Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
DiClad 870 is a high-performance laminate belonging to Rogers Corporation’s DiClad substrate Series, which is composed of a woven fiberglass and PTFE (polytetrafluoroethylene) composite.
Item NO.:
BIC-491-v577.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Rogers DiClad 870 DiClad Series DK2.33 PTFE Woven Fiberglass Laminates
DiClad 870 is a high-performance laminate belonging to Rogers Corporation’s DiClad substrate Series, which is composed of a woven fiberglass and PTFE (polytetrafluoroethylene) composite. Designed specifically for use as a printed circuit board (PCB) substrate, this DiClad 870 material is engineered with precise control over the fiberglass-to-PTFE ratio, delivering a balanced combination of electrical, thermal, mechanical, and physical properties tailored for demanding high-frequency applications.
Core Characteristics & Advantages
1)Exceptional Electrical Performance: Boasts a low and stable dielectric constant, paired with an ultra-low dissipation factor. These properties remain highly uniform across a broad frequency range, ensuring reliable signal integrity—critical for high-frequency applications where signal loss and consistency are paramount.
2)Superior Dimensional Stability: The woven fiberglass reinforcement within the laminate provides enhanced dimensional stability compared to non-woven fiberglass-reinforced PTFE-based laminates with similar dielectric constants. This stability minimizes dimensional variations under different environmental conditions, supporting precise PCB manufacturing and performance.
3)Consistent Overall Performance: Offers uniform product performance, including reliable mechanical properties and consistent electrical behavior. This consistency simplifies design processes and ensures scalability across different project requirements.
4)Strong Chemical Resistance: Exhibits excellent resistance to various chemicals, enhancing its durability and suitability for use in harsh operating environments.
Key Application Areas
Rogers DiClad 870 laminates are ideally suited for applications that demand low signal loss, stable dielectric properties, and reliable mechanical performance, such as:
DiClad 870 Technical Specifications
|
Property |
DiClad 870 |
Condition |
Test Method |
|
Electrical Properties |
|||
|
Dielectric Constant @ 10 GHz |
2.33 |
C23/50 |
IPC TM-650 2.5.5.5 |
|
Dielectric Constant @ 1 MHz |
2.33 |
C23/50 |
IPC TM-650 2.5.5.3 |
|
Dissipation Factor @ 10 GHz |
0.0013 |
C23/50 |
IPC TM-650 2.5.5.5 |
|
Dissipation Factor @ 1 MHz |
0.0009 |
C23/50 |
IPC TM-650 2.5.5.3 |
|
Thermal Coefficient of Er (ppm/°C) |
-161 |
-10°C to +140°C |
IPC TM-650 2.5.5.5 |
|
Volume Resistivity (MΩ-cm) |
1.5 x 109 |
C96/35/90 |
IPC TM-650 2.5.17.1 |
|
Surface Resistivity (MΩ) |
3.4 x 107 |
C96/35/90 |
IPC TM-650 2.5.17.1 |
|
Arc Resistance |
>180 |
D48/50 |
ASTM D-495 |
|
Dielectric Breakdown (kV) |
>45 |
D48/50 |
ASTM D-149 |
|
Mechanical Properties |
|||
|
Peel Strength (lbs.per inch) |
14 |
After Thermal Stress |
IPC TM-650 2.4.8 |
|
Tensile Modulus (kpsi) |
485(MD), 346(CD) |
A, 23°C |
ASTM D-638 |
|
Tensile Strength (kpsi) |
14.9(MD), 11.2 (CD) |
A, 23°C |
ASTM D-882 |
|
Compressive Modulus (kpsi) |
327 |
A, 23°C |
ASTM D-695 |
|
Flexural Modulus (kpsi) |
437 |
A, 23°C |
ASTM D-790 |
|
Thermal Properties |
|||
|
Coefficient of Thermal Expansion (ppm/°C) X Axis Y Axis Z Axis |
17 29 217 |
0°C to 100°C |
IPC TM-650 2.4.24 Mettler 3000 Thermomechanical Analyzer |
|
Thermal Conductivity (W/mK) |
0.257 |
100°C |
ASTM E-1225 |
|
Flammability UL |
Meets requirements of UL94-V0 |
C48/23/50, E24/125 |
UL 94 Vertical Burn IPC TM-650 2.3.10 |
|
Physical Properties |
|||
|
Density (g/cm3) |
2.26 |
A, 23°C |
ASTM D-792 Method A |
|
Water Absorption (%) |
0.02 |
E1/105 + D24/23 |
MIL-S-13949H 3.7.7 |
|
Outgassing Total Mass Loss (%) Collected Volatile Condensable Material (%) Water Vapor Regain (%) Visible Condensate (±) |
0.02 0.00 0.01 NO |
125°C, ≤ 10-6torr |
NASA SP-R-0022A Maximum 1.00% Maximum 0.10% |
Standard Offerings
Standard Thicknesses
Standard Panel Sizes
Standard Claddings
|
Cladding Type |
Thickness Options |
|
Electrodeposited Copper Foil |
1/2 oz. (18µm), 1 oz. (35µm) |
|
Rolled Copper Foil |
1/2 oz. (18µm), 1 oz. (35µm) |
Previous:
Wangling F4BM233 DK2.33 PTFE Glass Fiber Cloth Copper Clad LaminatesNext:
Rogers DiClad 527 DK2.4-2.6 DiClad Series Copper Clad LaminateIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
Categories
New Products
14-Layer Panasonic M6 R-5775(N) Laminate High Speed PCB ENEPIG Green Solder Mask
8-Layer RO4350B Tg180 FR-4 Mixed Dielectric Material PCB Blind Buried Via ENIG
4-layer RT/duroid 5880+TG175 FR4 Hybrid PCB with ENIG Controlled Depth Slots
4-layer RO4003C+TG175 FR4 Hybrid PCB 1.4mm Finished Board Thick ENIG
2-Layer Ultra-Thin Flexible Polyimide, Adhesiveless PCB SF202 ENEPIG Green Solder Mask
TP2000 PCB TP Series 6mm Wangling DK20 Substrate Pure Gold Bare Copper
25mil TF600-Based 2-Layer DK6.0 TF Series PCB with ENIG and Copper-filled Vias
Rogers RT/duroid 5870 PCB 2-layer 10mil Laminate ENIG Finish Bare Copper
© Copyright: 2026 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.
IPv6 network supported