TLX-8 RF Microwave 1.6mm Taconic SubstratePCB
The TLX-8 PCB is remarkable product is renowned for its reliability in a wide array of RF applications, including radar systems, mobile communications, microwave test equipment, and microwave transmission devices.
Key Characteristics of TLX-8 PCBs
Let us now examine the technical specifications that set the TLX-8 apart and make it truly exceptional.
One of the prominent features of the TLX-8 Taconic PCB is its dielectric constant (DK) at 10 GHz, which measures at 2.55. This parameter signifies the material's capacity to store electrical energy in an electromagnetic field. With a DK of 2.55, the TLX-8 demonstrates exceptional performance in terms of signal transmission and impedance control.
Moving forward, let's consider the dissipation factor (Df) at different frequencies. At 1.9 GHz, the TLX-8 exhibits a Df of 0.0012, while at 10 GHz, it registers at 0.0017. These low Df values indicate minimal loss of signal energy during transmission, ensuring both high signal integrity and low signal distortion.
Safety is also a priority, and the TLX-8 high frequency material achieves high resistance to combustion with its UL-94 V-0 flammability rating.
More TLX-8 PCB characteristic as follows:
|
Property
|
Test Method
|
Unit
|
TLX-8 Value
|
Unit
|
Value
|
|
DK @10 GHz
|
IPC-650 2.5.5.3
|
|
2.55
|
|
2.55
|
|
Df @1.9 GHz
|
IPC-650 2.5.5.5.1
|
|
0.0012
|
|
0.0012
|
|
Df @10 GHz
|
IPC-650 2.5.5.5.1
|
|
0.0017
|
|
0.0017
|
|
Dielectric Breakdown
|
IPC-650 2.5.6
|
kV
|
>45
|
kV
|
>45
|
|
Moisture Absorption
|
IPC-650 2.6.2.1
|
%
|
0.02
|
%
|
0.02
|
|
Flexural Strength(MD)
|
ASTM D 709
|
psi
|
28,900
|
N/mm2
|
|
|
Flexural Strength(CD)
|
ASTM D 709
|
psi
|
20,600
|
N/mm2
|
|
|
Tensile Strength(MD)
|
ASTM D 902
|
psi
|
35,600
|
N/mm2
|
|
|
Tensile Strength(CD)
|
ASTM D 902
|
psi
|
27,500
|
N/mm2
|
|
|
Elongation at Break(MD)
|
ASTM D 902
|
%
|
3.94
|
%
|
3.94
|
|
Elongation at Break(CD)
|
ASTM D 902
|
%
|
3.92
|
%
|
3.92
|
|
Young's Modulus(MD)
|
ASTM D 902
|
kpsi
|
980
|
N/mm2
|
|
|
Young's Modulus(CD)
|
ASTM D 902
|
kpsi
|
1,200
|
N/mm2
|
|
|
Young's Modulus(MD)
|
ASTM D 3039
|
kpsi
|
1,630
|
N/mm2
|
|
|
Poisson's Ratio
|
ASTM D 3039
|
|
0.135
|
N/mm
|
|
|
Peel Stength(1 oz.ed)
|
IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)
|
Ibs./linear inch
|
15
|
N/mm
|
|
|
Peel Stength(1 oz.RTF)
|
IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)
|
Ibs./linear inch
|
17
|
N/mm
|
|
|
Peel Stength(½ oz.ed)
|
IPC-650 2.4.8.3(Elevated Temp.)
|
Ibs./linear inch
|
14
|
N/mm
|
|
|
Peel Stength(½ oz.ed)
|
IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)
|
Ibs./linear inch
|
11
|
N/mm
|
|
|
Peel Stength(1 oz.rolled)
|
IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)
|
Ibs./linear inch
|
13
|
N/mm
|
2.1
|
|
Dimensional Stability(MD)
|
IPC-650 2.4.39 Sec.5.5(After Bake.)
|
mils/in.
|
0.06
|
mm/M
|
|
|
Dimensional Stability(CD)
|
IPC-650 2.4.39 Sec.5.4(After Bake.)
|
mils/in.
|
0.08
|
mm/M
|
|
|
Dimensional Stability(MD)
|
IPC-650 2.4.39 Sec.5.5(Thermal Stress.)
|
mils/in.
|
0.09
|
mm/M
|
|
|
Dimensional Stability(CD)
|
IPC-650 2.4.39 Sec.5.5(Thermal Stress.)
|
mils/in.
|
0.1
|
mm/M
|
|
|
Surface Resistivity
|
IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.)
|
Mohm
|
6.605 x 108
|
Mohm
|
6.605 x 108
|
|
Surface Resistivity
|
IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.)
