
Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
It is an affordable alternative to more
conventional PTFE antenna technologies, thus allowing our designers to optimize
the price and performance of the antennas.
Item NO.:
BIC-189-v111.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaColor:
WhiteShipping Port:
ShenzhenLead Time:
7-10 days
Rogers RO4535 High Frequency Printed Circuit Board RO4535 60mil 30mil 20mil Antenna PCB with Immersion Gold, Silver and Tin
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description:
RO4535 High Frequency Laminates, ceramic-filled, glass-reinforced hydrocarbon based material, are cost/performance materials from Rogers Corporation, specifically engineered and manufactured to meet the specific demands of the antenna markets. It has a dielectric constant of 3.44 and a loss tangent (Df) of 0.0037 measured at 10 GHz. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Thus, it provides excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.
The resin systems of RO4535 dielectric materials are designed to provide the necessary properties for ideal antenna performance. The coefficients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper. The good CTE match reduces stresses in the printed circuit board antenna.
Features and Benefits:
1. Low Loss 0.0037 , Low Dk 3.44, low PIM response: Wide range of application use
2. Thermoset resin system: Compatible with standard PCB fabrication
3. Excellent dimensional stability: Greater yield on larger panels sizes
4. Uniform mechanical properties: Maintains mechanical form during handling
5. High thermal conductivity: Improved power handling
Typical Applications:
1. Cellular infrastructure base station antennas
2. WiMAX antenna networks
Our PCB Capability (RO4535):
PCB Capability (RO4535) | |
PCB Material: | Ceramic-filled, Glass-reinforced Hydrocarbon |
Designation: | RO4535 |
Dielectric constant: | 3.44 |
Dissipation Factor | 0.0037 10GHz |
Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: | 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm ) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
RO4535 Typical Values:
Property | RO4535 | Direction | Units | Condition | Test Method |
Dielectric Constant, er Process | 3.44 ± 0.08 | Z | - | 10 GHz/23℃2.5 GHz | IPC-TM-650,2.5.5.5 |
Dissipation Factor | 0.0032 | Z | - | 2.5 GHz/23℃ | IPC-TM-650, 2.5.5.5 |
0.0037 | 10 GHz/23℃ | ||||
PIM (Typical) | -157 | - | dBc | Reflected 43 dBm swept tones | Summitek 1900b PIM Analyzer |
Dielectric Strength | >500 | Z | V/mil | 0.51 mm | IPC-TM-650, 2.5.6.2 |
Dimensional Stability | <0.5 | X,Y | mm/m (mils/inch) | after etch | IPC-TM-650, 2.4.39A |
Coefficient of Thermal Expansion | 16 | X | ppm/℃ | -55 to 288℃ | IPC-TM-650, 2.4.41 |
17 | Y | ||||
50 | Z | ||||
Thermal Conductivity | 0.6 | - | W/(m.K) | 80℃ | ASTM C518 |
Moisture Absorption | 0.09 | - | % | D48/50 | IPC-TM-650, 2.6.2.1 ASTM D570 |
Tg | >280 | - | ℃TMA | A | IPC-TM-650, 2.4.24.3 |
Density | 1.9 | - | gm/cm3 | - | ASTM D792 |
Copper Peel Strength | 5.1 (0.9) | - | lbs/in (N/mm) | 1 oz. EDC post solder float | IPC-TM-650, 2.4.8 |
Flammability | V-0 | - | - | - | UL 94 |
Lead-Free Process Compatible | Yes | - | - | - | - |
BICHNEG PCB WORKSHOP:
BICHNEG PCB CERTIFICATION:
BICHENG PCB MAIN COURIERS:
Previous:
Rogers RO4534 High Frequency 20mil 30mil 60mil Antenna PCB With ENIG and Immersion TinNext:
30mil AD1000 High Frequency PCB Double Sided RF DK 10.2 PWB with Immersion GoldIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
Categories
New Products
Copper Coin Embedded PCB 6-Layer M6 and ISO370HR Material Hybrid Board
Isola 370HR PCB 12-layer 1.6mm Thick ENIG High-Tg FR-4 Multilayer Board
2-Layer 0.22mm Flexible Polyimide FPC PCB with 1.0mm FR-4 Stiffener ENIG
Wangling F4BM220 PCB 2-layer 6.0mm Thick ENIG F4BM Series High Frequency Laminates
RO3006 PCB 2-layer 10mil 0.254mm Rogers 3006 ENIG High Frequency Circuit Board
RO3210 PCB 4-layer 1.22mm Thick Rogers 3210 Laminate ENIG Multilayer Board
RO3010 PCB 4-layer 2.6mm Thick Rogers 3010 Immersion Tin Blind Vias
RO4003C PCB 3-layer 1.8mm Thick Rogers 4003C ENIG Blind Via Multilayer Board
© Copyright: 2025 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.
IPv6 network supported