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The RO3210 20 mil substrate PCB combines Rogers' premium RO3210 material with precise manufacturing, offering excellent electrical performance, mechanical stability and wide applicability.
Item NO.:
BIC-417-v500.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Rogers RO3210 PCB 2-layer 20mil 0.508mm Immersion Silver Blue Solder Mask White Silkscreen
The RO3210 2-layer 20mil Immersion Silver PCB is a high-performance printed circuit board built on Rogers' advanced RO3210 high-frequency circuit material. Engineered for exceptional electrical and mechanical stability, thisRogersPCB is an ideal choice for a wide range of high-frequency and precision applications, combining superior material properties with meticulous manufacturing standards to deliver reliable performance and high production yields.
PCB Construction Details
The following table comprehensively outlines the key construction parameters of the Rogers RO3210 PCB, covering material selection, structural dimensions, processing accuracy and quality control measures.
|
Parameter |
Specification |
|
Base Material |
Rogers RO3210 |
|
Layer Count |
2-layer |
|
Board Dimensions |
54.5mm x 50.0mm (1 PCS) ±0.15mm |
|
Minimum Trace/Space |
5 / 8 mils |
|
Minimum Hole Size |
0.3mm |
|
Blind/Buried Vias |
No |
|
Finished Board Thickness |
0.6mm |
|
Finished Cu Weight (Outer) |
1 oz (35 μm / 1.4 mils) |
|
Via Plating Thickness |
20 μm |
|
Surface Finish |
Immersion Silver |
|
Top Silkscreen |
White |
|
Bottom Silkscreen |
No |
|
Top Solder Mask |
Blue |
|
Bottom Solder Mask |
No |
|
Electrical Test |
100% Tested |
PCB Stackup
As a 2-layer rigid PCB, its stackup structure is designed to optimize electrical performance and structural stability, with clear layer distribution and precise thickness control.
|
Layer |
Material |
Thickness |
|
Layer 1 |
Copper (Signal/Component) |
35 μm (1 oz) |
|
Dielectric |
Rogers RO3210 Core |
0.508 mm (20 mil) |
|
Layer 2 |
Copper (Ground Plane) |
35 μm (1 oz) |
PCB Statistics
The statistical data below reflects the component layout and connection design characteristics of the RO3210 high frequency PCB, providing a clear reference for assembly and application matching.
|
Item |
Quantity |
|
Components |
9 |
|
Total Pads |
23 |
|
Thru-Hole Pads |
15 |
|
Top SMT Pads |
8 |
|
Bottom SMT Pads |
0 |
|
Vias |
14 |
|
Nets |
2 |
About RO3210 Material
Rogers RO3210 substrate is a ceramic-filled laminate reinforced with woven fiberglass. It stands out for its exceptional electrical performance and enhanced mechanical stability. This material integrates the surface smoothness of non-woven PTFE laminates (enabling finer line etching tolerances) with the rigidity of woven-glass PTFE laminates, and can be fabricated into PCBs using standard PTFE circuit board processing techniques, ensuring compatibility with mainstream manufacturing processes.
Key Features
1) Dielectric Constant (Dk): 10.2 +/- 0.5, ensuring stable signal transmission in high-frequency scenarios.
2) Dissipation Factor: 0.0027 at 10GHz, minimizing signal loss and improving energy efficiency.
3) Coefficient of Thermal Expansion (CTE): Matched to copper, with x/y/z values of 13 ppm/°C, 13 ppm/°C, 34 ppm/°C respectively, enhancing thermal compatibility.
4) Decomposition Temperature (Td): 500°C (TGA), offering excellent high-temperature resistance.
5) Thermal Conductivity: 0.81W/mk, facilitating effective heat dissipation.
6) Flammability Rating: V0 (UL 94 standard), meeting strict safety requirements.
Outstanding Benefits
1) Woven Glass Reinforcement: Improves rigidity, making the PCB easier to handle during production and assembly.
2) Uniform Electrical & Mechanical Performance: Ideal for constructing complex multi-layer high-frequency structures, ensuring consistent performance across the board.
3) Low In-Plane Expansion Coefficient: Compatible with epoxy multi-layer board hybrid designs and enables reliable surface-mounted assemblies, reducing assembly failures.
4) Excellent Dimensional Stability: Contributes to high production yields by reducing deformation during processing and use.
5) Superior Surface Smoothness: Allows for finer line etching tolerances, supporting high-precision circuit design.
Typical Applications
This RO3210 2-layer PCB is widely applicable in scenarios requiring high-frequency performance and stability, including:
- Automotive collision avoidance systems
- Automotive global positions satellite antennas
- Wireless telecommunications systems
- Microstrip patch antennas for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes
- LMDS and wireless broadband
- Base station infrastructure
Additional Critical Information
In summary, the RO3210 20 mil substrate PCB combines Rogers' premium RO3210 material with precise manufacturing, offering excellent electrical performance, mechanical stability and wide applicability. It is a trusted choice for customers in automotive, telecommunications, satellite and other high-tech fields pursuing high-quality and high-reliability circuit solutions.
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Wangling F4BTMS255 PCB 2-layer 60mil 1.524mm Thick F4BTMS Series Substrates Immersion GoldNext:
Rogers RO3035 2-Layer 10mil 0.254mm Immersion Gold High-Frequency PCBIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
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