Wangling F4BTMS615 PCB Double-layer 0.254mm 10mil Thick Immersion Tin Bare Copper

Wangling F4BTMS615 PCB Double-layer 0.254mm 10mil Thick ImmersionTin Bare Copper

This product is a precision-engineered, double-layer printed circuit board fabricated on the advanced F4BTMS615 ceramic-filled PTFE composite material. Designed for high-reliability radio frequency (RF), microwave, and aerospace applications, this Wangling board exemplifies a perfect synergy between cutting-edge substrate technology and exacting manufacturing standards. The 0.3mm overall thickness and the absence of solder mask and silkscreen indicate a design optimized for controlled impedance, minimal dielectric loss, and potentially complex assembly integration where space and weight are at a premium. The immersion tin surface finish PCB provides a flat, solderable surface excellent for fine-pitch components and offers superior shelf life compared to bare copper.

PCB Construction

The F4BTMS615 PCB construction details are summarized below, highlighting its key dimensional and manufacturing specifications:

PCB Stackup (2-Layer Rigid)

The 10mil F4BTMS615 PCB stackup is a simple yet high-performance two-layer structure, as detailed in the following table:

PCB Statistics

A statistical overview of the board's design complexity and component layout is provided here:

Advanced Material Foundation: F4BTMS615

This PCB is built upon the innovative F4BTMS615 substrate, a significant upgrade from standard PTFE materials. It represents a technological breakthrough, formulated with a high loading of special nano-ceramics uniformly dispersed within a polytetrafluoroethylene (PTFE) resin matrix and reinforced with ultra-thin, ultra-fine glass fiber cloth. This proprietary formulation drastically reduces the negative effects of traditional glass weave on signal propagation, minimizing dielectric loss and improving dimensional stability. The result is a material with remarkably low and consistent anisotropy across the X, Y, and Z axes. It comes standard with RTF (Reverse Treated Foil) low-profile copper, which reduces conductor loss at high frequencies while maintaining excellent peel strength.

Key Material Features & Electrical Properties

The F4BTMS615 Wangling substrate delivers exceptional performance parameters critical for high-frequency designs:

1)Stable Dielectric Constant: A consistent Dk of 6.15 at 10GHz ensures predictable impedance control.

2)Ultra-Low Loss: An extremely low dissipation factor (Df) of 0.0020 at 10GHz (0.0023 at 20GHz) minimizes signal attenuation.

3)Excellent Dimensional & Thermal Stability: Very low Coefficient of Thermal Expansion (CTE: 10/12/40 ppm/°C in X/Y/Z) and a low thermal coefficient of Dk (-96 ppm/°C) ensure reliable performance under thermal cycling.

4)Enhanced Thermal Management: High thermal conductivity of 0.67 W/mK aids in heat dissipation from active components.

5)High Reliability: Low moisture absorption (0.1%) and a wide operating temperature range ensure robustness in harsh environments.

Typical Applications

This combination of a precisely manufactured thin PCB and the high-performance Wangling F4BTMS615 substrate makes it ideal for advanced electronic systems, including:

• Aerospace and Avionics Equipment, Cabin & Spacecraft Systems
• Microwave and RF Circuits, Up/Down Converters
• Radar Systems and Military Radar Modules
• Antenna Feed Networks
• Phase-Sensitive and Phased Array Antenna Elements
• Satellite Communication (SATCOM) Equipment

Ordering & Documentation

This product is available for global procurement. All fabrication data is supplied in the industry-standard Gerber RS-274-X format, ensuring seamless and accurate manufacturing. For this high-reliability F4BTMS615 high frequency PCB, trust in the material science and process control that meets the stringent demands of modern aerospace and RF engineering.