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The TLX-9 base material is a high-performance PTFE/woven glass composite laminate, renowned for its precisely controlled electrical and mechanical properties.
Item NO.:
BIC-427-v510.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
TLX-9 2-layer 50mil 1.27mm Taconic PCB Substrate ImmersionTin Custom Printed Board
The TLX-9 2-Layer 50 mil Immersion Tin PCB is a cutting-edge printed circuit board engineered for superior electrical and mechanical performance, ideal for high-frequency and precision electronic systems. Built with TLX-9 PTFE/woven glass laminate as the base material, this 2-layer rigid PCB features immersion tin surface finish, tightly controlled dimensions, and exceptional stability—making it a reliable choice for demanding applications in communications, aerospace, and industrial electronics. Below is a detailed breakdown of its specifications, properties, and advantages.
1. PCB Construction Details
The following table outlines the comprehensive construction parameters of the TLX-9 2-layer PCB, covering material selection, structural dimensions, manufacturing standards, and quality control measures.
|
Feature |
Specification |
|
Base Material |
Taconic TLX-9 |
|
Layer Count |
2 layers |
|
Board Dimensions |
57mm x 136mm (per PC) ±0.15mm |
|
Min. Trace/Space |
6 / 6 mils |
|
Min. Hole Size |
0.3 mm |
|
Blind/Buried Vias |
No |
|
Finished Thickness |
1.35 mm |
|
Finished Cu Weight |
1 oz (35 μm) on outer layers |
|
Via Plating Thickness |
20 μm |
|
Surface Finish |
Immersion Tin |
|
Top Silkscreen |
White |
|
Bottom Silkscreen |
No |
|
Top Solder Mask |
No |
|
Bottom Solder Mask |
No |
|
Identification |
Printed series number |
|
Electrical Test |
100% tested |
2. PCB Stackup
This table presents the layered structure composition of the TLX-9 2-layer rigid PCB, detailing the thickness and material of each layer to reflect its structural design.
|
Layer |
Material |
Thickness |
|
Layer 1 |
Copper |
35 μm (1 oz) |
|
Core |
Taconic TLX-9 |
1.27 mm (50 mil) |
|
Layer 2 |
Copper |
35 μm (1 oz) |
3. PCB Statistics
The table below summarizes key statistical data of the Taconic TLX-9 PCB, including component quantity, pad distribution, via count, and net count, providing insights into its circuit layout characteristics.
|
Item |
Quantity |
|
Components |
32 |
|
Total Pads |
64 |
|
Thru-Hole Pads |
36 |
|
Top SMT Pads |
28 |
|
Bottom SMT Pads |
0 |
|
Vias |
97 |
|
Nets |
2 |
4. TLX-9 Base Material Introduction
The TLX-9 base material is a high-performance PTFE/woven glass composite laminate, renowned for its precisely controlled electrical and mechanical properties. It is compatible with standard processing methods for PTFE/woven fiberglass materials, supporting shearing, drilling, milling, and plating operations. During manufacturing, the laminate maintains excellent dimensional stability and exhibits almost no moisture absorption, ensuring consistent performance throughout the production process.
Electronically, TLX-9 PCB boasts a low dielectric constant (DK) of 2.5, tightly controlled across a broad frequency and temperature range, and a low dissipation factor of approximately 0.0019 at 10 GHz—critical for minimizing signal loss in high-frequency applications. Additionally, it meets strict flammability standards, holding a UL 94 V-0 certification for reliable flame retardancy.
5. Typical Properties
The TLX-950 mil substrate PCB demonstrates outstanding performance across electrical, mechanical, and thermal metrics:
6. Core Benefits
Leveraging the advantages of TLX-9 1.27 mm material, the PCB offers multiple key benefits:
7. Typical Applications
The TLX-9 Taconic high frequency PCB is widely applicable in high-performance electronic systems, including:
8. Quality & Availability
The PCB adheres to the IPC-Class-2 quality standard, ensuring consistent manufacturing quality and performance. The artwork supplied is Gerber RS-274-X, compatible with mainstream PCB manufacturing processes. With worldwide availability, it can meet the supply demands of global customers in various industries.
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