TP600 PCB 19.6mil 2-layer Bare ENEPIG Finish Countersunk Holes DK6.0 High-Frequency Laminate

TP600 PCB 19.6mil 2-layer Bare ENEPIG Finish Countersunk Holes DK6.0 High-Frequency Laminate

TP600 PCB 19.6mil 2-layer ENEPIG—an engineered solution tailored for high-reliability, high-frequency scenarios where performance and precision are non-negotiable. Crafted with industry-unique TP600 thermoplastic material, this double-sided TP PCB stands out in satellite navigation, missile-borne systems, and miniaturized antennas, delivering stable dielectric properties and robust mechanical performance that outperforms conventional laminates.

PCB Construction Details Overview

The following table outlines the core construction parameters of the TP600 PCB, ensuring clarity on dimensional accuracy, material specifications, and manufacturing processes that guarantee consistent quality.

PCB Stackup Overview

The 2-layer rigid stackup is optimized for TP600 PCB material’s dielectric performance, ensuring uniform signal transmission and structural stability.

PCB Statistics Overview

The following statistics reflect the DK6.0 TP PCB’s compact design and component compatibility, tailored for miniaturized high-performance applications.

Introduction of TP series

TP PCB series material is a unique high-frequency thermoplastic material in the industry. The dielectric layer of TP-type PCB laminates consists of ceramics and polyphenylene Oxide resin (PPO), without fiberglass reinforcement. The dielectric constant can be precisely adjusted by adjusting the ratio between ceramics and PPO resin. The production process is special, and it has excellent dielectric performance and high reliability. TP refers to the smooth surface material without copper cladding, TP-1 refers to the material with copper cladding on one side, and TP-2 refers to the material with copper cladding on both sides.

The dielectric constant can be arbitrarily selected within the range of 3 to 25 according to circuit requirements, and it is stable. Common dielectric constants include 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 9.8, 10.2, 11, 16, and 20. The dielectric loss is low, and the loss increases as the frequency increases, but the change is not significant within 10 GHz. The corresponding part numbers are TP300, TP440, TP600, TP615, TP920, TP960, TP980 etc.

Core Material & Performance Advantages

The TP600 PCB substrate is a premium high-frequency thermoplastic laminate composed of ceramics and polyphenylene oxide (PPO) resin, without fiberglass reinforcement. This unique composition enables precise dielectric constant (Dk) adjustment—TP600 offers a stable Dk of 6±0.12 at 10GHz, paired with an ultra-low dissipation factor of 0.0010 at the same frequency, ensuring minimal signal loss in high-speed circuits.

Its exceptional thermal and mechanical stability includes a low temperature coefficient of Dk (-50 ppm/°C) across -55°C to 150°C, uniform coefficient of thermal expansion (CTE: 50 ppm/°C x/y-axis, 60 ppm/°C z-axis), and UL 94-V0 flame rating. With moisture absorption as low as 0.01% and thermal conductivity of 0.55 W/mk, it excels in harsh environments.

Quality, Compatibility & Availability

We adhere to IPC-Class-2 quality standards, with Gerber RS-274-X artwork support for seamless integration into your production workflow. TheENEPIG surface finish ensures excellent solderability, corrosion resistance, and compatibility with fine-pitch components. This PCB is available worldwide, making it a reliable choice for global projects.

Typical Applications:

This TP600 ENEPIG PCB is ideally suited for mission-critical, high-frequency subsystems, including:

• Global Satellite Navigation System (GNSS) receivers and antennas.
• Missile-borne guidance and telemetry electronics.
• Fuze technology and radar proximity sensors.
• Miniaturized Antennas, filters, and low-noise amplifiers (LNAs).

Why Choose This PCB?

This is not a commodity board. It is a high-performance solution engineered for applications where electrical performance, material stability, and long-term reliability are paramount. The combination of the electrically superior TP600PCBsubstrate, precise fabrication tolerances, and the robust ENEPIG finish creates a product capable of empowering next-generation RF and microwave designs. Choose this TP600 high frequency PCB to build the foundation of your system with confidence, ensuring signal clarity, design integrity, and resilience in the most challenging environments on Earth and beyond.

With worldwide availability, this TP600 PCB delivers consistent performance, reliability, and value for high-frequency, miniaturized electronic systems. Partner with us to leverage this advanced solution for your next-generation products.