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Home Newly Shipped RF PCB Rogers Cuclad 217 20mil laminate PCB Double-layer Immersion Gold Blue Solder Mask

Rogers Cuclad 217 20mil laminate PCB Double-layer Immersion Gold Blue Solder Mask

This double-layer CuClad 217 PCB is a robust, high-performance foundation for your most challenging electronic designs.

  • Item NO.:

    BIC-501-v586.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Rogers Cuclad 217 20mil laminate PCB Double-layer Immersion Gold Blue Solder Mask

 

This product is a high-performance, double-layer printed circuit board engineered for demanding radio frequency (RF) and microwave applications. Manufactured using Rogers CuClad 217 laminate, this board is designed to provide exceptional electrical stability, low signal loss, and reliable performance in sensitive electronic systems. With its immersion gold surface finish, precise 20-mil core thickness, and adherence to IPC-Class-2 standards, this Cuclad 217 PCB represents a reliable solution for advanced communications and defense electronics.

 

The core of this 20mil Cuclad 217 PCB is the renowned Rogers CuClad 217 material, a composite laminate constructed from cross-piled woven fiberglass and polytetrafluoroethylene (PTFE). This unique structure provides in-plane electrical and mechanical isotropy, ensuring consistent performance regardless of signal direction. With an ultra-low dielectric constant (Dk) of 2.17 and a remarkably low dissipation factor of 0.0009 at 10 GHz, it enables faster signal propagation and higher signal-to-noise ratios. The material's low moisture absorption (0.02%) and excellent peel strength further guarantee long-term reliability and durability under various environmental conditions.

 

 

PCB Construction Details

The following table outlines the fundamental physical and material specifications of the Rogers CuClad 217 PCB.

 

Parameter

Specification

Base Material

Rogers CuClad 217 Laminates

Layer Count

2

Board Dimensions

89mm x 56mm=1PCS (±0.15mm)

Minimum Trace / Space

4 mil / 5 mil

Minimum Hole Size

0.2mm

Blind Vias

No

Finished Board Thickness

0.6mm (20 mils)

Finished Copper Weight (Outer)

1 oz (35 μm / 1.4 mils)

Via Plating Thickness

20 μm (min)

Surface Finish

Immersion Gold (ENIG)

Top Silkscreen

White

Bottom Silkscreen

No

Top Solder Mask

Blue

Bottom Solder Mask

No

Electrical Test

100% Electrical test used prior to shipment

 

 

PCB Stackup

This table details the layer-by-layer material composition and thickness for this 2-layer rigid board.

 

Layer

Material

Thickness

Copper (Layer 1 - Top)

Electrodeposited Copper

35 μm (1 oz)

Core

Rogers CuClad 217 Dielectric

0.508 mm (20 mil)

Copper (Layer 2 - Bottom)

Electrodeposited Copper

35 μm (1 oz)

 

 

PCB Statistics

This table provides a quantitative overview of the Rogers board's design elements and component placement.

 

Item

Quantity

Components

25

Total Pads

130

Thru-Hole Pads

105

Top-Side SMT Pads

25

Bottom-Side SMT Pads

0

Vias

45

Nets

2

 

 

Quality & Documentation

This CuClad 217 ENIG PCB is manufactured in full compliance with IPC-Class-2 standards, ensuring a high degree of quality and reliability suitable for commercial and industrial applications where extended life and performance are required. All design files are supplied in the industry-standard Gerber RS-274-X format, ensuring accuracy and compatibility with modern fabrication equipment.


Cuclad 217 PCB 20mil Double-layer Immersion Gold

 

Key Features & Benefits

 

1)Low & Stable Dielectric Constant (Dk ~2.17): Provides stable electrical performance over a wide frequency range, enabling predictable signal speed and impedance control.

2)Ultra-Low Dissipation Factor (0.0009): Minimizes signal attenuation and circuit losses, which is critical for high-frequency and sensitive analog circuits.

3)Excellent Dimensional Stability: The cross-piled woven glass reinforcement offers superior mechanical stability, aiding in precise fabrication and reliable registration.

4)Low Moisture Absorption (0.02%): Enhances performance stability in humid environments and improves reliability.

5)Immersion Gold Surface Finish: Offers a flat, coplanar surface for excellent solder joint integrity and reliable wire bonding capability, protected by an underlying nickel barrier.

6)Electrical & Mechanical Isotropy: Ensures uniform performance in the X-Y plane, offering design flexibility and consistency.

 

Typical Applications

This combination of material and construction makes this CuClad 217 high Frequency PCB ideally suited for advanced electronic systems, including:

 


  • Radar Systems and Antenna Arrays
  • Electronic Countermeasures (ECM) and Electronic Support Measures (ESM)
  • Microwave Components: Low-Noise Amplifiers (LNAs), Filters, Power Dividers/Combiners, and Couplers
  • High-Frequency Communication Links
  • Other performance-sensitive RF and microwave circuits.


  

Available for supply worldwide, this double-layer CuClad 217 PCB is a robust, high-performance foundation for your most challenging electronic designs.

 


 




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