|
Mohm
|
3.550 x 106
|
Mohm
|
3.550 x 106
|
|
Volume Resistivity
|
IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.)
|
Mohm/cm
|
1.110 x 1010
|
Mohm/cm
|
1.110 x 1010
|
|
Volume Resistivity
|
IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.)
|
Mohm/cm
|
1.046 x 1010
|
Mohm/cm
|
1.046 x 1010
|
|
Thermal Conductivity
|
ASTM F433/ASTM 1530-06
|
W/M*K
|
0.19
|
W/M*K
|
0.19
|
|
CTE(X axis)(25-260℃)
|
IPC-650 2.4.41/ASTM D 3386
|
ppm/℃
|
21
|
ppm/℃
|
21
|
|
CTE(Y axis)(25-260℃)
|
IPC-650 2.4.41/ASTM D 3386
|
ppm/℃
|
23
|
ppm/℃
|
23
|
|
CTE(Z axis)(25-260℃)
|
IPC-650 2.4.41/ASTM D 3386
|
ppm/℃
|
215
|
ppm/℃
|
215
|
|
Density(Specific Gravity)
|
ASTM D 792
|
g/cm3
|
2.25
|
g/cm3
|
2.25
|
|
Td(2% Weight Loss)
|
IPC-650 2.4.24.6(TGA)
|
℃
|
535
|
℃
|
|
|
Td(5% Weight Loss)
|
IPC-650 2.4.24.6(TGA)
|
℃
|
553
|
℃
|
|
|
Flammability Rating
|
UL-94
|
|
V-0
|
|
V-0
|
The TLX Family
Within the TLX family, which comprises TLX-0, TLX-9, TLX-8, TLX-7, and TLX-6,TLX materials are PTFE-based fiberglass laminates. They offer versatility due to their DK range of 2.45 to 2.65, various available thicknesses, and copper cladding options. These materials are particularly suitable for low layer count microwave designs.
TLX stands out as it is available as an ultra-thin laminate suitable for coupler type applications. Out of the TLX series, TLX-9 boasts the thinnest thickness at 2 mils, while TLX-0 possesses the lowest DK of 2.45.
As RF microwave substrates, TLX is highly regarded due to the mechanical reinforcement provided by fiberglass, enabling resilience in harsh environments.
TLX-8 PCB Capability
|
PCB material:
|
PTFE Fiberglass Laminates
|
|
Designation:
|
TLX-8
|
|
Dielectric constant:
|
2.55
|
|
Layer count:
|
Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB
|
|
Dielectric thickness:
|
2.5mil (0.0635mm), 10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm)
|
|
Copper weight:
|
1oz (35µm), 2oz (70µm)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue, Red, Yellow etc.
|
|
Surface finish:
|
Immersion gold, HASL, Immersion silver, Immersion tin,Bare copper, OSP, ENEPIG, Pure gold etc..
|
An Exemplary TLX-8 PCB
Presenting a specific example, we have a 1.6mm TLX-8 PCB with immersion gold, specifically designed for filter applications.TLX-8 1.6mm Taconic substrate PCBs are also commonly found in radar systems, mobile communications, antennas, mixers, combiners, splitters, and more.
TLX-8's Outgassing Properties
TheTLX-8materialPCB exhibits tightly controlled DK, with a mere ± 2% variation across temperatures ranging from -55 to 125 °C. This remarkable material boasts a long-standing space heritage, demonstrating its ability to withstand severe environments, including radiation resistance in space.
Based on the outgassing test report, we observe that theTaconicTLX-8 PCBdisplays impressive results. It showcases a total mass loss (TML) of only 0.03%, a collected volatile condensable materials (CVCM) value of zero, and a water vapor regained (WVR) value of 0.01%. These values are significantly lower than the standard requirements, underscoring the exceptional performance of the TLX-8.
|
Property
|
Test Method
|
Units
|
Value
|
|
Outgassing (%TML)
|
ASTM E 595
|
24 H 257 °F @ ≤ 5 x 10-5 Torr
|
0.03
|
|
Outgassing (%CVCM)
|
ASTM E 595
|
24 H 257 °F @ ≤ 5 x 10-5 Torr
|
0.00
|
|
Outgassing (%WVR)
|
ASTM E 595
|
24 H 257 °F @ ≤ 5 x 10-5 Torr
|
0.01
|
In Conclusion
To summarize, the TLX-8 high frequency PCB is an exceptional material renowned for its outstanding electrical, mechanical, and thermal properties. Its stable performance across various applications makes it an ideal choice for high-frequency PCB designs, where both signal integrity and reliability are paramount.
That concludes our discussion on the Taconic TLX-8 PCB. Thank you for joining us today, and if you have any further inquiries, please feel free to consult our experts.
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