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Whether you're developing satellite communication equipment or high-frequency radar systems,the F4BM217 high frequency PCB delivers the performance, reliability, and cost-efficiency you need.
Item NO.:
BIC-473-v559.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Wangling 2-layer F4BM217 3.9mil F4B DK2.17 High Frequency Laminate ENIG PCB
Designed for demanding high-frequency and RF applications, our 2-Layer F4BM217 PCB with 3.9mil ENIG surface finish stands out with exceptional electrical performance, precise manufacturing, and reliable quality. Leveraging Wangling F4BM217 laminates, this double-sided F4B DK2.17 PCB delivers low dielectric loss, stable insulation performance, and excellent dimensional stability, making it a cost-effective alternative to premium foreign counterparts. Compliant with IPC-Class-2 standards and available worldwide, it is engineered to meet the rigorous requirements of microwave, radar, and satellite communication systems.
PCB Construction Details
Below is a comprehensive overview of the F4BM217 PCB's construction parameters, manufacturing tolerances, and quality assurance measures, ensuring transparency and reliability for our customers.
|
Parameter |
Specification |
|
Base Material |
F4BM217 High-Frequency Laminate |
|
Layer Count |
2 (Double-Sided) |
|
Board Dimensions |
120mm x 89mm (±0.15mm) |
|
Finished Board Thickness |
0.17mm (Nominal) |
|
Minimum Trace Width / Spacing |
6 mils / 7 mils |
|
Minimum Mechanical Hole Size |
0.3mm |
|
Via Structure |
Through-Hole Vias Only (No Blind/Buried) |
|
Finished Copper Weight (Outer Layers) |
1 oz (35 μm / 1.4 mils) |
|
Via Plating Thickness |
20 μm (Minimum) |
|
Surface Finish |
Immersion Gold (ENIG) |
|
Top / Bottom Solder Mask |
No |
|
Top / Bottom Silkscreen |
No |
|
Electrical Test |
100% Testing (Pre-Shipment) |
PCB Stackup
The F4BM217 ENIG PCB adopts a simplified yet robust 2-layer rigid structure, with precisely controlled layer thicknesses to optimize electrical performance and mechanical reliability.
|
Layer |
Material |
Thickness |
|
Top Layer |
Copper (Electrodeposited) |
35 μm (1 oz) |
|
Dielectric Core |
F4BM217 Laminate |
0.10 mm |
|
Bottom Layer |
Copper (Electrodeposited) |
35 μm (1 oz) |
|
Total Finished Thickness |
|
~0.17 mm |
PCB Statistics
The following statistics reflect the PCB's streamlined design, tailored for focused functionality in high-frequency passive and active component integration.
|
Item |
Quantity |
|
Total Components |
5 |
|
Total Pads |
21 |
|
Through-Hole Pads |
15 |
|
Surface-Mount (SMT) Pads - Top Side |
6 |
|
Surface-Mount (SMT) Pads - Bottom Side |
0 |
|
Total Vias |
25 |
|
Total Nets |
2 |
Advanced F4BM217 Substrate: The Core of Superior Performance
The PCB is built on Wangling's F4BM217 substrates, a scientifically formulated composite of fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film, manufactured through strict pressing processes. Compared to F4B220, F4BM217 offers enhanced electrical performance with lower dielectric loss, higher insulation resistance, and improved stability. A key advantage lies in its flexible copper foil pairing: F4BM217 uses ED copper foil, ideal for applications without PIM requirements, while its variant F4BME217 (same dielectric layer) adopts reverse-treated foil (RTF) for excellent PIM performance and precise line control.
F4BM217 dielectric constant (Dk) is precisely controlled at 2.17±0.04 (10GHz) by adjusting the PTFE-fiberglass ratio, ensuring low signal loss. It features a dissipation factor of 0.001 (10GHz), minimal moisture absorption (≤0.08%), and UL-94 V0 flammability rating. With a wide operating temperature range of -55°C to 288°C and stable CTE values (25 ppm/°C x-axis, 34 ppm/°C y-axis), it maintains performance integrity in harsh environments.
Key Specifications & Global Availability
We provide Gerber RS-274-X artwork for seamless manufacturing integration. Adhering to IPC-Class-2 quality standards, every PCB undergoes rigorous inspection to ensure consistency. With worldwide availability, we offer timely delivery and localized support to customers across industries.
Typical Applications
This high-performance DK2.17 PCB is ideally suited for: Microwave, RF, and radar systems; Phase shifters; Passive components; Power dividers, couplers, and combiners; Feed networks; Phased array antennas; Satellite communications; Base station antennas.
Whether you're developing satellite communication equipment or high-frequency radar systems,the F4BM217 high frequency PCB delivers the performance, reliability, and cost-efficiency you need. Partner with us for a tailored solution that meets your most demanding application requirements.
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