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The TLY-3 Taconic High Frequency PCB is engineered to bridge the gap between high-frequency performance and manufacturing efficiency.
Item NO.:
BIC-428-v511.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
TLY-3 2-layer 20mil 0.508mm Silver Gold Plate Taconic RF PCB Circuit Board
The TLY-3 2-Layer 20 mil Silver-Gold PCB is a cutting-edge printed circuit board tailored for high-frequency, high-reliability applications. Built on premium Taconic TLY-3 laminates, it combines exceptional dimensional stability, ultra-low dielectric loss, and robust manufacturing compatibility, making it an ideal choice for automotive radar, satellite communications, and aerospace systems. Below is a detailed breakdown of its specifications, structure, and core advantages.
1. PCB Construction Details
This table outlines the core structural and manufacturing parameters of the TLY-3 2-Layer PCB, covering material selection, dimensional tolerances, and quality control measures.
|
Feature |
Specification |
|
Base Material |
TLY-3 |
|
Layer Count |
2-layer |
|
Board Dimensions |
125mm x 47mm = 1PCS, +/- 0.15mm |
|
Minimum Trace/Space |
4/6 mils |
|
Minimum Hole Size |
0.3mm |
|
Blind/Buried Vias |
No |
|
Finished Board Thickness |
0.6mm |
|
Finished Cu Weight |
1oz (1.4 mils) |
|
Via Plating Thickness |
20 μm |
|
Surface Finish |
Silver plate / gold plate (Gold over silver) |
|
Top/Bottom Silkscreen |
No |
|
Top/Bottom Solder Mask |
No |
|
Electrical Test |
100% tested prior to shipment |
2. PCB Stackup
The stackup structure of this 2-layer rigid PCB ensures uniform signal transmission and mechanical stability, optimized for high-frequency performance.
|
Layer |
Material |
Thickness |
|
Copper Layer 1 |
Electro-Deposited Copper |
35μm (1oz) |
|
Core |
TLY-3 Dielectric |
20mil (0.508mm) |
|
Copper Layer 2 |
Electro-Deposited Copper |
35μm (1oz) |
3. PCB Statistics
This table summarizes the component and connectivity metrics, reflecting the board's layout efficiency and functional density.
|
Item |
Quantity |
|
Components |
25 |
|
Total Pads |
86 |
|
Thru Hole Pads |
64 |
|
Top SMT Pads |
22 |
|
Bottom SMT Pads |
0 |
|
Vias |
31 |
|
Nets |
2 |
4. Core Material: TLY-3 Laminate Advantage
The 20 mil TLY-3 substrates at the heart of this Taconic RF PCB are manufactured with lightweight woven fiberglass, delivering far superior dimensional stability compared to chopped fiber-reinforced PTFE composites. The woven matrix ensures mechanical stability, enabling high-volume manufacturing with exceptional yields. A standout feature is its ultra-low dissipation factor, which supports seamless operation in 77GHz automotive radar systems and other millimeter-wave antennas.
Comparative OEM testing at 77GHz confirms that TLY-3 matches the insertion loss and dielectric properties of competing chopped fiber materials—while offering significantly higher manufacturing yields. Its dielectric constant (Dk) ranges from 2.17 to 2.40, with a tight tolerance of±0.02 for most thicknesses. At 10GHz, the dissipation factor (Df) is as low as 0.0009, making it a top choice for high-frequency precision applications.
5. Key Technical Features
6. Customer-Centric Benefits
7. Target Applications
This Taconic TLY-3 PCB is the ideal solution for a wide range of cutting-edge technologies:
8. Quality & Availability
The TLY-3 Taconic High Frequency PCB is engineered to bridge the gap between high-frequency performance and manufacturing efficiency. Its advanced material properties and precise specifications make it a trusted solution for industries demanding uncompromised reliability and signal integrity.
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