2-Layer Rogers RO3010 PCB DK10.2 50mil 1.27mm Core EPIG Surface Finish Black Silkscreen

2-Layer Rogers RO3010 PCB DK10.2 50mil 1.27mm Core EPIG Surface Finish Black Silkscreen

PCB Product Introduction

1.1 Product Positioning & Overview

This 2-Layer RO3010 50mil EPIG PCB is a high-performance rigid printed circuit board specially designed for high-frequency, microwave, and RF applications. It is built on Rogers RO3010 ceramic-filled PTFE high-frequency laminate, with a 50mil (1.27mm) dielectric core andnickel-free EPIG surface finish. The Rogers DK10.2 board is manufactured in full compliance with IPC-Class 2 standards, supports stable performance in wide frequency and temperature ranges, and is ideal for automotive radar, satellite antennas, cellular communication systems, wireless patch antennas, and other precision high-frequency modules.

Compared with standard FR-4 PCBs and ordinary microwave substrate boards, thisRogers 3010 PCB features stable dielectric constant, extremely low dissipation factor, excellent thermal expansion matching with copper, outstanding dimensional stability, and strong reliability under lead-free assembly processes. The design removes solder masks on both sides to preserve radio-frequency signal integrity, reduce insertion loss, and avoid parasitic effects caused by additional dielectric layers. The board adopts 1oz outer-layer copper, 20μm via plating thickness, and 100% electrical testing before shipment, ensuring batch consistency, production stability, and long-term performance in real-world operating environments.

1.2 PCB Construction

This table summarizes the complete structural, processing, surface treatment, and quality control specifications of the RO3010 PCB, reflecting high-precision manufacturing for high-frequency applications.

1.3 PCB Stackup

The stackup adopts a symmetrical copper-clad structure with a 50 mil RO3010 core, ensuring impedance consistency, low warpage, and stable high-frequency transmission performance.

1.4 PCB Statistics

This table shows the component, pad, via, and net distribution of the board, representing a compact, low-complexity, high-purity RF circuit design.

1.5 PCB Performance Advantages

1.5.1 High-Frequency Signal Integrity

TheRogersboard uses RO3010 high frequency laminate with a dielectric constant of 10.2±0.30 at 10GHz and a dissipation factor of only 0.0022, greatly reducing signal attenuation and ensuring clarity and stability in broadband communication systems.

1.5.2 EPIG Nickel-Free Surface Finish

EPIG (Electroless Palladium Immersion Gold) eliminates the magnetic nickel layer used in traditional ENIG, reducing high-frequency parasitic loss, improving solderability and bonding performance, and supporting long-term reliability in RF modules.

1.5.3 Excellent Thermal & Mechanical Stability

The CTE of RO3010 is highly matched with copper, preventing deformation, delamination, or via cracking during thermal cycling. The decomposition temperature exceeds 500°C, fully compatible with lead-free reflow processes.

1.6 Typical Applications

This RO3010 high frequency PCB is widely used in high-frequency communication and sensing systems, including:

-Automotive radar systems (24GHz, 77–79GHz)

-GPS and global satellite communication antennas

-Cellular telecommunication base station power amplifiers and antennas

-Wireless communication patch antennas

-Direct broadcast satellite equipment

-Cable system data links

-Remote meter reading equipment

-High-performance power backplanes

Conclusion

The 2-Layer RO3010 PCB (50mil, EPIG) is a premium high-frequency circuit board designed for engineers who demand stable electrical performance, thermal reliability, and compact form factors. Its nickel-free EPIG finish, no-solder-mask design, and RO3010 core make it an outstanding choice for automotive radar, satellite communications, and RF power systems.

RO3010 CCL (Copper Clad Laminate) Knowledge

2.1 Basic Definition of CCL

Copper Clad Laminate (CCL) is the core base material of printed circuit boards. It is composed of reinforcing dielectric material and electrolytic or rolled copper foil bonded together under high temperature and pressure. CCL directly determines the electrical performance, thermal stability, mechanical reliability, and service life of PCBs. For high-frequency/RF applications, professional high-frequency CCL (such asceramic-filled PTFE series) must be used to ensure low loss and stable dielectric properties.

2.2 Introduction to Rogers RO3010 CCL

Rogers RO3010 is a high-performance ceramic-filled PTFE composite CCL belonging to the Rogers RO3000 series. It is designed for commercial microwave and RF applications, providing excellent electrical and mechanical stability at competitive cost. Thehigh DK10.2materialis uniformly filled with ceramic particles to achieve a high dielectric constant while maintaining ultra-low loss, making it ideal for circuit miniaturization and broadband design.

2.3 Key Performance Parameters of RO3010 CCL

2.4 Standard Specifications of RO3010 CCL

2.5 Fabrication Guidelines

RO3010 can be processed using standard PTFE circuit board techniques with minor modifications:

• Drilling: Use sharp carbide drills with high spindle speeds and controlled chip load to avoid smearing.
• Plasma Etch: Recommended before copper plating to activate the PTFE surface.
• Solder Mask: Low-temperature cure mask or no mask (as in this design) to prevent Dk shift.
• Handling: Avoid excessive bending due to ceramic filler making the material slightly brittle compared to FR-4.

2.6 Core Advantages of RO3010 CCL

1)Stable Dielectric Properties: Stable Dk and low Df over wide frequency and temperature ranges, supporting broadband design.

2)CTE Matched with Copper: Reduces thermal stress, improves reliability of plated through-holes, and enhances dimensional stability.

3)Low Moisture Absorption: Only 0.05%, maintaining stable electrical performance in high-humidity environments.

4)High Thermal Reliability: Td＞500°C, compatible with lead-free assembly and harsh thermal environments.

5)Good Process Compatibility: Supports standard PTFE PCB manufacturing processes with minor adjustments.

6)Cost-Effective: Suitable for volume production while maintaining high performance.

2.7 CCL Selection Principles for High-Frequency PCBs

• Choose materials with low and stable dissipation factor to reduce signal loss.
• Select appropriate dielectric constant based on circuit size and impedance requirements.
• Ensure CTE matches copper to improve thermal cycle reliability.
• Prioritize materials with low moisture absorption for outdoor and high-humidity environments.
• Confirm process compatibility with PCB fabrication capabilities.
• Balance performance and cost for mass production applications.