Rogers CuClad 250 DK2.55 Woven Fiberglass PTFE CuClad Series Copper Clad Laminates
Product Overview
CuClad 250 is a member of the CuClad series laminates, which are composite materials composed of woven fiberglass and PTFE (Polytetrafluoroethylene) specifically designed for printed circuit board (PCB) substrates. This laminate is formulated with a higher fiberglass/PTFE ratio, a key feature that enables it to deliver mechanical properties closely resembling those of conventional substrates.
A standout advantage of Rogers CuClad 250 is its superior dimensional stability, paired with lower thermal expansion across all directions. These characteristics make it a reliable choice for applications where structural integrity and consistent performance under varying conditions are essential.
For applications demanding critical performance standards, CuClad 250 substrate can be specified with the "LX" testing grade. Products bearing the "LX" designation undergo individual testing for each sheet, and a detailed test report is provided with the order. It should be noted that "LX" grade products are priced higher, as a portion of each sheet is used in destructive testing procedures to ensure quality and performance compliance.
CuClad 250, like other laminates in the CuClad substrate series, features a crossplied structure—alternating layers of coated fiberglass plies are oriented at 90°to one another. This unique construction delivers true electrical and mechanical isotropy in the X-Y plane, a property that is exclusive to CuClad laminates and highly valued in applications such as phased array antennas where isotropy is critical to performance.
Typical Properties of CuClad 250
|
Property
|
Test Method
|
Condition
|
Typical Value
|
|
Dielectric Constant @10 GHz
|
IPC TM-650 2.5.5.5
|
C23/50
|
2.40 to 2.55
|
|
Dielectric Constant @1 MHz
|
IPC TM-650 2.5.5.3
|
C23/50
|
2.40 to 2.60
|
|
Dissipation Factor @10 GHz
|
IPC TM-650 2.5.5.5
|
C23/50
|
0.0017
|
|
Thermal Coefficient of Er (ppm/°C)
|
IPC TM-650 2.5.5.5 Adapted
|
-10°C to +140°C
|
-153
|
|
Peel Strength (lbs. per inch)
|
IPC TM-650 2.4.8
|
After Thermal Stress
|
14
|
|
Volume Resistivity (MΩ-cm)
|
IPC TM-650 2.5.17.1
|
C96/35/90
|
8.0 x 10⁹
|
|
Surface Resistivity (MΩ)
|
IPC TM-650 2.5.17.1
|
C96/35/90
|
1.5 x 10⁸
|
|
Arc Resistance (seconds)
|
ASTM D-495
|
D48/50
|
>180
|
|
Tensile Modulus (kpsi)
|
ASTM D-638
|
A, 23°C
|
725, 572
|
|
Tensile Strength (kpsi)
|
ASTM D-882
|
A, 23°C
|
26.0, 20.5
|
|
Compressive Modulus (kpsi)
|
ASTM D-695
|
A, 23°C
|
342
|
|
Flexural Modulus (kpsi)
|
ASTM D-790
|
A, 23°C
|
456
|
|
Dielectric Breakdown (kv)
|
ASTM D-149
|
D48/50
|
>45
|
|
Specific Gravity (g/cm³)
|
ASTM D-792 Method A
|
A, 23°C
|
2.31
|
|
Water Absorption (%)
|
MIL-S-13949H 3.7.7; IPC TM-650 2.6.2.2
|
E1/105 + D24/23
|
0.03
|
|
Coefficient of Thermal Expansion (ppm/°C) - X Axis
|
IPC TM-650 2.4.24; Mettler 3000 Thermomechanical Analyzer
|
0°C to 100°C
|
18
|
|
Coefficient of Thermal Expansion (ppm/°C) - Y Axis
|
IPC TM-650 2.4.24; Mettler 3000 Thermomechanical Analyzer
|
0°C to 100°C
|
19
|
|
Coefficient of Thermal Expansion (ppm/°C) - Z Axis
|
IPC TM-650 2.4.24; Mettler 3000 Thermomechanical Analyzer
|
0°C to 100°C
|
177
|
|
Thermal Conductivity
|
ASTM E-1225
|
100°C
|
0.25
|
|
Outgassing - Total Mass Loss (%)
|
NASA SP-R-0022A (Maximum 1.00%)
|
125°C, ≤10⁻⁶ torr
|
0.01
|
|
Outgassing - Collected Volatile Condensable Material (%)
|
NASA SP-R-0022A (Maximum 0.10%)
|
125°C, ≤10⁻⁶ torr
|
0
|
|
Outgassing - Water Vapor Regain (%)
|
NASA SP-R-0022A
|
125°C, ≤10⁻⁶ torr
|
0
|
|
Outgassing - Visible Condensate (±)
|
NASA SP-R-0022A
|
125°C, ≤10⁻⁶ torr
|
NO
|
|
Flammability
|
UL 94 Vertical Burn; IPC TM-650 2.3.10
|
C48/23/50, E24/125
|
Meets requirements of UL94-V0
|
Key Features & Benefits
Features
-
Crossplied woven fiberglass construction (alternating plies oriented 90°to each other)
-
Higher fiberglass/PTFE ratio compared to other CuClad variants
-
Superior dielectric constant uniformity than comparable non-woven fiberglass reinforced PTFE laminates
Benefits
-
True electrical and mechanical isotropy in the X-Y plane, ideal for precision applications
-
Excellent dimensional stability and low thermal expansion across all axes
-
Mechanical properties that align with conventional PCB substrates
-
Suitable for high-frequency applications requiring reliable signal integrity
-
Material Availability
Standard Thicknesses (with Tolerances)
0.010" (0.25mm)±0.0010"
0.020" (0.51mm)±0.0020"
0.031" (0.79mm)±0.0020"
0.062" (1.57mm)±0.0020"
Additional non-standard thicknesses available from 0.005" to 0.250" in varying increments
Standard Panel Sizes
18×12" (457×305mm)
18×24" (457×610mm)
Additional custom panel sizes available upon request
Standard Cladding
Electrodeposited copper foil
½oz. (18μm) HH/HH
1 oz. (35μm) HH/HH
Additional cladding options available: heavy metal, resistive foil, and unclad
For inquiries about non-standard configurations, custom requirements, please contact our Customer Service or Sales Engineering team.
BICHENG PCB CERTIFICATE:
Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
