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This double-layer CuClad 217 PCB is a robust, high-performance foundation for your most challenging electronic designs.
Item NO.:
BIC-501-v586.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Rogers Cuclad 217 20mil laminate PCB Double-layer Immersion Gold Blue Solder Mask
This product is a high-performance, double-layer printed circuit board engineered for demanding radio frequency (RF) and microwave applications. Manufactured using Rogers CuClad 217 laminate, this board is designed to provide exceptional electrical stability, low signal loss, and reliable performance in sensitive electronic systems. With its immersion gold surface finish, precise 20-mil core thickness, and adherence to IPC-Class-2 standards, this Cuclad 217 PCB represents a reliable solution for advanced communications and defense electronics.
The core of this 20mil Cuclad 217 PCB is the renowned Rogers CuClad 217 material, a composite laminate constructed from cross-piled woven fiberglass and polytetrafluoroethylene (PTFE). This unique structure provides in-plane electrical and mechanical isotropy, ensuring consistent performance regardless of signal direction. With an ultra-low dielectric constant (Dk) of 2.17 and a remarkably low dissipation factor of 0.0009 at 10 GHz, it enables faster signal propagation and higher signal-to-noise ratios. The material's low moisture absorption (0.02%) and excellent peel strength further guarantee long-term reliability and durability under various environmental conditions.
PCB Construction Details
The following table outlines the fundamental physical and material specifications of the Rogers CuClad 217 PCB.
|
Parameter |
Specification |
|
Base Material |
Rogers CuClad 217 Laminates |
|
Layer Count |
2 |
|
Board Dimensions |
89mm x 56mm=1PCS (±0.15mm) |
|
Minimum Trace / Space |
4 mil / 5 mil |
|
Minimum Hole Size |
0.2mm |
|
Blind Vias |
No |
|
Finished Board Thickness |
0.6mm (20 mils) |
|
Finished Copper Weight (Outer) |
1 oz (35 μm / 1.4 mils) |
|
Via Plating Thickness |
20 μm (min) |
|
Surface Finish |
Immersion Gold (ENIG) |
|
Top Silkscreen |
White |
|
Bottom Silkscreen |
No |
|
Top Solder Mask |
Blue |
|
Bottom Solder Mask |
No |
|
Electrical Test |
100% Electrical test used prior to shipment |
PCB Stackup
This table details the layer-by-layer material composition and thickness for this 2-layer rigid board.
|
Layer |
Material |
Thickness |
|
Copper (Layer 1 - Top) |
Electrodeposited Copper |
35 μm (1 oz) |
|
Core |
Rogers CuClad 217 Dielectric |
0.508 mm (20 mil) |
|
Copper (Layer 2 - Bottom) |
Electrodeposited Copper |
35 μm (1 oz) |
PCB Statistics
This table provides a quantitative overview of the Rogers board's design elements and component placement.
|
Item |
Quantity |
|
Components |
25 |
|
Total Pads |
130 |
|
Thru-Hole Pads |
105 |
|
Top-Side SMT Pads |
25 |
|
Bottom-Side SMT Pads |
0 |
|
Vias |
45 |
|
Nets |
2 |
Quality & Documentation
This CuClad 217 ENIG PCB is manufactured in full compliance with IPC-Class-2 standards, ensuring a high degree of quality and reliability suitable for commercial and industrial applications where extended life and performance are required. All design files are supplied in the industry-standard Gerber RS-274-X format, ensuring accuracy and compatibility with modern fabrication equipment.
Key Features & Benefits
1)Low & Stable Dielectric Constant (Dk ~2.17): Provides stable electrical performance over a wide frequency range, enabling predictable signal speed and impedance control.
2)Ultra-Low Dissipation Factor (0.0009): Minimizes signal attenuation and circuit losses, which is critical for high-frequency and sensitive analog circuits.
3)Excellent Dimensional Stability: The cross-piled woven glass reinforcement offers superior mechanical stability, aiding in precise fabrication and reliable registration.
4)Low Moisture Absorption (0.02%): Enhances performance stability in humid environments and improves reliability.
5)Immersion Gold Surface Finish: Offers a flat, coplanar surface for excellent solder joint integrity and reliable wire bonding capability, protected by an underlying nickel barrier.
6)Electrical & Mechanical Isotropy: Ensures uniform performance in the X-Y plane, offering design flexibility and consistency.
Typical Applications
This combination of material and construction makes this CuClad 217 high Frequency PCB ideally suited for advanced electronic systems, including:
Available for supply worldwide, this double-layer CuClad 217 PCB is a robust, high-performance foundation for your most challenging electronic designs.
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