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Home Newly Shipped RF PCB TLY-3 2-layer 20mil 0.508mm Silver Gold Plate Taconic RF PCB Circuit Board

TLY-3 2-layer 20mil 0.508mm Silver Gold Plate Taconic RF PCB Circuit Board

The TLY-3 Taconic High Frequency PCB is engineered to bridge the gap between high-frequency performance and manufacturing efficiency.

  • Item NO.:

    BIC-428-v511.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


TLY-3 2-layer 20mil 0.508mm Silver Gold Plate Taconic RF PCB Circuit Board

 

The TLY-3 2-Layer 20 mil Silver-Gold PCB is a cutting-edge printed circuit board tailored for high-frequency, high-reliability applications. Built on premium Taconic TLY-3 laminates, it combines exceptional dimensional stability, ultra-low dielectric loss, and robust manufacturing compatibility, making it an ideal choice for automotive radar, satellite communications, and aerospace systems. Below is a detailed breakdown of its specifications, structure, and core advantages.

 

1. PCB Construction Details

This table outlines the core structural and manufacturing parameters of the TLY-3 2-Layer PCB, covering material selection, dimensional tolerances, and quality control measures.


Feature

Specification

Base Material

TLY-3

Layer Count

2-layer

Board Dimensions

125mm x 47mm = 1PCS, +/- 0.15mm

Minimum Trace/Space

4/6 mils

Minimum Hole Size

0.3mm

Blind/Buried Vias

No

Finished Board Thickness

0.6mm

Finished Cu Weight

1oz (1.4 mils)

Via Plating Thickness

20 μm

Surface Finish

Silver plate / gold plate (Gold over silver)

Top/Bottom Silkscreen

No

Top/Bottom Solder Mask

No

Electrical Test

100% tested prior to shipment



2. PCB Stackup

The stackup structure of this 2-layer rigid PCB ensures uniform signal transmission and mechanical stability, optimized for high-frequency performance.


Layer

Material

Thickness

Copper Layer 1

Electro-Deposited Copper

35μm (1oz)

Core

TLY-3 Dielectric

20mil (0.508mm)

Copper Layer 2

Electro-Deposited Copper

35μm (1oz)

 


3. PCB Statistics

This table summarizes the component and connectivity metrics, reflecting the board's layout efficiency and functional density.


Item

Quantity

Components

25

Total Pads

86

Thru Hole Pads

64

Top SMT Pads

22

Bottom SMT Pads

0

Vias

31

Nets

2

 


4. Core Material: TLY-3 Laminate Advantage


The 20 mil TLY-3 substrates at the heart of this Taconic RF PCB are manufactured with lightweight woven fiberglass, delivering far superior dimensional stability compared to chopped fiber-reinforced PTFE composites. The woven matrix ensures mechanical stability, enabling high-volume manufacturing with exceptional yields. A standout feature is its ultra-low dissipation factor, which supports seamless operation in 77GHz automotive radar systems and other millimeter-wave antennas.

 

Comparative OEM testing at 77GHz confirms that TLY-3 matches the insertion loss and dielectric properties of competing chopped fiber materials—while offering significantly higher manufacturing yields. Its dielectric constant (Dk) ranges from 2.17 to 2.40, with a tight tolerance of±0.02 for most thicknesses. At 10GHz, the dissipation factor (Df) is as low as 0.0009, making it a top choice for high-frequency precision applications.

 

TLY-3 PCB 2-layer 20mil Silver Gold


5. Key Technical Features


  • Dielectric Constant: 2.33±0.02 at 10GHz (uniform and consistent)
  • Dissipation Factor: 0.0012 at 10GHz (ultra-low loss)
  • Thermal Conductivity: 0.22 W/mk (Unclad)
  • CTE (Coefficient of Thermal Expansion): x=26 ppm/°C, y=15 ppm/°C, z=217 ppm/°C
  • Peel Strength: 0.5oz (11 lbs/in), 1oz (17 lbs/in)
  • Moisture Absorption: 0.02% (ultra-low, ensuring reliability in harsh environments)
  • Flammability Rating: V-0 (high safety standard)
  • Outgassing: TML 0.01%, CVCM 0.01%, WVR 0.01% (suitable for aerospace applications)


 

6. Customer-Centric Benefits


  • Dimensional Stability: Woven fiberglass structure minimizes warpage, ensuring compatibility with high-volume assembly.
  • Lowest Df: Reduces signal attenuation, critical for high-frequency (77GHz+) applications like automotive radar.
  • High Peel Strength: Enhances copper-to-substrate adhesion, improving long-term reliability.
  • Low Moisture Absorption: Prevents performance degradation in humid or harsh environments.
  • Uniform Dk: Ensures consistent signal propagation, optimizing circuit performance.
  • Laser Ablatable: Facilitates precise manufacturing of fine features.


 

 

7. Target Applications

This Taconic TLY-3 PCB is the ideal solution for a wide range of cutting-edge technologies:


  • Automotive Radar: Ideal for 77GHz systems, leveraging low Df and dimensional stability.
  • Satellite/Cellular Communications: Reliable performance in high-frequency bands.
  • Power Amplifiers: Supports efficient signal transmission with minimal loss.
  • LNBs, LNAs, LNCs: Optimized for low-noise, high-precision signal processing.
  • Aerospace: Meets strict outgassing and environmental resistance requirements.
  • Ka, E and W Band Applications: Excels in high-frequency communication systems.


 

 8. Quality & Availability


  • Quality Standard: Complies with IPC-Class-2, ensuring consistent performance and reliability.
  • Artwork Type: Gerber RS-274-X (industry-standard format for seamless manufacturing).
  • Availability: Worldwide supply, supporting global production needs.



The TLY-3 Taconic High Frequency PCB is engineered to bridge the gap between high-frequency performance and manufacturing efficiency. Its advanced material properties and precise specifications make it a trusted solution for industries demanding uncompromised reliability and signal integrity.






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