTM D792
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Copper Peel Stength
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7.9
|
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pli
|
20 sec. @288 ℃
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IPC-TM-650 2.4.8
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Flammability
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V-0
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UL 94
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Lead-Free Process Compatible
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Yes
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